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31. 发明申请

WO2008048938A3 MAKING AND USING CARBON NANOTUBE PROBES 审中-公开
标题翻译：制造和使用碳纳米管探针
公开(公告)号：WO2008048938A3
公开(公告)日：2008-09-12
申请号：PCT/US2007081423
申请日：2007-10-15
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , GRITTERS JOHN K , MARTENS RODNEY I , SLOCUM ALEXANDER H , YAGLIOGLU ONNIK
发明人： ELDRIDGE BENJAMIN N , GRITTERS JOHN K , MARTENS RODNEY I , SLOCUM ALEXANDER H , YAGLIOGLU ONNIK
IPC分类号： F16F1/36 , B82B1/00
CPC分类号： G01R1/06716 , G01R1/06744 , G01R1/0675 , G01R1/06755 , G01R3/00 , H01L2924/0002 , Y10T29/49004 , Y10T29/49147 , Y10T29/49204 , H01L2924/00
摘要： Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.
摘要翻译：包括多个垂直排列的碳纳米管的柱可以被配置为机电接触结构或探针。柱可以在牺牲衬底上生长并转移到产物基底，或者可以在产物基底上生长柱。可以处理柱以增强诸如刚度，电性能如导电性和/或物理接触特性的机械性能。柱可以被机械调节以具有预定的弹簧性质。这些列可以用作机电探针，例如用于接触和测试诸如半导体管芯的电子器件，并且这些列可以在电子器件的端子上形成独特的标记。

32. 发明申请

WO2006023741A3 METHOD TO BUILD A WIREBOND PROBE CARD IN A MANY AT A TIME FASHION 审中-公开
标题翻译：一种方便地在时间上构建WIREBOND探针卡的方法
公开(公告)号：WO2006023741A3
公开(公告)日：2007-12-06
申请号：PCT/US2005029581
申请日：2005-08-19
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , BARBARA BRUCE J
发明人： ELDRIDGE BENJAMIN N , BARBARA BRUCE J
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , G01R1/07342 , G01R1/07378 , G01R31/2889 , H01L2224/48091 , H01L2224/49171 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H01L2924/30111 , Y10T29/49121 , Y10T29/49147 , Y10T29/49224 , H01L2924/00014 , H01L2924/00
摘要： Resilient spring contacts (140) for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures (140) are adapted for wire bonding to an electrical circuit on a space transformer substrate (160). The support substrates (150) with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate (160) to improve yield. The resilient spring contacts (140) are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts (140) are epoxied to the support substrate (150) and the release layer removed. The support substrate (150) can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided (152) beneath the spring contacts for improved impedance matching.
摘要翻译：提供了用于晶片测试探测的弹性弹簧触点（140），其可以以非常精细的间距间距制造并且精确地位于支撑基板上。弹性接触结构（140）适于引线接合到空间变换器基板（160）上的电路。具有附接的弹簧触点的支撑基板（150）可以一起大量制造，并在附接到空间变压器基板（160）之前进行切割和测试，以提高产量。弹性弹簧触点（140）使用光刻技术制造，以在将弹簧触点（140）环氧化为支撑衬底（150）并且去除释放层之前在释放层上形成触点。支撑基板（150）可以是透明的，以允许触点的对准和下面的光学部件的测试。支撑衬底可以包括在弹簧触点下面提供（152）的接地平面，用于改善阻抗匹配。

33. 发明申请

WO02075783A8 WAFER LEVEL INTERPOSER 审中-公开
公开(公告)号：WO02075783A8
公开(公告)日：2005-03-17
申请号：PCT/US0207863
申请日：2002-03-13
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , REYNOLDS CARL V
发明人： ELDRIDGE BENJAMIN N , REYNOLDS CARL V
IPC分类号： G01R1/067 , G01R1/073 , H01L23/48
CPC分类号： G01R1/07378 , G01R1/07307 , H01L2924/0002 , H01L2924/00
摘要： Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer (1078) comprises a substrate having a first surface (1082) and a second surface (1086) opposite of said first surface, a first plurality of contact elements (1080) disposed on said first side (1082) of said substrate, and a second plurality of contact elements (1084) disposed on said second surface (1086) of said substrate, wherein said interposer (1078) connects electronic devices (1088, 1090) via said first and said second plurality of contact elements.
摘要翻译：双面插入器组件及其形成和使用方法。在本发明的一个示例中，插入器（1078）包括具有第一表面（1082）和与所述第一表面相对的第二表面（1086）的基板，设置在所述第一侧面上的第一多个接触元件（1080） 1082）和设置在所述基板的所述第二表面（1086）上的第二多个接触元件（1084），其中所述插入件（1078）经由所述第一和第二多个接触元件

