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31. 发明授权

US08173759B2 Organopolysilmethylene and a composition comprising the same 有权
标题翻译：有机聚亚甲基及其组合物
公开(公告)号：US08173759B2
公开(公告)日：2012-05-08
申请号：US12861283
申请日：2010-08-23
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04 , C08G77/06
CPC分类号： C08G77/50 , C08G77/12 , C08G77/20 , C08L83/14 , C08L83/00
摘要： The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, a hydroxy group, R3SiCH2— and R3SiO—, wherein R is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, and a hydroxy group, m is an integer of 1 to 100, and n is an integer of 1 to 100, and wherein at least two out of R1's and R's are an alkenyl group.
摘要翻译：本发明提供由以下通式（1）表示的有机聚亚甲硅烷基：其中R 1彼此独立地为选自未取代或取代的碳原子数1〜10的一价烃基，烷氧基，羟基R3SiCH2-和R3SiO-，其中R是彼此独立地选自未取代或取代的具有1-10个碳原子的一价烃基，烷氧基和羟基的基团 m为1〜100的整数，n为1〜100的整数，R 1和R 2中的至少2个为烯基。

32. 发明授权

US08133957B2 Resin composition for encapsulating optical semiconductor element 有权
标题翻译：用于封装光学半导体元件的树脂组合物
公开(公告)号：US08133957B2
公开(公告)日：2012-03-13
申请号：US12510491
申请日：2009-07-28
申请人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Yoshihira Hamamoto , Toshio Shiobara , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08G77/14
CPC分类号： C08G59/306 , C08G59/3254 , C08L83/06
摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).
摘要翻译：一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2）两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

33. 发明申请

US20120007119A1 LIGHT-EMITTING SEMICONDUCTOR DEVICE, MOUNTED SUBSTRATE, AND FABRICATION METHOD THEREOF 有权
标题翻译：发光半导体器件，安装基板及其制造方法
公开(公告)号：US20120007119A1
公开(公告)日：2012-01-12
申请号：US13179200
申请日：2011-07-08
申请人： Toshio SHIOBARA , Tsutomu Kashiwagi
发明人： Toshio SHIOBARA , Tsutomu Kashiwagi
IPC分类号： H01L33/60
CPC分类号： H01L33/44 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/8592 , H01L2933/0025 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector.
摘要翻译：发光半导体器件包括具有引线电极的引线框架，布置有引线框架的反射器和容纳在反射器中的发光半导体芯片，并且具有通过倒装芯片接合方法连接到引线电极的电极，其中：引线框与发光半导体芯片之间的间隙填充有固化的底部填充材料，并且形成厚度为0.05至10μm的固化的氧化硅膜覆盖表面的发光半导体芯片和反射器。

34. 发明授权

US08057906B2 Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device 有权
标题翻译：降低硅橡胶固化产物的表面粘性的方法，用于密封半导体的液体硅橡胶组合物，硅橡胶密封半导体器件以及半导体器件的制造方法
公开(公告)号：US08057906B2
公开(公告)日：2011-11-15
申请号：US11529312
申请日：2006-09-29
申请人： Tsutomu Kashiwagi , Toshio Shiobara , Masanobu Sato , Koki Matsumoto
发明人： Tsutomu Kashiwagi , Toshio Shiobara , Masanobu Sato , Koki Matsumoto
IPC分类号： B32B9/04
CPC分类号： C08J7/047 , C08J2383/04 , C08J2483/00 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/16195 , Y10T428/31663 , H01L2924/00014 , H01L2924/00012
摘要： A method of reducing surface tackiness of a silicone rubber cured product is provided. The method includes coating the surface of a cured product of a curable silicone rubber composition, which has a molar ratio within the composition of hydrogen atoms bonded to silicon atoms relative to alkenyl groups bonded to silicon atoms of 1.0 or greater, and which, following curing, exhibits a type A hardness prescribed in JIS K6253 of no more than 20, with a curable silicone resin layer which, following curing, exhibits a type D hardness prescribed in JIS K6253 of 30 or greater; and subsequently curing the silicone resin to form a cured resin layer with a thickness of no more than 0.5 mm. Adhesion of dirt to the surface can be prevented.
摘要翻译：提供降低硅橡胶固化产物的表面粘性的方法。该方法包括将可固化的硅橡胶组合物的固化产物的表面涂覆，该固化产物的摩尔比在与硅原子键合的氢原子的组成中相对于键合到硅原子的链烯基为1.0或更大，并且其在固化之后表现出JIS K6253规定为不大于20的A型硬度，其中固化后的固化性有机硅树脂层表现出JIS K6253规定的D型硬度为30以上; 然后固化硅树脂以形成厚度不大于0.5mm的固化树脂层。可以防止污垢附着到表面。

