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31. 发明授权

US07224245B2 Duplexer fabricated with monolithic FBAR and isolation part and a method thereof 有权
标题翻译：用单片FBAR和隔离部分制造的双工器及其方法
公开(公告)号：US07224245B2
公开(公告)日：2007-05-29
申请号：US10989403
申请日：2004-11-17
申请人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Kuang-woo Nam , Dong-ha Shim
发明人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Kuang-woo Nam , Dong-ha Shim
IPC分类号： H03H9/70 , H03H3/02
CPC分类号： H03H9/173 , H03H9/0571 , H03H9/564 , H03H9/706 , Y10T29/42
摘要： A duplexer having a filter and an isolation part which are integrally formed including a substrate, a transmitter filter integrated on the substrate to pass signals only in a frequency band for transmission, a receiver filter integrated on the substrate to pass signals only in a frequency band for reception, and an isolation part integrally formed with either one of the transmitter filter and the receiver filter to isolate the signals passed through the transmitter filter and the receiver filter from each other. Since the isolation part is integrally formed with either one of the transmitter filter and the receiver filter, the duplexer can be manufactured in a small size by simplified processes.
摘要翻译：一种具有滤波器和隔离部分的双工器，其一体形成包括基板，集成在基板上的发射器滤波器，仅在用于传输的频带中传递信号;集成在基板上的接收滤波器，以仅在频带中传递信号以及与发射机滤波器和接收机滤波器中的任一个整体形成的隔离部分，以将通过发射机滤波器和接收机滤波器的信号彼此隔离。由于隔离部分与发射器滤波器和接收器滤波器中的任一个整体形成，所以可以通过简化的处理将双工器制造成小尺寸。

32. 发明申请

US20050253670A1 Air-gap type thin-film bulk acoustic resonator and fabrication method therefor 有权
标题翻译：气隙型薄膜体声波谐振器及其制造方法
公开(公告)号：US20050253670A1
公开(公告)日：2005-11-17
申请号：US11130157
申请日：2005-05-17
申请人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Jong-seok Kim
发明人： In-sang Song , Byeoung-ju Ha , Yun-kwon Park , Jong-seok Kim
IPC分类号： H01L41/09 , H01L41/187 , H01L41/22 , H03H3/02 , H03H9/17 , H03H9/24 , H03H9/56
CPC分类号： H03H9/173 , H03H3/02 , H03H2003/021 , Y10T29/42
摘要： An air-gap type thin-film bulk acoustic resonator. The air-gap type thin-film bulk acoustic resonator has a substrate having a cavity formed on a predetermined portion of an upper surface thereof; a resonance part having a structure of a first electrode, a piezoelectric substance, and a second electrode deposited in order and formed over the upper side of the cavity; and at least one via hole penetrating a lower surface of the substrate and connecting to the cavity.
摘要翻译：气隙式薄膜体声共振器。气隙型薄膜体声波谐振器具有形成在其上表面的预定部分上的空腔的基板; 具有第一电极，压电体和第二电极的结构的共振部分，其依次沉积并形成在空腔的上侧; 以及穿过基板的下表面并连接到空腔的至少一个通孔。

33. 发明授权

US07548139B2 Coupled resonator filter and fabrication method thereof 有权
标题翻译：耦合谐振滤波器及其制造方法
公开(公告)号：US07548139B2
公开(公告)日：2009-06-16
申请号：US11455190
申请日：2006-06-19
申请人： Hao-seok Park , Joo-ho Lee , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
发明人： Hao-seok Park , Joo-ho Lee , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
IPC分类号： H03H9/17 , H03H9/00
CPC分类号： H03H9/584 , H03H3/04 , H03H9/587 , H03H9/588
摘要： A coupled resonator filter and a method of fabricating the coupled resonator filter are provided. The method includes: sequentially stacking a first electrode, a first piezoelectric layer, a second electrode, an insulating layer, a third electrode, a second piezoelectric layer, and a fourth electrode on a surface of a substrate; sequentially patterning the first electrode, the first piezoelectric layer, the second electrode, the insulating layer, the third electrode, the second piezoelectric layer, and the fourth electrode to expose areas of the first, second, and third electrodes; forming a plurality of connection electrodes respectively connected to the exposed areas of the first, second, and third electrodes and an area of the fourth electrode; and etching an area of the substrate underneath the first electrode to form an air gap.
摘要翻译：提供耦合谐振滤波器和制造耦合谐振滤波器的方法。该方法包括：在基板的表面上依次堆叠第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极; 顺序地构图第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极，以暴露第一，第二和第三电极的区域; 形成分别连接到第一，第二和第三电极的暴露区域和第四电极的区域的多个连接电极; 并且蚀刻在第一电极下方的衬底的区域以形成气隙。

