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31. 发明申请

US20080095451A1 Image Processing Apparatus, Image Processing Method, and Image Processing Program 失效
标题翻译：图像处理装置，图像处理方法和图像处理程序
公开(公告)号：US20080095451A1
公开(公告)日：2008-04-24
申请号：US11662267
申请日：2005-09-07
申请人： Takeshi Nakamura
发明人： Takeshi Nakamura
IPC分类号： G06K9/36
CPC分类号： H04N19/577 , H04N19/107 , H04N19/137 , H04N19/179 , H04N19/527 , H04N19/58 , H04N19/61
摘要： A target image of coding is separated into sequences of a plurality of frames, that is, shots, and differences between the shots and shots similar to the shots are coded (reference frames for each frame in the target shot of coding are frames corresponding thereto in a shot similar to the target shot). As shown in the figure, for example, a shot “A3” refers to a similar shot “A0” (prediction) and “A1” or “A2” refers to both shots “A0” and “A3” (bidirectional prediction), respectively for coding.
摘要翻译：编码的目标图像被分成多个帧的序列，即拍摄，并且类似于拍摄的拍摄和拍摄之间的差异被编码（编码目标镜头中的每个帧的参考帧是与其对应的帧一个类似于目标射门的镜头）。如图所示，例如，拍摄“A 3”是指相似的照片“A 0”（预测），“A 1”或“A 2”是指两张照片“A 0”和“A 3” （双向预测），分别用于编码。

32. 发明授权

US07339281B2 Circuit device and manufacturing method thereof 失效
标题翻译：电路装置及其制造方法
公开(公告)号：US07339281B2
公开(公告)日：2008-03-04
申请号：US11139210
申请日：2005-05-26
申请人： Ryosuke Usui , Hiroyuki Watanabe , Takeshi Nakamura
发明人： Ryosuke Usui , Hiroyuki Watanabe , Takeshi Nakamura
IPC分类号： H01L23/29
CPC分类号： H05K3/4655 , H01L21/565 , H01L23/4334 , H01L23/49531 , H01L23/5384 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2221/68377 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K3/0035 , H05K3/284 , H05K3/421 , H05K3/4647 , H05K3/4652 , H05K2201/0195 , H05K2201/0209 , H05K2201/0266 , H05K2201/09509 , H05K2201/09581 , H05K2201/096 , H05K2203/0369 , H05K2203/0554 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.
摘要翻译：提供一种能够容易地形成将布线层彼此连接的连接部的电路装置及其制造方法。在本发明的混合集成电路器件的制造方法中，形成第一树脂膜以覆盖第一布线层。此后，形成穿过第一树脂膜并从其底部露出第一布线层的第一通孔。接下来，形成第二树脂膜以填充第一通孔。此外，在埋设在第一通孔中的第二树脂膜中形成第二通孔，形成连接部。

33. 发明申请

US20080010477A1 RECORDING APPARATUS AND METHOD FOR CONTROLLING THE RECORDING APPARATUS 有权
标题翻译：记录装置和控制记录装置的方法
公开(公告)号：US20080010477A1
公开(公告)日：2008-01-10
申请号：US11770010
申请日：2007-06-28
申请人： Takeshi Nakamura
发明人： Takeshi Nakamura
IPC分类号： G06F1/00
CPC分类号： H04N1/00885 , H04N1/00204 , H04N1/00347 , H04N1/00896 , H04N2201/0036 , H04N2201/0044 , H04N2201/0049 , H04N2201/0051 , H04N2201/0087 , H04N2201/0094
摘要： A recording apparatus can shift to power saving modes even when the recording apparatus is connected to the host PC, thus reducing power consumption. The recording apparatus can switch to a first power saving mode to supply power that enables detection of an inquiry from a host device and also switch to a second power saving mode to supply power that enables responding to an inquiry from the host device about information as to the memory card. Prior to switching to the first power saving mode, the recording apparatus stores information about a memory card attached to the card slot in a memory unit. In response to detection of an inquiry from the host device, the recording apparatus switches from the first power saving mode to the second power saving mode, and notifies information stored in the memory card controller to the host device.
摘要翻译：即使当记录装置连接到主机PC时，记录装置也可以转换到省电模式，从而降低功耗。记录装置可以切换到第一省电模式以提供能够检测来自主机设备的查询的电力，并且还切换到第二省电模式以提供能够响应于来自主机设备的查询的电源，关于关于存储卡。在切换到第一省电模式之前，记录装置将关于附接到卡槽的存储卡的信息存储在存储单元中。响应于来自主机设备的查询的检测，记录设备从第一省电模式切换到第二省电模式，并将存储在存储卡控制器中的信息通知主机设备。

