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31. 发明申请

US20090310908A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20090310908A1
公开(公告)日：2009-12-17
申请号：US12457372
申请日：2009-06-09
申请人： Hitoki Kanagawa , Jun Ishii , Toshiki Naito
发明人： Hitoki Kanagawa , Jun Ishii , Toshiki Naito
IPC分类号： G02B6/12
CPC分类号： G11B5/4833 , G02B6/43 , G11B5/4866 , G11B2005/0021 , H05K1/0274 , H05K1/056
摘要： A suspension board with circuit includes a circuit board, and an optical waveguide formed on the circuit board. The circuit board is provided with a pedestal for supporting a slider. The pedestal allows the optical waveguide to be disposed so as to overlap the slider in a thickness direction of the circuit board.
摘要翻译：具有电路的悬挂板包括电路板和形成在电路板上的光波导。电路板设置有用于支撑滑块的基座。基座允许光波导被设置成在电路板的厚度方向上与滑块重叠。

32. 发明申请

US20080277142A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20080277142A1
公开(公告)日：2008-11-13
申请号：US12081835
申请日：2008-04-22
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H05K1/00
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.
摘要翻译：一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。

33. 发明授权

US08869391B2 Producing method of wired circuit board 有权
标题翻译：有线电路板的生产方法
公开(公告)号：US08869391B2
公开(公告)日：2014-10-28
申请号：US13317648
申请日：2011-10-25
申请人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
发明人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
IPC分类号： H05K3/10 , H05K3/42 , G11B5/48 , H05K1/05
CPC分类号： H05K3/421 , G11B5/486 , H05K1/056 , H05K3/108 , H05K2201/09509 , H05K2203/1105 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.
摘要翻译：布线电路基板的制造方法包括以下步骤：制备金属支撑层，在金属支撑层上形成绝缘层以形成开口，在绝缘层和金属支撑层上形成导电薄膜，从绝缘层的开口露出，加热导电薄膜，在形成于绝缘层上的导电薄膜上形成导电图案，并在导电薄膜上形成与导电图案连续的金属连接部分形成在从绝缘层的开口露出的金属支撑层上的膜。

34. 发明申请

US20120124829A1 Producing method of wired circuit board 有权
标题翻译：有线电路板的生产方法
公开(公告)号：US20120124829A1
公开(公告)日：2012-05-24
申请号：US13317648
申请日：2011-10-25
申请人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
发明人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
IPC分类号： H05K3/10
CPC分类号： H05K3/421 , G11B5/486 , H05K1/056 , H05K3/108 , H05K2201/09509 , H05K2203/1105 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.
摘要翻译：布线电路基板的制造方法包括以下步骤：制备金属支撑层，在金属支撑层上形成绝缘层以形成开口，在绝缘层和金属支撑层上形成导电薄膜，从绝缘层的开口露出，加热导电薄膜，在形成于绝缘层上的导电薄膜上形成导电图案，并在导电薄膜上形成与导电图案连续的金属连接部分形成在从绝缘层的开口露出的金属支撑层上的膜。

35. 发明授权

US08174844B2 Wired circuit board and connection structure between wired circuit boards 有权
标题翻译：有线电路板和有线电路板之间的连接结构
公开(公告)号：US08174844B2
公开(公告)日：2012-05-08
申请号：US12654034
申请日：2009-12-08
申请人： Hitoki Kanagawa , Akinori Itokawa , Naotaka Higuchi
发明人： Hitoki Kanagawa , Akinori Itokawa , Naotaka Higuchi
IPC分类号： H05K1/11
CPC分类号： H05K1/147 , G11B5/4813 , G11B5/4853 , G11B5/486 , H05K1/056 , H05K1/142 , H05K1/145 , H05K1/189 , H05K2201/10689
摘要： A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.
摘要翻译：一种用于将悬挂板与包括金属支撑层，绝缘基底层，导电层和绝缘覆盖层的电路电连接的布线电路板和外部电路，包括与悬挂板电连接的第一布线电路板带电路; 以及用于与外部电路电连接的第二布线电路板。第一布线电路板和第二布线电路板通过前置放大器电连接。第一布线电路板包括第一金属支撑层; 第一绝缘基层; 第一导电层和第一绝缘覆盖层。