35. 发明申请

US20110046319A1 ORGANOPOLYSILMETHYLENE AND A CURED PRODUCT THEREOF 有权
标题翻译：有机聚甲基苯乙烯及其固化产物
公开(公告)号：US20110046319A1
公开(公告)日：2011-02-24
申请号：US12860682
申请日：2010-08-20
申请人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Manabu Ueno , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08L83/06 , C08G77/16
CPC分类号： C08G77/50 , C08G77/16 , C08G77/18 , C08G77/24 , C08L83/14 , Y10T428/31663 , C08L83/00
摘要： The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group and a halogen atom; R2 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom and (R1)3SiCH2—, wherein R3 is, independently of each other, a group selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; and having, in a molecule, at least two out of alkoxy groups, hydroxy groups and halogen atoms bonded to one or more silicon atoms.
摘要翻译：本发明提供由以下通式（1）表示的有机聚亚甲硅烷基：其中R 1彼此独立地为选自除烯基以外的未取代或取代的碳原子数1〜10的一价烃基基团，烷氧基，羟基和卤素原子; R2彼此独立地选自除烯基，烷氧基，羟基，卤素原子以外的未取代或取代的碳原子数1〜10的一价烃基和（R1） 3SiCH 2 - ，其中R 3彼此独立地为选自氢原子和具有1至4个碳原子的烷基的基团; k为1〜100的整数， n为1〜1000的整数。并且在一个分子中具有与一个或多个硅原子键合的烷氧基，羟基和卤素原子中的至少两个。

36. 发明授权

US07858198B2 Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet 有权
标题翻译：含有荧光体的粘合性硅酮组合物，由该组合物形成的组合物片材，以及使用该片材的发光装置的制造方法
公开(公告)号：US07858198B2
公开(公告)日：2010-12-28
申请号：US12078909
申请日：2008-04-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B9/04 , C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.
摘要翻译：提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。荧光体的分散状态随时间保持稳定。在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材仪器。

37. 发明授权

US07283715B2 Optical waveguide forming material and method 有权
标题翻译：光波导形成材料及方法
公开(公告)号：US07283715B2
公开(公告)日：2007-10-16
申请号：US10911686
申请日：2004-08-05
申请人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Kinya Kodama , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： G02B6/10 , G02B6/00
CPC分类号： G02B6/138 , C03C17/30 , G02B1/046 , C08L83/06
摘要： An optical waveguide comprising a substrate, a lower clad layer on the substrate, a core layer and an upper clad layer, at least one of the lower clad layer, the core layer and the upper clad layer is formed of a cured product of a photo-curable organopolysiloxane composition comprising(A) a (meth)acryloyloxy group-containing organopolysiloxane of the following average compositional formula (1): (CH2═CR1COO(CH2)n)a(Ph)bR2c(R3O)dSiO(4-a-b-c-d)/2 (1) wherein R1 is hydrogen or methyl, R2 is an C1–C8 alkyl or C2–C8 alkenyl group, Ph is phenyl, R3 is hydrogen or an unsubstituted or alkoxy-substituted C1–C4 alkyl group, subscripts a, b, c and d are numbers satisfying: 0.05≦a≦0.9, 0.1≦b≦0.9, 0≦c≦0.2, 0
摘要翻译：一种光波导，包括基板，基底上的下覆盖层，芯层和上覆盖层，下包层，芯层和上覆层中的至少一个由照相的固化产物形成可固化的有机基聚硅氧烷组合物，其包含（A）具有以下平均组成式（1）的（甲基）丙烯酰氧基的有机聚硅氧烷：<？在线式描述=“在线式”末端=“铅” CH 2 CO 2（CH 2）n（CH 2）n（CH 2）n（CH 2））（4-abcd）/ 2（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中R 1是氢或甲基 R 2是C 1 -C 8烷基或C 2 -C 8烷基或C 2 -C 8烷基， SUB>烯基，Ph是苯基，R 3是氢或未取代或烷氧基取代的C 1 -C 4烷基，下标 a，b，c和d是麻木的满足：0.05 <= a <= 0.9,0.1 <= b <= 0.9,0 <= c <= 0.2,0