34. 发明申请

US20070281459A1 Multilayer Substrate Manufacturing Method 失效
标题翻译：多层基板制造方法
公开(公告)号：US20070281459A1
公开(公告)日：2007-12-06
申请号：US10598469
申请日：2005-02-24
申请人： Takeshi Nakamura , Katsumi Ito
发明人： Takeshi Nakamura , Katsumi Ito
IPC分类号： H01L21/4763
CPC分类号： H05K3/4679 , H01L2224/16225 , H01L2924/19105 , H05K1/0269 , H05K3/0008 , H05K3/0032 , H05K3/0035 , H05K3/064 , H05K3/429 , H05K3/4652 , H05K2201/0394 , H05K2201/09063 , H05K2201/09536 , H05K2201/09563 , H05K2201/09781 , H05K2203/0554 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A manufacturing method of a multilayer substrate that suppresses relative displacement of layers and forms interconnecting portions electrically connecting layers having an accurate positioning. A manufacturing method of a multilayer substrate for laminating, via an insulating film, a wiring layer formed by patterning a conductive film comprises providing a positioning hole in a conductive film laminated at the beginning and patterning a second and/or any subsequent wiring layers after identifying a position of an identification section. Interconnecting sections for interconnecting wiring layers are formed using the identification section.
摘要翻译：一种抑制层的相对位移的多层基板的制造方法，形成具有精确定位的电连接层的互连部。一种多层基板的制造方法，其特征在于，通过绝缘膜将通过图案形成导电膜形成的布线层层叠在一起，在开始时形成层叠的导电膜的定位孔，并且在识别出第二和/ 识别部分的位置。用于互连布线层的互连部分使用识别部分形成。

35. 发明授权

US07125704B2 Gluconate dehydratase 有权
公开(公告)号：US07125704B2
公开(公告)日：2006-10-24
申请号：US10885874
申请日：2004-07-08
申请人： Hitoki Miyake , Toshifumi Yamaki , Toshihiro Oikawa , Takeshi Nakamura , Hiroki Ishibashi , Yasushi Fukuiri , Atsushi Sakuma , Hironori Komatsu , Tomoyuki Ando , Kazuhiko Togashi , Hideki Umetani
发明人： Hitoki Miyake , Toshifumi Yamaki , Toshihiro Oikawa , Takeshi Nakamura , Hiroki Ishibashi , Yasushi Fukuiri , Atsushi Sakuma , Hironori Komatsu , Tomoyuki Ando , Kazuhiko Togashi , Hideki Umetani
IPC分类号： C12N9/88 , C12P7/40 , C12P7/58 , C12P21/06
CPC分类号： C12N9/88 , C12P7/58 , C12Y402/01039
摘要： A novel gluconate dehydratase derived from Achromobacter xylosoxidans and a gene encoding the gluconate dehydratase are provided. By reacting the gluconate dehydratase or a transformed cell containing the gene with an aldonic acid, the corresponding 2-keto-3-deoxyaldonic acid can be efficiently produced.

36. 发明申请

US20060114726A1 Nonvolatile memory 有权
公开(公告)号：US20060114726A1
公开(公告)日：2006-06-01
申请号：US11330233
申请日：2006-01-12
申请人： Kenji Kozakai , Takeshi Nakamura , Tatsuya Ishii , Motoyasu Tsunoda , Shinya Iguchi , Junichi Maruyama
发明人： Kenji Kozakai , Takeshi Nakamura , Tatsuya Ishii , Motoyasu Tsunoda , Shinya Iguchi , Junichi Maruyama
IPC分类号： G11C16/04 , G11C7/10
CPC分类号： G06F12/0246 , G06F11/1068 , G06F12/06 , G06F2212/1036 , G11C16/04 , G11C16/10 , G11C16/349 , G11C29/44 , G11C29/76 , G11C2029/0409
摘要： For a nonvolatile memory permitting electrical writing and erasing of information to be stored, such as a flash memory, the load on the system developer is to be reduced, and it is to be made possible to avoid, even if such important data for the system as management and address translation information are damaged, an abnormal state in which the system becomes unable to operate. The nonvolatile memory is provided with a replacing function to replace a group of memory cells including defective memory cells which are incapable of normal writing or erasion with a group of memory cells including no defective memory cell, a numbers of rewrites averaging function to grasp the number of data rewrites in each group of memory cells and to so perform replacement of memory cell groups that there may arise no substantial difference in the number of rewrites among a plurality of memory cell groups, and an error correcting function to detect and correct any error in data stored in the memory array, wherein first address translation information deriving from the replacing function and second address translation information deriving from the numbers of rewrites averaging function are stored in respectively prescribed areas in the memory array, and the first address translation information and second address translation information concerning the same memory cell group are stored in a plurality of sets in a time series.

