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    • 31. 发明授权
    • Electron affinity engineered VCSELs
    • 电子亲和性工程VCSELs
    • US07065124B2
    • 2006-06-20
    • US10767920
    • 2004-01-29
    • James R. BiardRalph H. JohnsonKlein L. Johnson
    • James R. BiardRalph H. JohnsonKlein L. Johnson
    • H01S3/08H01S5/00
    • H01S5/18358H01S5/0421H01S5/18308H01S5/2009H01S5/205H01S5/3211H01S5/423H01S2301/166
    • A VCSEL having an N-type Bragg mirror with alternating layers of high bandgap (low index) and low bandgap (high index) layers of AlGaAs. The layers may be separated by a step change of Al composition followed by a graded region, and vice versa for the next layer, in the N-type mirror to result in a lower and more linear series resistance. Also, an N-type spacer layer may be adjacent to an active region of quantum wells. There may be a similar step in a change of Al composition from the nearest layer of the N-type mirror to the N-type spacer formed from a lower bandgap direct AlGaAs layer to provide lower free carrier absorption. With electron affinity engineering, a minority carrier hole barrier may be inserted adjacent to the quantum wells to improve hole confinement at high current density and high temperature.
    • 具有具有高带隙(低折射率)和低带隙(高折射率)AlGaAs层的交替层的N型布拉格反射镜的VCSEL。 这些层可以通过Al组分的阶跃变化和随后的渐变区域分离,反之亦然,在N型反射镜中可以产生较低和更线性的串联电阻。 此外,N型间隔层可以与量子阱的有源区相邻。 从最近的N型反射镜层到由较低带隙的直接AlGaAs层形成的N型间隔物的Al组成变化可能有类似的步骤,以提供较低的自由载流子吸收。 通过电子亲和力工程,可以在量子阱附近插入少数载流子阱屏障,以在高电流密度和高温下改善孔隙限制。
    • 33. 发明授权
    • Vertical cavity surface emitting laser including indium in the active region
    • 在活性区域中包括铟的垂直空腔表面发射激光器
    • US06922426B2
    • 2005-07-26
    • US10026055
    • 2001-12-20
    • Ralph H. Johnson
    • Ralph H. Johnson
    • H01S5/183H01S5/323H01S5/343H01S5/00
    • B82Y20/00H01S5/183H01S5/3211H01S5/32366H01S5/34306H01S5/34313H01S5/34353
    • Quantum wells and associated barriers layers can be grown to include nitrogen (N), aluminum (Al), antimony (Sb), phosphorous (P) and/or indium (In) placed within or about a typical GaAs substrate to achieve long wavelength VCSEL performance, e.g., within the 1260 to 1650 nm range. In accordance with features of the present invention, a vertical cavity surface emitting laser is described that includes at least one quantum well comprised of InGaAs; GaAsN barrier layers sandwiching said at least one quantum well; and GaAsN confinement layers sandwiching said barrier layers. GaAsN barrier layers sandwiching the quantum well and AlGaAs confinement layers sandwiching the barrier layers can also be provided with a InGaAs quantum well. AlGaAs barrier layers sandwiching the at least one quantum well and GaAsN confinement layers sandwiching the barrier layers can also be provided with a InGaAs quantum well. Quantum wells can be developed up to and including 50 Å in thickness. Quantum wells can also be developed with a depth of at least 40 meV.
    • 可以生长量子阱和相关屏障层,以包括放置在典型GaAs衬底内或周围的氮(N),铝(Al),锑(Sb),磷(P)和/或铟(In),以实现长波长VCSEL 性能,例如在1260至1650 nm范围内。 根据本发明的特征,描述了包括由InGaAs组成的至少一个量子阱的垂直腔表面发射激光器; 夹持所述至少一个量子阱的GaAsN阻挡层; 和夹持所述阻挡层的GaAsN限制层。 夹着量子阱的GaAsN阻挡层和夹持势垒层的AlGaAs限制层也可以设置有InGaAs量子阱。 夹持至少一个量子阱的AlGaAs阻挡层和夹着阻挡层的GaAsN限制层也可以设置有InGaAs量子阱。 量子阱的厚度可以达到并包括50埃。 量子阱也可以开发深度至少40 meV。
    • 39. 发明授权
    • Efficient carrier injection in a semiconductor device
    • 在半导体器件中有效的载流子注入
    • US07829912B2
    • 2010-11-09
    • US11735993
    • 2007-04-16
    • Ralph H. Johnson
    • Ralph H. Johnson
    • H01L31/167
    • H01L29/201H01L33/06H01L33/30H01S5/0421H01S5/18308H01S5/3211
    • Semiconductor devices such as VCSELs, SELs, LEDs, and HBTs are manufactured to have a wide bandgap material near a narrow bandgap material. Electron injection is improved by an intermediate structure positioned between the wide bandgap material and the narrow bandgap material. The intermediate structure is an inflection, such as a plateau, in the ramping of the composition between the wide bandgap material and the narrow bandgap material. The intermediate structure is highly doped and has a composition with a desired low electron affinity. The injection structure can be used on the p-side of a device with a p-doped intermediate structure at high hole affinity.
    • 制造诸如VCSEL,SEL,LED和HBT的半导体器件在窄带隙材料附近具有宽带隙材料。 通过位于宽带隙材料和窄带隙材料之间的中间结构来改善电子注入。 中间结构是在宽带隙材料和窄带隙材料之间的组成的斜坡中的拐点,例如平台。 中间结构是高度掺杂的并且具有期望的低电子亲和力的组成。 注入结构可以在具有高孔亲和力的p掺杂中间结构的器件的p侧上使用。