38. 发明授权

US07276562B2 Epoxy-silicone mixed resin composition and light-emitting semiconductor device 有权
标题翻译：环氧硅酮混合树脂组合物和发光半导体装置
公开(公告)号：US07276562B2
公开(公告)日：2007-10-02
申请号：US11116295
申请日：2005-04-28
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/07
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/70 , C08L63/00 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , Y10T428/31511 , Y10T428/31663 , C08L2666/14 , C08L83/00 , C08L2666/02 , H01L2924/00014 , H01L2924/00
摘要： An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index within 10% of that of a cured product of the curable resin composition. It is suitable for use as an encapsulator for light-emitting semiconductors.
摘要翻译：一种环氧硅酮混合树脂组合物，得到透明固化物，其包含[I] 100重量份的含有有机硅化合物和环氧树脂作为必要成分的固化性树脂组合物，[II]将0.1〜50重量份折射率在固化树脂组合物的固化物的折射率的10％以内的有机硅弹性体。适用于发光半导体的封装。

39. 发明申请

US20060264567A1 Lens-forming silicone resin composition and silicone lens 有权
标题翻译：透镜成型硅树脂组合物和硅胶透镜
公开(公告)号：US20060264567A1
公开(公告)日：2006-11-23
申请号：US11437662
申请日：2006-05-22
申请人： Toshio Shiobara , Tsutomu Kashiwagi , Katsuyuki Imazawa
发明人： Toshio Shiobara , Tsutomu Kashiwagi , Katsuyuki Imazawa
IPC分类号： C08L83/04 , C08K5/09
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00
摘要： Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a platinum group metal base catalyst, and (D) a mold release agent cure into colorless, transparent, heat resistant parts which can be smoothly released from the mold and used as lenses in LED devices.
摘要翻译：硅氧烷树脂组合物，其包含（A）含有至少两个脂族不饱和键的有机聚硅氧烷，（B）分子中具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，（C）铂族金属碱催化剂和（D）脱模剂固化成无色，透明，耐热的部件，可以从模具中顺利释放并用作LED器件中的透镜。

40. 发明授权

US06949294B2 Radiation curing silicone rubber composition and adhesive silicone elastomer film 有权
标题翻译：辐射固化硅橡胶组合物和粘性硅橡胶膜
公开(公告)号：US06949294B2
公开(公告)日：2005-09-27
申请号：US10366357
申请日：2003-02-14
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B25/20 , C08K5/54 , C08L83/06 , C08L83/14 , C08F2/46 , C08L83/00
CPC分类号： C08L83/06 , B32B25/20 , C08K5/54 , C08L83/14 , Y10T428/31663 , C08L83/00
摘要： A radiation curing silicone rubber composition is provided. This composition includes as a base polymer either a liquid polysiloxane with a (meth)acryloyl group and a hydrosilyl group, or a combination of a liquid polysiloxane with at least two (meth)acryloyl groups and a liquid polysiloxane with a hydrosilyl group. This composition is formed into a film, and then subjected to radiation curing, thereby producing an adhesive silicone rubber elastomer film with low elasticity, adequate heat resistance, powerful adhesion and good workability. This film is useful for bonding electronic components using methods such as die bonding.
摘要翻译：提供辐射固化硅橡胶组合物。该组合物作为基础聚合物包括具有（甲基）丙烯酰基和氢化硅烷基的液体聚硅氧烷，或具有至少两个（甲基）丙烯酰基的液体聚硅氧烷和具有氢甲硅烷基的液体聚硅氧烷的组合。将该组合物形成膜，然后进行辐射固化，由此制备具有低弹性，足够的耐热性，强大的附着力和良好的可加工性的粘合性硅橡胶弹性体膜。该膜可以使用诸如芯片粘合的方法来接合电子元件。

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