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    • 32. 发明授权
    • Piezoelectric resonance component
    • 压电谐振分量
    • US5621263A
    • 1997-04-15
    • US285233
    • 1994-08-03
    • Hiroaki Kaida
    • Hiroaki Kaida
    • H03H9/05H01L41/08
    • H03H9/1035H03H9/0595
    • A piezoelectric resonance component includes spacer plates located on both side surfaces of a piezo-resonator so as to form through clearances for allowing vibration of a vibrating part. Case substrates are located on both major surfaces of the piezo-resonator and the spacer plates through spacer frame members for defining clearances for allowing vibration of the vibrating part of the piezo-resonator. Dynamic dampers are located between the vibrating part of the piezo-resonator and ends of a piezoelectric substrate for suppressing vibration received from the vibrating part and for preventing vibration from being transmitted to a holding part.
    • 压电共振部件包括位于压电谐振器的两个侧表面上的间隔板,以形成通过间隙以允许振动部件的振动。 壳体基板位于压电谐振器的两个主表面上,隔离板通过间隔框架构件限定间隙,以允许压电谐振器的振动部分振动。 动压阻尼器位于压电谐振器的振动部分和压电基片的端部之间,用于抑制从振动部分接收的振动并防止振动传递到保持部分。
    • 35. 发明授权
    • Piezoelectric tuning fork resonator and method of manufacturing the same
    • 压电音叉谐振器及其制造方法
    • US5302880A
    • 1994-04-12
    • US64944
    • 1993-05-20
    • Hiroaki Kaida
    • Hiroaki Kaida
    • H03H9/21H01L41/08
    • H03H9/21Y10T29/42
    • A piezoelectric tuning fork resonator having a piezoelectric substrate provided with a stepped portion on its end and a tuning fork arm portion formed in the stepped portion. A dummy substrate is arranged adjacent to a side of the piezoelectric substrate and a pair of sealing substrates are pasted onto upper and lower portions of the piezoelectric substrate and the dummy substrate to form a chip type piezoelectric tuning fork resonator. In another embodiment piezoelectric substrate includes a resin sealing portion having a hollow portion defined around the tuning fork arm portion so as to form a resin-coated piezoelectric tuning fork resonator.
    • 一种压电音叉谐振器,具有在其端部设置有阶梯部的压电基板和形成在台阶部的音叉臂部。 虚设基板与压电基板的一侧相邻配置,并且一对密封基板被粘贴在压电基板和虚设基板的上部和下部,以形成芯片型压电音叉谐振器。 在另一实施例中,压电基片包括树脂密封部分,该树脂密封部分具有围绕音叉臂部分限定的中空部分,以形成树脂涂覆的压电音叉谐振器。
    • 40. 发明申请
    • PIEZOELECTRIC VIBRATION COMPONENT
    • 压电振动元件
    • US20100231094A1
    • 2010-09-16
    • US12794144
    • 2010-06-04
    • Eitaro KamedaToru KizuAkihiro MitaniHiroaki Kaida
    • Eitaro KamedaToru KizuAkihiro MitaniHiroaki Kaida
    • H01L41/053
    • H03H9/1021
    • To obtain an inexpensive piezoelectric vibration component having vibration characteristics whose degradation resulting from deposition of moisture due to a temperature change is less likely to occur without increasing the cost of a sealing structure and the number of parts, a piezoelectric vibration component includes a piezoelectric vibrating element accommodated in a package being sealed, and when the volume of the piezoelectric vibrating element is Ve and the volume within the package obtained by subtraction of the volume Ve of the piezoelectric vibrator from the volume of the space of the package is Vp Ve/Vp>(Se×M)/{(Sp+Se)×2.72} where Se is the surface area of the piezoelectric vibrating element, Sp is the surface area of the space inside the package when the piezoelectric vibrating element inside the package is absent, and M is the maximum mass of moisture per unit volume [μg/mm3] at the use temperature and 100% relative humidity.
    • 为了获得具有振动特性的廉价的压电振动部件,其压电振动部件包括压电振动部件,压电振动部件不会增加密封结构的成本和部件数量,因此,由于温度变化导致的水分沉积导致的劣化, 容纳在被封装的封装中,并且当压电振动元件的体积为Ve时,通过从压缩振动器的空间体积减去压缩振动器的体积Ve而获得的封装体积为Vp Ve / Vp> (Se×M)/ {(Sp + Se)×2.72}其中Se是压电振动元件的表面积,Sp是包装内的压电振动元件不存在时封装内的空间的表面积, M是使用温度和100%相对湿度下每单位体积的最大水分质量[μg/ mm3]。