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    • 31. 发明授权
    • Corrective tempering apparatus for rolling elements
    • 滚动元件矫正回火设备
    • US06248287B1
    • 2001-06-19
    • US09449676
    • 1999-11-30
    • Kiyoshi HirakawaAkitoshi MaedaHiroaki SugiyamaManabu Ohhori
    • Kiyoshi HirakawaAkitoshi MaedaHiroaki SugiyamaManabu Ohhori
    • C21D900
    • C21D1/30C21D1/26C21D1/40C21D1/42C21D1/673C21D9/40F16C33/30Y02P10/253Y10S148/906
    • In a corrective tempering method and apparatus for a rolling element in which the thermal deformation of the rolling element is corrected within an extremely short time by utilizing plasticity exhibited during a metallic structure transforming process brought about by low-temperature tempering of the rolling element made of steel, the hardened rolling element is heated and pressured to a maximum temperature within a range of from 250 to 500° C. by a heating device while set in correcting molds to correct the deformation of the rolling element at a degree of working within a range not exceeding an elastic deformation range of the rolling element at a room temperature. The rolling element can be heated also by an induction heating device in addition to a conduction heating device. A product whose inner/outer diameter correcting degree of deformation is 60% or more, dimension standardizing rate is 30% or more, surface roughness is less than Ra 0.2 &mgr;m, and surface hardness is HRC 56 or more can be obtained for a correction time within 6 minutes and an induction heating time within 30 seconds.
    • 在一种用于滚动元件的矫正回火方法和装置中,通过利用在通过低温回火引起的金属结构转化过程中所发生的塑性,在极短的时间内校正滚动元件的热变形, 通过加热装置将淬火的滚动元件加热并加压到250-500℃的最高温度,同时设置在校正模具中以在一定范围内的加工程度校正滚动元件的变形 在室温下不超过滚动体的弹性变形范围。 除了传导加热装置之外,滚动体也可以通过感应加热装置加热。 其外径矫正度的变形量为60%以上,尺寸标准化率为30%以上,表面粗糙度小于Ra0.2μm,并且可以获得表面硬度为HRC 56以上的校正时间 在6分钟内,感应加热时间在30秒以内。
    • 36. 发明授权
    • Method of manufacturing a liquid crystal display panel including a terminal electrode part thereof
    • 制造包括其端子电极部分的液晶显示面板的方法
    • US06515730B1
    • 2003-02-04
    • US09924766
    • 2001-08-09
    • Akitoshi Maeda
    • Akitoshi Maeda
    • G02F113
    • G02F1/1345
    • A simple method for preventing oxidization of an aluminum surface of terminal electrode, increase of pressure contact resistance, unstability and reduction of connection reliability is provided. In a terminal electrode part on a reactive matrix substrate, for being connected to an external drive circuit, connecting electrodes are formed by using aluminum or an aluminum alloy, at least their surfaces connected to TCP are covered with an insulating film of aluminum oxide or consisting of a laminate film of aluminum oxide aluminum hydroxide, and the insulating film is selectively removed in a step subsequent to the final step in a cell formation process. In this way, adverse effects of the heat treatment processes such as the annealing in the array formation process and the orientation film sintering of the cell formation process and the oxidization of the connecting electrode surface in the washing.
    • 提供了一种防止端子电极的铝表面氧化的简单方法,增加了耐压接触性,不稳定性和连接可靠性的降低。 在反应性基质基板上的端子电极部分中,为了连接到外部驱动电路,通过使用铝或铝合金形成连接电极,至少其连接到TCP的表面被氧化铝的绝缘膜覆盖,或者由 的氧化铝氢氧化铝的层压膜,并且在细胞形成过程中的最终步骤之后的步骤中选择性地除去绝缘膜。 以这种方式,诸如阵列形成过程中的退火和细胞形成过程的取向膜烧结以及洗涤中连接电极表面的氧化的热处理过程的不利影响。
    • 38. 发明授权
    • Liquid crystal display panel and method of manufacturing the same, including a structure for, and a method of preparing, terminal or connecting electrodes for connecting liquid crystal display panel to an external drive circuit
    • 液晶显示面板及其制造方法,包括用于将液晶显示面板与外部驱动电路连接的端子或连接电极的结构和方法
    • US06259495B1
    • 2001-07-10
    • US09233961
    • 1999-01-20
    • Akitoshi Maeda
    • Akitoshi Maeda
    • G02F1136
    • G02F1/1345
    • A simple method for preventing oxidization of an aluminum surface of terminal electrode, increase of pressure contact resistance, unstability and reduction of connection reliability is provided. In a terminal electrode part on a reactive matrix substrate, for being connected to an external drive circuit, connecting electrodes are formed by using aluminum or an aluminum alloy, at least their surfaces connected to TCP are covered with an insulating film of aluminum oxide or consisting of a laminate film of aluminum oxide aluminum hydroxide, and the insulating film is selectively removed in a step subsequent to the final step in a cell formation process. In this way, adverse effects of the heat treatment processes such as the annealing in the array formation process and the orientation film sintering of the cell formation process and the oxidization of the connecting electrode surface in the washing.