34. 发明申请

WO2012006249A2 TESTING TECHNIQUES FOR THROUGH-DEVICE VIAS 审中-公开
标题翻译：通过设备VIAS的测试技术
公开(公告)号：WO2012006249A2
公开(公告)日：2012-01-12
申请号：PCT/US2011042850
申请日：2011-07-01
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： H01L21/66
CPC分类号： G01R31/2884 , G01R31/2889
摘要： Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias.
摘要翻译：用于测试具有穿通设备通孔的电子设备的技术可以包括使用具有探针的探针卡组件，用于接触包括电子设备的穿通设备通孔的端部的电子设备的连接结构。一对探针可以电连接在探针卡组件中，并且因此可以接触并且形成从一个通过装置通孔到另一个通过装置通孔的直接返回回路，一对通过装置通孔与一对穿通装置通孔探针接触。电子设备可以包括用于将测试信号驱动到通过设备通孔中的一个上的测试电路和用于检测通过设备通孔中的另一个上的测试信号的接收器。

35. 发明申请

WO2007102998A3 STACKED GUARD STRUCTURES 审中-公开
标题翻译：堆叠式防护结构
公开(公告)号：WO2007102998A3
公开(公告)日：2008-04-10
申请号：PCT/US2007004668
申请日：2007-02-22
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R31/2889 , H05K1/0216 , H05K1/0298 , H05K2201/093 , H05K2201/09663 , H05K2201/09672
摘要： Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insulating structure disposed between the signal structure and the guard structure. The signal structure, insulating structure, and guard structure can be aligned one with another in the stack.
摘要翻译：公开了一种用于提供具有嵌入堆叠中的保护平面的堆叠的系统和方法。可以通过形成包括导电信号结构，电保护结构和布置在信号结构和保护结构之间的电绝缘结构的堆叠来制造电气设备。信号结构，绝缘结构和防护结构可以在堆叠中彼此对准。

36. 发明申请

WO2006068939A3 REMOTE TEST FACILITY WITH WIRELESS INTERFACE TO LOCAL TEST FACILITIES 审中-公开
标题翻译：远程测试设施与无线接口到本地测试设备
公开(公告)号：WO2006068939A3
公开(公告)日：2006-12-28
申请号：PCT/US2005045611
申请日：2005-12-15
申请人： FORMFACTOR INC , KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N
IPC分类号： G01R31/26 , G01R31/28
CPC分类号： G01R31/2884 , G01R31/3025 , G01R31/31907
摘要： A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.
摘要翻译：中央测试设备将无线测试数据传输到本地测试设备，该设备使用测试数据测试电子设备。本地测试设施将由电子设备生成的无线响应数据发送回中央测试设施，中央测试设施分析响应数据以确定哪些电子设备通过了测试。中央测试设施可以将测试结果提供给其他实体，例如设计电子设备的设计设施或制造电子设备的制造设施。中央测试设施可以接受来自多个本地测试设施中的任何一个的测试资源的请求，调度对应于每个测试请求的测试时间，并且在预定的测试时间，将测试数据无线传输到相应的本地测试设施。

37. 发明申请

WO02064496A3 METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE 审中-公开
标题翻译：在基板上形成微电子弹簧结构的方法
公开(公告)号：WO02064496A3
公开(公告)日：2003-08-14
申请号：PCT/US0203938
申请日：2002-02-06
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , WENZEL STUART W
发明人： ELDRIDGE BENJAMIN N , WENZEL STUART W
IPC分类号： B81C1/00 , B81B3/00 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01H11/04 , H01L21/768 , H01L23/48 , H01L23/482 , H01R13/24 , H05K3/40 , H05K7/10
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , Y10T29/49147 , H01L2924/00
摘要： A layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.
摘要翻译：在衬底上形成牺牲材料层。然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。如果需要，则牺牲层被固化或硬化。弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。然后，牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。在替代方法的初始步骤中，在衬底上提供一层材料。然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。流体被固化或硬化以稳定弯液面的轮廓形状。然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

