专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

WO2010087525A1 CURABLE SILICONE RUBBER COMPOSITION 审中-公开
标题翻译：可固化硅橡胶组合物
公开(公告)号：WO2010087525A1
公开(公告)日：2010-08-05
申请号：PCT/JP2010/051663
申请日：2010-01-29
申请人： DOW CORNING TORAY CO., LTD. , YOSHIDA, Hiroaki , ISHIGAMI, Nozomi , HASEGAWA, Chiichiro , YOSHITAKE, Makoto
发明人： YOSHIDA, Hiroaki , ISHIGAMI, Nozomi , HASEGAWA, Chiichiro , YOSHITAKE, Makoto
IPC分类号： C08L83/04 , C09D183/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C09D183/04 , Y10T428/31663 , C08L83/00
摘要： A curable silicone rubber composition characteristically comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least two alkenyl groups in each molecule and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO?4/2#191 unit, Rｿ1??2#191Rｿ2?SiO?1/2#191 unit, and Rｿ1??3#191SiO?1/2#191 unit wherein Rｿ1? is C1-10 alkyl and Rｿ2? is alkenyl and that contains the alkenyl group in the range from more than 2.5 mass% to not more than 5.0 mass%; (B) an organopolysiloxane that contains the silicon-bonded hydrogen atom; and (C) a hydrosilylation reaction catalyst in a catalytic quantity and provides a cured silicone material that has a hardness is not more than 75 and the elongation is at least 35%. Also, a composite in which the cured silicone material provided by the thermosetting of the curable silicone rubber composition is integrated into a single article with a substrate.
摘要翻译：一种可固化的硅橡胶组合物，其特征在于包含（A）含有烯基的有机聚硅氧烷，其包含（A-1）在每个分子中平均具有至少两个烯基的二烷基聚硅氧烷和（A-2）含烯基的树脂形式包含SiO 4/2＃191单元的有机聚硅氧烷，R 1 1 2 2＃191R 2 2 SiO 1/2＃191单元和R 1 1〜3＃191SiO 1/2＃191单元，其中 R'1？是C 1-10烷基和R 2 是烯基并且含有在大于2.5质量％至不大于5.0质量％范围内的烯基; （B）含有硅键合氢原子的有机聚硅氧烷; 和（C）催化剂的氢化硅烷化反应催化剂，并提供硬度不大于75且伸长率至少为35％的固化的硅氧烷材料。另外，其中通过可固化硅橡胶组合物的热固化提供的固化的硅氧烷材料与基材整合成单个制品的复合材料。

32. 发明申请

WO2009017251A1 CURABLE SILICONE COMPOSITION 审中-公开
标题翻译：可固化硅胶组合物
公开(公告)号：WO2009017251A1
公开(公告)日：2009-02-05
申请号：PCT/JP2008/064080
申请日：2008-07-30
申请人： DOW CORNING TORAY CO., LTD. , HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
发明人： HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
IPC分类号： C08L83/04 , C09D183/04 , C08L83/05 , C08L83/07 , C09D183/05 , C09D183/07
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C09D183/04 , C08L83/00
摘要： A curable silicone composition comprising: an alkenyl-containing organopolysiloxane (A) that contains: a dialkylpolysiloxane (A-1) having on average at least 2 alkenyl groups in one molecule having a 25°C viscosity in the range of 5,000 to 35,000 mPa.s, and a alkenyl-containing organopolysiloxane resin (A-2) consisting of SiO 4/2 units, R 1 2 R 2 SiO 1/2 units, and R 1 3 SiO 1/2 units (where R 1 designates alkyl groups with 1 to 10 carbon atoms, and R 2 designates alkenyl groups) with the content of alkenyl groups ranging from 3.5 to 5.0 mass %, and with the ratio of the sum of the mole numbers of the R 1 2 R 2 SiO 1/2 units and R 1 3 SiO 1/2 units to 1 mole of the SiO 4/2 units in the range from 0.5 to 1.4; an organopolysiloxane (B), wherein silicon-bonded hydrogen atoms are in an amount of at least 0.7 mass %; and a hydrosilylation catalyst (C). The composition is capable of forming a flex-resistant highly transparent cured silicone product with non-tacky surface.
摘要翻译：一种可固化的有机硅组合物，其包含：含有烯基的有机聚硅氧烷（A），其含有：在一分子中平均具有至少2个烯基的二烷基聚硅氧烷（A-1），其粘度在5,000至35,000mPa的范围内。和由SiO 4/2单元组成的含链烯基的有机聚硅氧烷树脂（A-2），R1 2R2SiO1 / 2单元和R1 3SiO1 / 2单元（其中R1表示具有1-10个碳原子的烷基，R2表示链烯基的含量范围为3.5〜5.0质量％，R1R2SiO1 / 2单元和R1 3SiO1 / 2单元的摩尔数与1摩尔SiO 4/2单元的摩尔比之和在0.5至1.4的范围内; 有机聚硅氧烷（B），其中与硅键合的氢原子的量为至少0.7质量％; 和氢化硅烷化催化剂（C）。该组合物能够形成具有非粘性表面的耐挠曲高透明固化硅氧烷产品。

