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31. 发明授权

US4954301A Transfer molding process and an apparatus for the same 失效
标题翻译：传递成型工艺及其设备
公开(公告)号：US4954301A
公开(公告)日：1990-09-04
申请号：US378505
申请日：1989-07-12
申请人： Junichi Saeki , Aizo Kaneda , Kunihiko Nishi
发明人： Junichi Saeki , Aizo Kaneda , Kunihiko Nishi
IPC分类号： B29C45/02 , B29C45/76 , B29L31/34 , H01L21/00
CPC分类号： H01L21/67126 , B29C45/76 , B29C45/02
摘要： A transfer molding process and an apparatus for carrying out the same for sealing electronic devices, such as semiconductor devices, in a resin by driving a plunger downward in a pot to inject the resin into a mold. In injecting a resin into a mold by driving the plunger downward, the rotary motion of the output shaft of an electric motor is converted into a linear motion to drive the plunger downward, the downward displacement of the plunger from the initial position is detected, and pressure applied to the plunger is varied according to the displacement of the plunger. Thus, the transfer molding process and the apparatus for carrying out the same reduces defects, such as voids and incompletely filled parts, in the resin-sealed device, and prevents burrs and the deformation of the insert during the transfer molding operation.

32. 发明授权

US5110515A Method of encapsulating semiconductor chips 失效
标题翻译：封装半导体晶片的方法
公开(公告)号：US5110515A
公开(公告)日：1992-05-05
申请号：US353256
申请日：1989-05-16
申请人： Shozo Nakamura , Aizo Kaneda , Shigeharu Tsunoda , Akio Hasebe , Masao Mitani
发明人： Shozo Nakamura , Aizo Kaneda , Shigeharu Tsunoda , Akio Hasebe , Masao Mitani
IPC分类号： B29C45/02 , B29C45/14 , B29C45/72 , B29L31/34 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/1468 , B29C45/7207 , H01L21/565 , H01L2924/0002
摘要： A method for manufacturing plastic package for semiconductor according to the present invention comprises the steps of: forming a mold product of plastic package for semiconductor, which contains therein a semiconductor chip, by molding resin by means of a transfer press; heating the mold product to postcure it during transportation from the transfer press to a heating chamber while the mold product is kept by heaters at a temperature higher than a glass transition temperature of the resin for a predetermined period of time; and further heating the mold product in the heating chamber while the mold product is kept at a temperature substantially equal to the glass transition temperature of the resin for another predetermined period of time.
摘要翻译：根据本发明的用于制造半导体用塑料封装件的方法包括以下步骤：通过转印压模成型树脂来形成其中包含半导体芯片的用于半导体的塑料封装的模具产品; 在模具产品通过加热器在高于树脂的玻璃化转变温度的温度下保持预定时间段时，加热模具产品以在从转印压机传送到加热室的过程中将其后固化; 并且在模具产品保持在基本上等于树脂的玻璃化转变温度的温度另外预定时间段的情况下，进一步加热加热室中的模具产品。