34. 发明授权

US07498900B2 System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
标题翻译：包括用于隔离元件的气腔，双工器和双工器制造方法的片上系统结构
公开(公告)号：US07498900B2
公开(公告)日：2009-03-03
申请号：US11517371
申请日：2006-09-08
申请人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
发明人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
IPC分类号： H03H9/00
CPC分类号： H01L27/0805 , H03H9/0571 , H03H9/588 , H03H9/706
摘要： A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.
摘要翻译：防止发射机和接收机滤波器之间影响的双工器。双工器包括基板，在基板的表面上的预定的第一区域中制造的发送器滤波器，在基板的表面上的预定的第二区域中制造的接收滤波器，以及在预定的第一和第第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。因此，可以有效地截获元素之间的物理效应。

35. 发明申请

US20070139139A1 Coupled resonator filter and fabrication method thereof 有权
标题翻译：耦合谐振滤波器及其制造方法
公开(公告)号：US20070139139A1
公开(公告)日：2007-06-21
申请号：US11455190
申请日：2006-06-19
申请人： Hao-seok Park , Joo-ho Lee , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
发明人： Hao-seok Park , Joo-ho Lee , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
IPC分类号： H03H9/54
CPC分类号： H03H9/584 , H03H3/04 , H03H9/587 , H03H9/588
摘要： A coupled resonator filter and a method of fabricating the coupled resonator filter are provided. The method includes: sequentially stacking a first electrode, a first piezoelectric layer, a second electrode, an insulating layer, a third electrode, a second piezoelectric layer, and a fourth electrode on a surface of a substrate; sequentially patterning the first electrode, the first piezoelectric layer, the second electrode, the insulating layer, the third electrode, the second piezoelectric layer, and the fourth electrode to expose areas of the first, second, and third electrodes; forming a plurality of connection electrodes respectively connected to the exposed areas of the first, second, and third electrodes and an area of the fourth electrode; and etching an area of the substrate underneath the first electrode to form an air gap.
摘要翻译：提供耦合谐振滤波器和制造耦合谐振滤波器的方法。该方法包括：在基板的表面上依次堆叠第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极; 顺序地构图第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极，以暴露第一，第二和第三电极的区域; 形成分别连接到第一，第二和第三电极的暴露区域和第四电极的区域的多个连接电极; 并且蚀刻在第一电极下方的衬底的区域以形成气隙。

36. 发明申请

US20070126527A1 System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
标题翻译：包括用于隔离元件的气腔，双工器和双工器制造方法的片上系统结构
公开(公告)号：US20070126527A1
公开(公告)日：2007-06-07
申请号：US11517371
申请日：2006-09-08
申请人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
发明人： Joo-ho Lee , Hae-seok Park , In-sang Song , Byeoung-ju Ha , Seog-woo Hong
IPC分类号： H03H9/70
CPC分类号： H01L27/0805 , H03H9/0571 , H03H9/588 , H03H9/706
摘要： A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.
摘要翻译：防止发射机和接收机滤波器之间影响的双工器。双工器包括基板，在基板的表面上的预定的第一区域中制造的发送器滤波器，在基板的表面上的预定的第二区域中制造的接收滤波器，以及在预定的第一和第第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。因此，可以有效地截获元素之间的物理效应。

37. 发明授权

US07615842B2 Inductor integrated chip 有权
标题翻译：电感集成芯片
公开(公告)号：US07615842B2
公开(公告)日：2009-11-10
申请号：US11473079
申请日：2006-06-23
申请人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
发明人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
IPC分类号： H01L29/00
CPC分类号： H03H9/0542 , H03H9/105
摘要： An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.
摘要翻译：提供一种电感器集成芯片及其制造方法。电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件，其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。该方法包括在晶片的表面上形成电感器和电路元件，其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件，以将连接电极与电感器的第二端连接。