36. 发明授权

US07957614B2 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US07957614B2
公开(公告)日：2011-06-07
申请号：US12457576
申请日：2009-06-16
申请人： Jun Ishii , Hitoki Kanagawa , Toshiki Naito
发明人： Jun Ishii , Hitoki Kanagawa , Toshiki Naito
IPC分类号： G02B6/12 , G02B6/26
CPC分类号： G11B5/4866 , G02B6/423 , G11B5/486 , H05K1/0274 , H05K1/056 , H05K2201/09909 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49895
摘要： A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
摘要翻译：具有电路的悬挂板包括：金属支撑板，形成在金属支撑板上的绝缘图案和形成在绝缘图案上的导电图案的电路板; 布置在电路板上的光波导; 以及设置在电路板上以便相对于电路板定位光波导的定位部分。

37. 发明授权

US07732900B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07732900B2
公开(公告)日：2010-06-08
申请号：US11236815
申请日：2005-09-28
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H01L23/495
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.
摘要翻译：一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，从而导线4a，4b，4c，4d，磁头连接端子7和外部连接端子8一体形成，并且在外部连接端子8中也形成有第一通孔9.然后，在形成绝缘覆盖层10之后，在支撑板2上形成第三通孔20和第二通孔19，绝缘基底层3分别与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时可以进行连接，同时确认焊球的位置 21从相应的通孔。

38. 发明授权

US07405479B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07405479B2
公开(公告)日：2008-07-29
申请号：US11224108
申请日：2005-09-13
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H01L23/48
CPC分类号： G11B5/4853 , G11B5/4846 , G11B5/486 , H01L2924/0002 , H05K1/056 , H05K1/111 , H05K3/3452 , H05K3/3478 , H05K2201/09472 , H05K2201/09745 , H05K2203/041 , Y02P70/611 , H01L2924/00
摘要： A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer 3 is formed on a supporting board 2 so that insulating concave portions 13 are formed at portions thereof where external connecting terminals 8 are to be formed. A conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, the magnetic head connecting terminals 7, and the external connecting portions 8 are integrally formed, and conductive concave portions 9 are formed in the external connecting terminals 8. Thereafter, an insulating cover layer 10 is formed on the insulating base layer 3 so that the magnetic head connecting terminals 7 and the external connecting terminals 8 are exposed from the insulating cover layer 10. In the suspension board with circuit 1 thus formed, when the external connecting terminals 8 are connected with connecting terminals of a read/write substrate via the solder balls 21, reliable connection therebetween can be ensured.
摘要翻译：一种具有能够确保大的电气连接区域的端子的布线电路板，同时防止相邻端子的短路，以确保端子通过熔融金属与外部端子电连接。绝缘基层3形成在支撑板2上，使得绝缘凹部13形成在其外部连接端子8将要形成的部分处。导电图案4形成在绝缘基底层3上，使得线4a，4b，4c，4d的线数，磁头连接端子7和外部连接部8一体形成，导电凹部9形成在外部连接端子8中。此后，在绝缘基底层3上形成绝缘覆盖层10，使得磁头连接端子7和外部连接端子8从绝缘覆盖层10露出在具有如此形成的电路1的悬挂板中，当外部连接端子8经由焊球21与读取/写入基板的连接端子连接时，可以确保其间的可靠连接。

39. 发明申请

US20060087011A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20060087011A1
公开(公告)日：2006-04-27
申请号：US11236815
申请日：2005-09-28
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H01L23/495
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.
摘要翻译：一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。

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