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31. 发明授权

US08668365B2 Optoelectronic device 有权
标题翻译：光电器件
公开(公告)号：US08668365B2
公开(公告)日：2014-03-11
申请号：US13119342
申请日：2009-09-01
申请人： Peter Brick , Sven Weber-Rabsilber , Michael Zitzlsperger
发明人： Peter Brick , Sven Weber-Rabsilber , Michael Zitzlsperger
IPC分类号： F21V7/00 , F21S8/00
CPC分类号： H01L33/60 , G09F27/008 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic device includes at least one luminescence diode chip which emits electromagnetic radiation during operation of the optoelectronic device, and at least one shield against stray radiation which laterally surrounds the luminescence diode chip only in places, wherein each shield is integral with a component of the optoelectronic device.
摘要翻译：光电子器件包括至少一个发光二极管芯片，其在光电子器件的工作过程中发射电磁辐射，以及至少一个防止杂散辐射的屏蔽物，其仅在某些位置横向包围发光二极管芯片，其中每个屏蔽件与光电器件。

32. 发明申请

US20130240935A1 METHOD FOR PRODUCING A SURFACE-MOUNTABLE SEMICONDUCTOR COMPONENT 有权
标题翻译：生产表面安装半导体元件的方法
公开(公告)号：US20130240935A1
公开(公告)日：2013-09-19
申请号：US13807342
申请日：2011-06-27
申请人： Harald Jäger , Michael Zitzlsperger , Markus Pindl
发明人： Harald Jäger , Michael Zitzlsperger , Markus Pindl
IPC分类号： H01L33/60 , H01L31/0232 , H01L31/18
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
摘要： A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing, the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary earner; and producing individual surface-mountable semiconductor components by severing the molding.
摘要翻译：一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在光电部件和插入件彼此不直接接触的位置处适配地覆盖光电子部件和插入件，并且光电子部件和插入件通过模制机械连接在一起; 移除辅助工具; 并通过切割模制件来生产单个的可表面安装的半导体部件。

33. 发明申请

US20130126935A1 Surface-Mountable Optoelectronic Component and Method for Producing a Surface-Mountable Optoelectronic Component 有权
标题翻译：可表面安装的光电子元件和用于制造可表面安装的光电元件的方法
公开(公告)号：US20130126935A1
公开(公告)日：2013-05-23
申请号：US13702000
申请日：2011-05-25
申请人： Michael Zitzlsperger , Harald Jaeger
发明人： Michael Zitzlsperger , Harald Jaeger
IPC分类号： H01L33/64
CPC分类号： H01L33/62 , H01L24/97 , H01L33/486 , H01L33/54 , H01L33/60 , H01L33/64 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/1715 , H01L2924/181 , H01L2924/18301 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. A molding surrounds the chip carrier at least in places. The chip carrier extends completely through the molding in a vertical direction perpendicular to the radiation passage face.
摘要翻译：表面安装的光电子部件具有辐射通道面，光电子半导体芯片和芯片载体。在芯片载体中形成空腔，并且半导体芯片布置在空腔中。模制品至少在一些地方围绕着芯片载体。芯片载体在垂直于辐射通道面的垂直方向上完全延伸穿过模制件。

34. 发明申请

US20120119250A1 Optoelectronic Semiconductor Component 有权
标题翻译：光电半导体元件
公开(公告)号：US20120119250A1
公开(公告)日：2012-05-17
申请号：US13256213
申请日：2009-12-23
申请人： Michael Zitzlsperger
发明人： Michael Zitzlsperger
IPC分类号： H01L33/48
CPC分类号： H01L31/0203 , H01L33/483 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor component (100) is specified, with a support (1) which has a mounting surface (11) and at least one penetration (3), where the penetration (3) extends from the mounting surface (11) to a bottom surface (12) of the support (1) that lies opposite the mounting surface (11); at least one optoelectronic semiconductor chip (2), which is mounted on the mounting surface (11); a radiation-transparent casting body (5), which surrounds the at least one optoelectronic semiconductor chip (2) at least in places, where the casting body (5) is arranged at least in places in the penetration (3) of the support (1).
摘要翻译：规定光电子半导体部件（100），其具有支撑件（1），所述支撑件（1）具有安装表面（11）和至少一个穿透部（3），其中穿透部件（3）从安装表面（11）延伸到底部所述支撑件（1）的与安装表面（11）相对的表面（12）; 安装在所述安装面（11）上的至少一个光电半导体芯片（2）; 至少在至少一些地方围绕所述至少一个光电半导体芯片（2）的辐射透明铸造体（5），其中所述铸造体（5）至少布置在所述支撑件的穿透（3）中的位置（ 1）。

35. 发明申请

US20120111628A1 Electronic Device 有权
标题翻译：电子设备
公开(公告)号：US20120111628A1
公开(公告)日：2012-05-10
申请号：US13382698
申请日：2010-06-22
申请人： Michael Zitzlsperger , Stefan Groetsch
发明人： Michael Zitzlsperger , Stefan Groetsch
IPC分类号： H05K7/04
CPC分类号： H05K1/181 , H01L31/0203 , H01L33/486 , H01L33/62 , H01L2224/16057 , H01L2224/16105 , H01L2224/48091 , H01L2224/48247 , H05K3/3442 , H05K2201/09181 , H05K2201/10106 , H05K2201/1084 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
摘要： An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.
摘要翻译：电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。基体在其下侧具有连接位置。在基体的顶侧设置有电子部件。基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。第二个地区体现为第一个地区的缩进。第一和第二区域包含不同的材料。

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