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    • 37. 发明申请
    • MICRORESONANTOR SYSTEMS AND METHODS OF FABRICATING THE SAME
    • 微波分解系统​​及其制备方法
    • WO2009017770A2
    • 2009-02-05
    • PCT/US2008/009225
    • 2008-07-30
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L. P.TAN, MichaelWANG, Shih-YuanSTEWART, DuncanFATTAL, David
    • TAN, MichaelWANG, Shih-YuanSTEWART, DuncanFATTAL, David
    • H01S3/08H01S3/109
    • H01S5/1075B82Y20/00G02B6/12007H01S5/026H01S5/0424H01S5/1032H01S5/1042H01S5/34306
    • Various embodiments of the present invention are related to microresonator systems and to methods of fabricating the microresonator systems. In one embodiment, a microresonator system (200) comprises a substrate (206) having a top surface layer (204) and at least one waveguide (214,216) embedded in the substrate and positioned adjacent to the top surface layer of the substrate. The microresonator system also includes a microresonator (202,402) having a top layer (218), an intermediate layer (222), a bottom layer (220), a peripheral region, and a peripheral coating (224). The bottom layer (220) of the microresonator is attached to and in electrical communication with the top surface layer (204) of the substrate. The microresonator is positioned so that at least a portion of the peripheral region is located above the at least one waveguide (214, 216). The peripheral coating (224) covers at least a portion of the peripheral surface and has a relatively lower index of refraction than the top, intermediate, and bottom layers of the microresonator.
    • 本发明的各种实施例涉及微谐振器系统和制造微谐振器系统的方法。 在一个实施例中,微谐振器系统(200)包括具有顶表面层(204)的衬底(206)和嵌入衬底中的至少一个波导(214,216),并且邻近衬底的顶表面层定位。 微谐振器系统还包括具有顶层(218),中间层(222),底层(220),周边区域和外围涂层(224)的微谐振器(202,402)。 微谐振器的底层(220)附着到衬底的顶表面层(204)并且与衬底的顶表面层(204)电连通。 微谐振器被定位成使得周边区域的至少一部分位于至少一个波导(214,216)之上。 周边涂层(224)覆盖周边表面的至少一部分并且具有比微谐振器的顶层,中间层和底层更低的折射率。