    • 提供了一种防止端子电极的铝表面氧化的简单方法,增加了耐压接触性,不稳定性和连接可靠性的降低。 在反应性基质基板上的端子电极部分中,为了连接到外部驱动电路,通过使用铝或铝合金形成连接电极,至少其连接到TCP的表面被氧化铝的绝缘膜覆盖,或者由 的氧化铝氢氧化铝的层压膜,并且在细胞形成过程中的最终步骤之后的步骤中选择性地除去绝缘膜。 以这种方式,诸如阵列形成过程中的退火和细胞形成过程的取向膜烧结以及洗涤中连接电极表面的氧化的热处理过程的不利影响。
    • 39. 发明授权
    • Corrective tempering method for rolling elements
    • 滚动元件矫正回火方法
    • US6093268A
    • 2000-07-25
    • US632418
    • 1996-04-24
    • Kiyoshi HirakawaAkitoshi MaedaHiroaki SugiyamaManabu Ohhori
    • Kiyoshi HirakawaAkitoshi MaedaHiroaki SugiyamaManabu Ohhori
    • C21D1/26C21D1/30C21D1/40C21D1/42C21D1/673C21D9/40C21D9/00
    • C21D1/30C21D1/26C21D1/42C21D9/40F16C33/30C21D1/40C21D1/673Y02P10/253Y10S148/906
    • In a corrective tempering method and apparatus for a rolling element in which the thermal deformation of the rolling element is corrected within an extremely short time by utilizing plasticity exhibited during a metallic structure transforming process brought about by low-temperature tempering of the rolling element made of steel, the hardened rolling element is heated and pressured to a maximum temperature within a range of from 250 to 500.degree. C. by a heating device while set in correcting molds to correct the deformation of the rolling element at a degree of working within a range not exceeding an elastic deformation range of the rolling element at a room temperature. The rolling element can be heated also by an induction heating device in addition to a conduction heating device. A product whose inner/outer diameter correcting degree of deformation is 60% or more, dimension standardizing rate is 30% or more, surface roughness is less than Ra 0.2 .mu.m, and surface hardness is HRC 56 or more can be obtained for a correction time within 6 minutes and an induction heating time within 30 seconds.
    • PCT No.PCT / JP95 / 01662 Sec。 371日期:1996年4月24日 102(e)日期1996年4月24日PCT提交1995年8月23日PCT公布。 公开号WO96 / 06194 日本特开1996年2月29日,日本特开2002-1259号公报所述的一种用于滚动元件的矫正回火方法和装置,其中通过利用由低温回火引起的金属结构变形过程中所呈现的可塑性,在极短的时间内对滚动元件的热变形进行校正 由钢制的滚动元件,通过加热装置将硬化的滚动元件加热并加压到250-500℃的最高温度,同时设置在校正模具中以校正滚动元件的变形程度 在不超过滚动体的弹性变形范围的范围内在室温下工作。 除了传导加热装置之外,滚动体也可以通过感应加热装置加热。 其内/外径矫正度为60%以上,尺寸标准化率为30%以上,表面粗糙度小于Ra0.2μm的产品,并且可以获得表面硬度为HRC 56以上的校正 时间在6分钟内,感应加热时间在30秒以内。
    • 40. 发明授权
    • Method of forming multilevel interconnections in a semiconductor
integrated circuit
    • 在半导体集成电路中形成多电平互连的方法
    • US5316975A
    • 1994-05-31
    • US823163
    • 1992-01-21
    • Akitoshi Maeda
    • Akitoshi Maeda
    • H01R4/26H01L21/768H01R13/22H01R33/76H01L21/441H01L21/465
    • H01L21/76877Y10S148/05Y10S438/902Y10S438/906
    • A method is disclosed for producing integrated circuit apparatus in which electroconductive interconnection films are disposed adjacent to each other and have an insulating film sandwiched therebetween. The electroconductive films are electrically connected with each other via a through-hole formed in the insulating film. First, a through-hole is formed in an insulating film so as to extend to the surface of a first electroconductive interconnection film. Then, extraneous materials existing on the surfaces of the insulating film and the electroconductive film exposed in the through-hole are removed by a sputter etching method. Next, an insulating film covering film ("covering film") is formed by a sputtering method on said insulating film by using a material which is the same material that is used for forming a second electroconductive interconnection film. Subsequently, the sputter etching method is used again to remove the covering film. Finally, the second electroconductive interconnection film is formed on the insulating film and makes electrical contact with the first electroconductive film via the through-hole.
    • 公开了一种用于制造集成电路装置的方法,其中导电互连膜彼此相邻设置并且夹在其间的绝缘膜。 导电膜通过形成在绝缘膜中的通孔彼此电连接。 首先,在绝缘膜中形成通孔,以延伸到第一导电互连膜的表面。 然后,通过溅射蚀刻方法除去存在于绝缘膜表面上的外部材料和暴露在通孔中的导电膜。 接下来,通过使用与用于形成第二导电互连膜的材料相同的材料,通过溅射法在所述绝缘膜上形成绝缘膜覆盖膜(“覆盖膜”)。 随后,再次使用溅射蚀刻方法去除覆盖膜。 最后,第二导电互连膜形成在绝缘膜上,并经由通孔与第一导电膜电接触。