37. 发明授权

US07026725B2 Control circuit for vehicular power transmission apparatus, and abnormality determining device for the control circuit 失效
公开(公告)号：US07026725B2
公开(公告)日：2006-04-11
申请号：US10305235
申请日：2002-11-27
申请人： Takeshi Nakamura , Atsushi Kumazawa , Osamu Ogi , Osamu Umemoto
发明人： Takeshi Nakamura , Atsushi Kumazawa , Osamu Ogi , Osamu Umemoto
IPC分类号： H02H7/00
CPC分类号： F16H61/12 , F16H2061/005 , F16H2061/1224 , F16H2061/1292
摘要： An interruption circuit capable of interrupting an electrical power fed from a power source unit to a driver circuit in response to an interruption signal from an electronic control unit is interposed between the driver circuit for activating power transmission means and the power source unit. By this arrangement, it is possible to interrupt the electrical power fed from the power source unit to the driver circuit forcibly and prevent unnecessary power consumption and unnecessary action (or a malfunction) of the power transmission means.

38. 发明申请

US20060001166A1 Circuit device and manufacturing method thereof 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20060001166A1
公开(公告)日：2006-01-05
申请号：US11165680
申请日：2005-06-24
申请人： Yusuke Igarashi , Takeshi Nakamura , Yasunori Inoue , Ryosuke Usui , Hideki Mizuhara
发明人： Yusuke Igarashi , Takeshi Nakamura , Yasunori Inoue , Ryosuke Usui , Hideki Mizuhara
IPC分类号： H01L23/48
CPC分类号： H01L23/5384 , H01L23/3128 , H01L24/48 , H01L2221/68377 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48465 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K3/4647 , H05K2201/0355 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/0733 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.
摘要翻译：提供一种包括具有改善的散热性能的多层布线结构的电路装置及其制造方法。本发明的电路器件包括第一布线层和在插入第一绝缘层的同时层叠的第二布线层。第一布线层通过形成为穿透第一绝缘层的连接部分在期望位置连接到第二布线层。连接部分包括从第一布线层沿厚度方向突出的第一连接部分和从第二布线层沿厚度方向突出的第二连接部分。第一连接部和第二连接部在绝缘层的厚度方向的中间部彼此接触。

40. 发明授权

US06889428B2 Method of manufacturing sheet material and method of manufacturing circuit device using the same 失效
标题翻译：片材的制造方法及使用该片材的电路装置的制造方法
公开(公告)号：US06889428B2
公开(公告)日：2005-05-10
申请号：US10617339
申请日：2003-07-10
申请人： Yusuke Igarashi , Noriaki Sakamoto , Takeshi Nakamura , Yoshiyuki Kobayashi
发明人： Yusuke Igarashi , Noriaki Sakamoto , Takeshi Nakamura , Yoshiyuki Kobayashi
IPC分类号： C25D5/02 , C25D7/00 , H01L21/48 , H01L23/31 , H01L23/495 , H01L23/50 , H01L25/04 , H01L25/18 , H05K3/30
CPC分类号： H01L21/4832 , C25D5/026 , H01L21/4828 , H01L23/3107 , H01L23/49582 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/743 , H01L24/97 , H01L2224/29339 , H01L2224/32245 , H01L2224/3754 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83439 , H01L2224/84 , H01L2224/85439 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49142 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the surface of the conductive foil. The resin film of parts which become bonding pads and die pads is eliminated by a laser etching. A clamper presses of the periphery of the block so as to form hermetically sealed spaces on the block. The interior of the clamper is filled with a plating liquid by means of an injection means and an evacuation means, and subsequently, and Ag plated film is formed by an electroplating method.
摘要翻译：本发明是在导电箔上形成大面积精密电镀膜，简化了镀膜的形成工序。在导电箔的表面上形成由热固性树脂构成的树脂膜。通过激光蚀刻消除了成为接合焊盘和管芯焊盘的部件的树脂膜。块体的周边的夹持器压制以在块上形成密封的空间。夹持器的内部通过注射装置和排气装置填充电镀液，随后通过电镀法形成Ag镀膜。

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