38. 发明申请

US20060164187A1 Band filter using film bulk acoustic resonator and method of fabricating the same 有权
标题翻译：使用膜体声波谐振器的带滤波器及其制造方法
公开(公告)号：US20060164187A1
公开(公告)日：2006-07-27
申请号：US11337574
申请日：2006-01-24
申请人： Seog-woo Hong , Byeoung-ju Ha , In-sang Song , Kyu-sik Kim
发明人： Seog-woo Hong , Byeoung-ju Ha , In-sang Song , Kyu-sik Kim
IPC分类号： H03H9/56
CPC分类号： H03H3/02 , H03H9/02047 , H03H9/588 , H03H2003/023
摘要： A band filter using a film bulk acoustic resonator and a method of fabricating the same. The method includes the steps of forming a membrane layer on a substrate, forming a plurality of resonators on an upper surface of the membrane layer, depositing a mask layer on a lower surface of the membrane layer and patterning the mask layer to form a plurality of main windows and sub windows, and forming cavities along the main windows in the substrate and forming sub walls in the cavities in such a way that the sub walls are separated apart from the membrane layer by using the notch effect caused during a dry etching. It is possible to precisely form cavities with desired sizes even if the cavities have different sizes, to reduce the notched areas in the cavities, to reduce the total size of the filter by decreasing a distance between the cavities and to reduce the total length of wires.
摘要翻译：一种使用膜体声波谐振器的带滤波器及其制造方法。该方法包括以下步骤：在衬底上形成膜层，在膜层的上表面上形成多个谐振器，在膜层的下表面上沉积掩模层，并使掩模层形成多个主窗口和副窗口，并且沿着基板中的主窗口形成空腔，并且以这样的方式在空腔中形成子壁，使得通过使用在干蚀刻期间引起的切口效应，子壁与膜层分离。可以精确地形成具有期望尺寸的空腔，即使空腔具有不同的尺寸，以减少空腔中的凹口区域，以通过减小空腔之间的距离来减小过滤器的总尺寸并减少导线的总长度。

39. 发明授权

US07619492B2 Film bulk acoustic resonator and a method for manufacturing the same 有权
标题翻译：薄膜体声波谐振器及其制造方法
公开(公告)号：US07619492B2
公开(公告)日：2009-11-17
申请号：US11324303
申请日：2006-01-04
申请人： Byeoung-ju Ha , Seog-woo Hong , In-sang Song , Hyung Choi
发明人： Byeoung-ju Ha , Seog-woo Hong , In-sang Song , Hyung Choi
IPC分类号： H03H9/54 , H01L41/22
CPC分类号： H03H3/02 , H03H9/174 , Y10T29/42
摘要： A film bulk acoustic resonator (FBAR) including a substrate having an etched air gap therethrough; a resonance part having a first electrode, a piezoelectric film and a second electrode which are laminated in turn above the air gap; and an etching resistance layer disposed between the air gap and the resonance part to limit an etching depth in forming the air gap, thereby preventing damage to the resonance part.
摘要翻译：一种薄膜体声波谐振器（FBAR），包括具有穿过其中的蚀刻气隙的基板; 具有第一电极，压电膜和第二电极的共振部分，其依次层叠在气隙上方; 以及设置在气隙和谐振部件之间的耐蚀刻层，以限制形成气隙的蚀刻深度，从而防止对共振部件的损坏。

40. 发明申请

US20070138594A1 Inductor integrated chip and fabrication method thereof 有权
标题翻译：电感集成芯片及其制造方法
公开(公告)号：US20070138594A1
公开(公告)日：2007-06-21
申请号：US11473079
申请日：2006-06-23
申请人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
发明人： Joo-ho Lee , Hae-seok Park , Byeoung-ju Ha , Seog-woo Hong , Hyung Choi , In-sang Song
IPC分类号： H01L29/00
CPC分类号： H03H9/0542 , H03H9/105
摘要： An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.
摘要翻译：提供一种电感器集成芯片及其制造方法。电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件，其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。该方法包括在晶片的表面上形成电感器和电路元件，其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件，以将连接电极与电感器的第二端连接。

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