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    • 37. 发明专利
    • PATTERN FORMING METHOD
    • JPH1197334A
    • 1999-04-09
    • JP25959097
    • 1997-09-25
    • HITACHI LTD
    • CHOKAI MINORU
    • G03F7/20H01L21/027
    • PROBLEM TO BE SOLVED: To reduce a period for forming fine element patterns, by a method wherein, via a projection optical system having a modulation step of changing space frequency and a demodulation step of reproducing mask patterns associated with this modulation amount, an optical exposure and an electron beam exposure for projecting in resist and forming patterns are used. SOLUTION: In a final titanium sapphire laser 1 and a second titanium sapphire laser 20, just after the second titanium sapphire laser 20 manufactures demodulating lattice stripes 26 by a main control system 11, the pattern exposing first titanium sapphire laser 1 is set so as to pass the lattice stripes 26. The second lattice stripes 26 are moved in a demodulating thin film 28 by changing continuously a phase of lights in a mirror 24. A first lattice 17 and the second lattice stripes 26 are synchronously scanned while patterns are exposed, so that fine patterns of 0.15 μm, for example, are exposed to a resist 27, and continuously fine patterns of 0.1 μm, for example, are drawn by electron beam drawing.
    • 38. 发明专利
    • PATTERN FORMATION METHOD AND DEVICE
    • JPH10275757A
    • 1998-10-13
    • JP7958197
    • 1997-03-31
    • HITACHI LTD
    • CHOKAI MINORU
    • G03F7/20H01L21/027
    • PROBLEM TO BE SOLVED: To prevent, for example, an optical element and a coating film from being damaged by applying a beam where the pulse width of an excimer laser is longer than a specific value. SOLUTION: A beam where the pulse width of an excimer laser 1 is longer than 100 ns is applied. The oscillation life of the laser itself is extended. For example, the spiker/sustainer vibrating method is known as the method for extending pulses, and a pulse width exceeding 1 μs is achieved. More specifically, the pulse width can be drastically extended without using any additional optical system such as an optical system for splitting an optical path, thus extending the pulse width at least by 100 times as compared with a normal pulse width of 10 ns. Therefore, an energy density per unit time becomes much smaller, namely 1/10 or less, thus preventing an optical element and a coating film from being damaged. The electron density of discharge can be controlled by electron beams for extending life or the plasma cathode ionization method can be utilized.
    • 39. 发明专利
    • ELECTROCHEMICAL LIGHT EMITTING DEVICE
    • JPH08190801A
    • 1996-07-23
    • JP306395
    • 1995-01-12
    • HITACHI LTD
    • CHOKAI MINORU
    • H05B33/26F21K2/08H05B33/12
    • PURPOSE: To provide a new light emitting device by arranging a light emitting medium containing an electrochemical light emitting substance between two confronting electrodes set with a predetermined electrode spacing so as to generate electrochemical light emission efficiently. CONSTITUTION: An inside electrode wiring film 6 whose both ends are composed of an electrode portion 6a and a terminal portion 6b and an outside electrode wiring film 7 composed of partially opened doughnut-like electrode 7a and a terminal portion 7b are formed concentrically on the insulation layer 2 of a board 1. The wiring films 6, 7 are covered by an insulation film 8 so as to expose the electrode portions and the terminal portions thereof, a lid member 18 is arranged on the insulation film 8 via an O ring 16 arranged outside the electrode portion 7a, and the liquid 17 of an electrochemical light emitting substance, such as pyrene or the like is filled in the inside space thereof. Since the shortest time for ions generated at one side electrode to reach the confronting electrode is expressed by t=d /(D: diffusion constant), an electrochemical light emitting efficiency is improved by setting an electrode spacing (d) so that the (t) is less than the mean lifetime of the ions.
    • 40. 发明专利
    • PATTERN FORMING METHOD
    • JPH07220991A
    • 1995-08-18
    • JP813794
    • 1994-01-28
    • HITACHI LTD
    • CHOKAI MINORU
    • G03F7/004G03F7/20H01L21/027
    • PURPOSE:To obtain a high resolution without influence of an uneven part of a base by simultaneously exposing by using a light having a second wavelength with an optical mask generated in a thin film by selective exposure using a light having a first wavelength. CONSTITUTION:N,N'-di-(p-methylphenyl)-theta,theta'-dipyridylium-dimeth ylaniline complex, novolak resin and quinone diazide compound are dissolved in solvent, this solution is filtered by a filter, and resist solution is prepared. A silicon wafer is coated with this resist solution, and dried to manufacture a resist thin film. Then, the wafer is irradiated at a mask pattern with a single pulse of an exposure amount of 50mJ/cm via a mask having a fine pattern by using a contraction projection exposure unit having an excimer laser which has an exposure wavelength of 248nm. Thereafter, after the entire wafer is simultaneously irradiated with 100mJ/cm with an exposure wavelength of 436nm, it is developed with tetramethyl ammonium aqueous solution to remove an exposed part with the light of 436nm.