33. 发明授权

US5334875A Stacked semiconductor memory device and semiconductor memory module containing the same 失效
标题翻译：堆叠的半导体存储器件和包含其的半导体存储器模块
公开(公告)号：US5334875A
公开(公告)日：1994-08-02
申请号：US1649
申请日：1993-03-02
申请人： Toshio Sugano , Kohji Nagaoka , Seiichiro Tsukui , Yoshiaki Wakashima , Michio Tanimoto , Masayuki Watanabe , Suguru Sakaguchi , Kunihiko Nishi , Aizo Kaneda , Kohji Serizawa , Michiharu Honda , Tohru Yoshida , Takeshi Komaru , Atsushi Nakamura
发明人： Toshio Sugano , Kohji Nagaoka , Seiichiro Tsukui , Yoshiaki Wakashima , Michio Tanimoto , Masayuki Watanabe , Suguru Sakaguchi , Kunihiko Nishi , Aizo Kaneda , Kohji Serizawa , Michiharu Honda , Tohru Yoshida , Takeshi Komaru , Atsushi Nakamura
IPC分类号： G11C5/00 , H01L23/498 , H01L25/065 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H01L23/16
CPC分类号： G11C5/02 , G11C5/00 , G11C5/06 , H01L23/49805 , H01L25/0657 , H01L2224/16 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06579 , H01L2225/06596 , H01L2924/07811 , H01L2924/09701 , H05K1/144 , H05K1/182 , H05K3/3421 , H05K3/363
摘要： There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.
摘要翻译：存在增加需要大容量存储器的器件的面积的趋势，其由半导体存储器占据。这种趋势阻碍了设备尺寸的减小。本发明旨在提供一种能够在最小化安装面积的同时具有高集成度，高密度和大容量的存储器。为了实现这种记忆，现有技术的TAB（磁带自动接合）被安装在导电连接器上，并且由TAB和连接器组成的多个结构被堆叠。此外，将TAB安装在其上的连接器构造成使得堆叠的TAB的独立端子可能不会短路。

34. 发明授权

US5028986A Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices 失效
标题翻译：具有多个堆叠半导体器件的半导体器件和半导体模块
公开(公告)号：US5028986A
公开(公告)日：1991-07-02
申请号：US288955
申请日：1988-12-23
申请人： Toshio Sugano , Kohji Nagaoka , Seiichiro Tsukui , Yoshiaki Wakashima , Michio Tanimoto , Masayuki Watanabe , Suguru Sakaguchi , Kunihiko Nishi , Aizo Kaneda , Kohji Serizawa , Michiharu Honda , Tohru Yoshida , Takeshi Komaru , Atsushi Nakamura
发明人： Toshio Sugano , Kohji Nagaoka , Seiichiro Tsukui , Yoshiaki Wakashima , Michio Tanimoto , Masayuki Watanabe , Suguru Sakaguchi , Kunihiko Nishi , Aizo Kaneda , Kohji Serizawa , Michiharu Honda , Tohru Yoshida , Takeshi Komaru , Atsushi Nakamura
IPC分类号： G11C5/00 , H01L23/498 , H01L25/065 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36
CPC分类号： G11C5/02 , G11C5/00 , G11C5/06 , H01L23/49805 , H01L25/0657 , H01L2224/16 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06579 , H01L2225/06596 , H01L2924/07811 , H01L2924/09701 , H05K1/144 , H05K1/182 , H05K3/3421 , H05K3/363
摘要： There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.
摘要翻译：存在增加需要大容量存储器的器件的面积的趋势，其由半导体存储器占据。这种趋势阻碍了设备尺寸的减小。本发明旨在提供一种能够在最小化安装面积的同时具有高集成度，高密度和大容量的存储器。为了实现这种记忆，现有技术的TAB（磁带自动接合）被安装在导电连接器上，并且由TAB和连接器组成的多个结构被堆叠。此外，将TAB安装在其上的连接器构造成使得堆叠的TAB的独立端子可能不会短路。

35. 发明授权

US4322593A Apparatus for pre-heating resin tablet 失效
标题翻译：树脂片预热装置
公开(公告)号：US4322593A
公开(公告)日：1982-03-30
申请号：US097126
申请日：1979-11-26
申请人： Kunihiko Nishi , Yoshiaki Wakashima , Akira Suzuki , Aizo Kaneda , Sumumu Tuzuku
发明人： Kunihiko Nishi , Yoshiaki Wakashima , Akira Suzuki , Aizo Kaneda , Sumumu Tuzuku
IPC分类号： B29C35/02 , B29B13/02 , B29C45/02 , B29C45/17 , B29K101/10 , G05D24/02 , H05B6/56 , H05B6/50
CPC分类号： B29B13/02 , G05D24/02 , Y10S264/46
摘要： An apparatus for pre-heating resin tablets comprising a resin tablet heater, a switch for setting a reference softening degree and a softening degree detector for the resin tablet. The detector includes a pressure source and a pressure transmitting member coupled to the pressure source and adapted for contact with the resin tablet. The pressure transmitting member is movable a distance representative of the softening degree of the resin tablet being heated due to deformation of the resin tablet.
摘要翻译：一种用于预热树脂片的设备，包括树脂片加热器，用于设定参考软化度的开关和用于树脂片的软化度检测器。检测器包括压力源和连接到压力源并适于与树脂片接触的压力传递构件。压力传递构件可移动一定距离，代表由于树脂片的变形而被加热的树脂片的软化度。