38. 发明申请

WO2006026733A3 A METHOD OF DESIGNING A PROBE CARD APPARATUS WITH DESIRED COMPLIANCE CHARACTERISTICS 审中-公开
标题翻译：一种设计具有期望符合特性的探针卡设备的方法
公开(公告)号：WO2006026733A3
公开(公告)日：2006-10-26
申请号：PCT/US2005031242
申请日：2005-08-31
申请人： FORMACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： G01R31/02
CPC分类号： G01R1/07364 , G01R1/07378 , G01R3/00 , Y10T29/49117
摘要： A probe card apparatus is configured to have a desired overall amount of compliance. The compliance of the probes of the probe card apparatus is determined, and an additional, predetermined amount of compliance is designed into the probe card apparatus so that the sum of the additional compliance and the compliance of the probes total the overall desired compliance of the probe card apparatus.
摘要翻译：探针卡装置被配置为具有期望的整体柔量。确定探针卡装置的探针的顺从性，并且将额外的预定量顺从性设计到探针卡装置中，使得探针的附加顺应性和顺应性的总和总体上符合探针卡装置。

39. 发明专利

JP2007201471A Method of testing semiconductor product die, and assembly including test die for its test 审中-公开
标题翻译：测试半导体产品的方法和包括测试测试的组件
公开(公告)号：JP2007201471A
公开(公告)日：2007-08-09
申请号：JP2007013166
申请日：2007-01-23
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： ELDRIDGE BENJAMIN N , KHANDROS IGOR Y , PEDERSEN DAVID V , WHITTEN RALPH G
IPC分类号： G01R1/06 , H01L21/66 , G01R1/073 , G01R31/28 , G01R31/3183 , H01L21/822 , H01L23/544 , H01L27/04
CPC分类号： H01L22/34 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a design and a test method that break a linear relationship between a fault detection range or testability and costs of testing or producing a design. SOLUTION: A test assembly 2000 is designed for testing product circuitry of a product die 2011. In one embodiment, the test assembly comprises a test die 2010 and an interconnection substrate 2008 for electrically connecting the test die to a host controller 2002. The test die can be designed according to a design methodology for a test die and a product die that includes a step of concurrently designing test circuitry and product circuitry in a unified design. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供破坏故障检测范围或可测试性与测试或生产设计成本之间的线性关系的设计和测试方法。解决方案：测试组件2000被设计用于测试产品模具2011的产品电路。在一个实施例中，测试组件包括测试模具2010和用于将测试模具电连接到主机控制器2002的互连衬底2008。测试模具可以根据用于测试模具和产品模具的设计方法进行设计，其包括在统一设计中同时设计测试电路和产品电路的步骤。版权所有（C）2007，JPO＆INPIT

40. 发明专利

JP2007132950A Probe card assembly and kit, and method using them 有权
标题翻译：探针卡组件和套件，以及使用它们的方法
公开(公告)号：JP2007132950A
公开(公告)日：2007-05-31
申请号：JP2007000149
申请日：2007-01-04
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： KHANDROS IGOR Y , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： G01R1/073 , B23K1/00 , B23K20/00 , B23K31/02 , C23C18/16 , C25D5/08 , C25D5/16 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/06 , G01R1/067 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/58 , H01L21/60 , H01L21/603 , H01L21/607 , H01L21/66 , H01L21/68 , H01L23/02 , H01L23/12 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R9/00 , H01R12/71 , H01R13/05 , H01R13/24 , H01R29/00 , H01R33/74 , H01R33/76 , H01R107/00 , H05H1/18 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/24 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： PROBLEM TO BE SOLVED: To provide a technique for applying a probe to a semiconductor element capable of an orientation of an edge of a probe element, without altering a position of a probe card. SOLUTION: The probe card assembly comprises an upper surface, a lower surface, and the probe card (electronic component) having a plurality of terminals on the upper surface: the upper surface, the lower surface and an intervention body (electronic component) which has the first plural contact structures with a restoring property extending from the terminals at the lower surface and the second plural contact structures with the restoring property extending from the terminals at the upper surface: the upper surface, the lower surface, an interval converter which has the plural contact pads (terminal) mounted at the lower surface and the third contact structures (probe element) with the restoring property extending from the terminals at the upper surface. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将探针施加到能够探测元件的边缘的取向的半导体元件的技术，而不改变探针卡的位置。解决方案：探针卡组件包括上表面，下表面和在上表面上具有多个端子的探针卡（电子部件）：上表面，下表面和干涉体（电子部件），其具有第一多个接触结构，具有从下表面的端子延伸的恢复特性和具有从上表面的端子延伸的恢复特性的第二多个接触结构：上表面，下表面，间隔转换器其具有安装在下表面的多个接触垫（端子）和具有从上表面的端子延伸的恢复特性的第三接触结构（探针元件）。版权所有（C）2007，JPO＆INPIT

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