36. 发明授权

US5198888A Semiconductor stacked device 失效
标题翻译：半导体堆叠器件
公开(公告)号：US5198888A
公开(公告)日：1993-03-30
申请号：US631154
申请日：1990-12-20
申请人： Toshio Sugano , Kohji Nagaoka , Seiichiro Tsukui , Yoshiaki Wakashima , Michio Tanimoto , Masayuki Watanabe , Suguru Sakaguchi , Kunihiko Nishi , Aizo Kaneda , Kohji Serizawa , Michiharu Honda , Tohru Yoshida , Takeshi Komaru , Atsushi Nakamura
发明人： Toshio Sugano , Kohji Nagaoka , Seiichiro Tsukui , Yoshiaki Wakashima , Michio Tanimoto , Masayuki Watanabe , Suguru Sakaguchi , Kunihiko Nishi , Aizo Kaneda , Kohji Serizawa , Michiharu Honda , Tohru Yoshida , Takeshi Komaru , Atsushi Nakamura
IPC分类号： G11C5/00 , H01L23/498 , H01L25/065 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36
CPC分类号： G11C5/06 , G11C5/02 , H01L23/49805 , H01L25/0657 , H01L2224/16 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06579 , H01L2225/06596 , H01L2924/07811 , H01L2924/09701 , H05K1/144 , H05K1/182 , H05K3/3421 , H05K3/363
摘要： There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.
摘要翻译：存在增加需要大容量存储器的器件的面积的趋势，其由半导体存储器占据。这种趋势阻碍了设备尺寸的减小。本发明旨在提供一种能够在最小化安装面积的同时具有高集成度，高密度和大容量的存储器。为了实现这种记忆，现有技术的TAB（磁带自动接合）被安装在导电连接器上，并且由TAB和连接器组成的多个结构被堆叠。此外，将TAB安装在其上的连接器构造成使得堆叠的TAB的独立端子可能不会短路。

37. 发明授权

US4426341A Transfer molding method and transfer molding machine 失效
标题翻译：传递成型法和传递成型机
公开(公告)号：US4426341A
公开(公告)日：1984-01-17
申请号：US411759
申请日：1982-08-26
申请人： Susumu Tsuzuku , Aizo Kaneda , Junichi Saeki , Masayoshi Aoki
发明人： Susumu Tsuzuku , Aizo Kaneda , Junichi Saeki , Masayoshi Aoki
IPC分类号： H01L21/56 , B29C43/00 , B29C45/00 , B29C45/02 , B29C45/26 , B29C45/76 , B29C45/77 , B29G3/00
CPC分类号： B29C45/77 , B29C45/02
摘要： A transfer molding machine for filling at least one cavity of a mold with a resin by means of a plunger including a resin pressure sensor for sensing the resin pressure in the mold, and a control device for controlling the pressure applied to the plunger to drive same in such a manner that an arbitrarily selected primary pressure higher than a holding pressure is applied to the plunger to drive same until the pressure of the resin charged into the mold which pressure is detected by the resin pressure sensor in the mold reaches a predetermined pressure level and a secondary pressure corresponding to the holding pressure is applied to the plunger to drive same after the predetermined pressure level has been exceeded by the pressure of the resin being charged into the mold sensed by the resin pressure sensor in the mold, and a warning device that issues a warning when the pressure applied to the plunger to drive has exceeded a predetermined pressure.
摘要翻译：一种用于通过包括用于感测模具中的树脂压力的树脂压力传感器的柱塞的树脂填充模具的至少一个模腔的传送成型机，以及用于控制施加到柱塞以驱动其的压力的控制装置以这样的方式，将高于保持压力的任意选择的一次压力施加到柱塞以驱动，直到被模具中的树脂压力传感器检测到的压力中的树脂的压力达到预定压力水平并且在由模具中的树脂压力传感器感测到的模具中充填的树脂的压力超过预定压力水平之后，将对应于保持压力的次级压力施加到柱塞以驱动其，并且警告装置当施加到柱塞驱动的压力已经超过预定压力时发出警告。

38. 发明授权

US4802831A Fluid machine with resin-coated scroll members 失效
标题翻译：带树脂涂层滚动件的流体机
公开(公告)号：US4802831A
公开(公告)日：1989-02-07
申请号：US37849
申请日：1987-04-13
申请人： Kazutaka Suefuji , Aizo Kaneda , Yasuyuki Kanai , Shozo Nakamura , Tetsuya Arata , Katsuaki Kikuchi , Takao Senshu , Kimiaki Nakakado , Eiji Maeda , Sadatsohi Minakawa
发明人： Kazutaka Suefuji , Aizo Kaneda , Yasuyuki Kanai , Shozo Nakamura , Tetsuya Arata , Katsuaki Kikuchi , Takao Senshu , Kimiaki Nakakado , Eiji Maeda , Sadatsohi Minakawa
IPC分类号： B29C45/14 , B29C70/78 , F01C21/10 , F04C18/02 , F04C18/04 , F04C29/00
CPC分类号： F01C21/104 , B29C45/14 , B29C70/78 , F04C18/0269 , F04C2230/00 , F04C2230/91 , F05B2230/00
摘要： A compressor has stationary and orbiting scroll members formed thereon with spiral wraps engaged with each other to define compression chambers which, when the orbiting scroll member is moved relative to the stationary scroll member, are radially inwardly moved while decreasing their volumes. Each scroll member is composed of a metallic base scroll member having a spiral wrap formed on one side and a coating layer of a resin compound formed on the said side of the scroll member, including the surfaces of the wrap. The coating layer is molded by placing the base scroll member in a mold cavity with a space left between the said side of the base scroll member and a mold part and by injecting the resin compound into the space.
摘要翻译：压缩机具有形成在其上的固定和绕动涡旋构件，螺旋形涡卷彼此接合以限定压缩室，当涡旋构件相对于静涡旋构件移动时，径向向内移动，同时减小其体积。每个涡旋构件由在一侧形成有螺旋形涡卷的金属底座涡旋构件和形成在涡旋构件的所述侧面上的树脂组合物的涂层组成，包括涡卷的表面。通过将基座涡旋构件放置在模具空腔中，将基座涡旋构件的所述侧面和模具部件之间留有空间并将树脂化合物注入空间来模制涂层。

39. 发明授权

US06265782B1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film 有权
标题翻译：半导体器件，半导体芯片安装基板，制造器件和基板的方法，粘合剂和粘合剂双重涂膜
公开(公告)号：US06265782B1
公开(公告)日：2001-07-24
申请号：US09284131
申请日：1999-08-30
申请人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
发明人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , C09J163/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83856 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15159 , H01L2924/15184 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
摘要翻译：本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产处理。

40. 发明授权

US06621170B2 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film 有权
标题翻译：半导体器件，用于安装半导体芯片的基板，其制造方法，粘合剂和双面粘合剂膜
公开(公告)号：US06621170B2
公开(公告)日：2003-09-16
申请号：US09842441
申请日：2001-04-26
申请人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
发明人： Kazunori Yamamoto , Yasushi Shimada , Yasushi Kumashiro , Teiichi Inada , Hiroyuki Kuriya , Aizo Kaneda , Takeo Tomiyama , Yoshihiro Nomura , Yoichi Hosokawa , Hiroshi Kirihara , Akira Kageyama
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , C09J163/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83856 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15159 , H01L2924/15184 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
摘要翻译：本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产处理。

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