33. 发明申请

WO2007001039A1 CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND OPTICAL PART MOLDED THEREFROM 审中-公开
标题翻译：可固化的有机聚硅氧烷树脂组合物和模制的光学部件
公开(公告)号：WO2007001039A1
公开(公告)日：2007-01-04
申请号：PCT/JP2006/312949
申请日：2006-06-22
申请人： DOW CORNING TORAY CO., LTD. , NAKANISHI, Koji , YOSHITAKE, Makoto , SAGAWA, Takashi , TAKEUCHI, Kasumi , MURAKAMI, Masashi
发明人： NAKANISHI, Koji , YOSHITAKE, Makoto , SAGAWA, Takashi , TAKEUCHI, Kasumi , MURAKAMI, Masashi
IPC分类号： C08L83/04 , G02B1/04
CPC分类号： C08L83/04 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , G02B1/04 , H01L33/56 , H01L2224/48091 , C08L83/00 , H01L2924/00014
摘要： A curable organopolysiloxane resin composition having a viscosity at 25 °C in the range of 0.001 to 5,000 Pa s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80 %; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.
摘要翻译：在25℃下的粘度为0.001〜5000Pa·s，JIS K2501（1992）规定的总酸值在0.0001〜0.2mg / g范围内的可固化的有机聚硅氧烷树脂组合物，固化状态等于或大于80％; 由上述组合物的固化体组成的光学部件。本发明的可固化的有机基聚硅氧烷树脂组合物的特征在于透明性好，当暴露于高温时透射率降低低，当需要时粘合性优异。

34. 发明申请

WO2015034073A1 METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造光学半导体器件和光学半导体器件的方法
公开(公告)号：WO2015034073A1
公开(公告)日：2015-03-12
申请号：PCT/JP2014/073592
申请日：2014-08-29
申请人： DOW CORNING TORAY CO., LTD.
发明人： YAMAZAKI, Ryosuke , YOSHIDA, Shin , YOSHITAKE, Makoto
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2933/0025 , H01L2924/00014 , H01L2924/00012
摘要： The present invention relates to a method of manufacturing an optical semiconductor device comprising a step of sealing an optical semiconductor element using a curable silicone composition, the curable silicone composition, although cured by a hydrosilylation reaction, being hydro silylation reaction catalyst free, or, if containing a hydrosilylation reaction catalyst, a content of the curable silicone composition being insufficient to cure the composition, and the optical semiconductor element being sealed in a state in which the curable silicone composition contacts a cured silicone that contains a hydrosilylation reaction catalyst. According to the present invention, a method of manufacturing an optical semiconductor device of which the sealing agent realizes storage stability, has good heat resistance, and can greatly resist discoloration can be provided; and an optical semiconductor device obtained by the manufacturing method can be provided.
摘要翻译：本发明涉及一种制造光半导体器件的方法，其包括使用可固化硅氧烷组合物密封光学半导体元件的步骤，该可固化硅氧烷组合物尽管通过氢化硅烷化反应固化，是无硅烷化反应催化剂，或如果含有氢化硅烷化反应催化剂，可固化硅氧烷组合物的含量不足以固化组合物，并且光固化性硅氧烷组合物与含有氢化硅烷化反应催化剂的固化的硅氧烷接触的状态下密封光学半导体元件。根据本发明，可以提供密封剂实现储存稳定性，耐热性良好并且能够极大地抵抗变色的光半导体装置的制造方法。并且可以提供通过该制造方法获得的光学半导体器件。

35. 发明申请

WO2014002918A1 REACTIVE SILICONE COMPOSITION, REACTIVE THERMOPLASTIC ARTICLE, CURED PRODUCT, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：反应性硅酮组合物，反应性热塑性制品，固化产品和光学半导体器件
公开(公告)号：WO2014002918A1
公开(公告)日：2014-01-03
申请号：PCT/JP2013/067163
申请日：2013-06-18
申请人： DOW CORNING TORAY CO., LTD.
发明人： YAMAZAKI, Ryosuke , YAMAZAKI, Haruna , YOSHITAKE, Makoto
IPC分类号： C08L83/04 , C08K3/22 , C08K3/36 , H01L33/56
CPC分类号： C08K7/18 , C08G77/12 , C08G77/20 , C08G77/80 , C08K3/22 , C08K3/36 , C08K7/14 , C08K2003/2241 , C08L83/04 , H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： The present invention relates to a reactive silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane represented by the average unit formula; (B) an alkenyl group-containing organopolysiloxane represented by the general formula; (C) a silicon atom-bonded hydrogen atom-containing organopolysiloxane represented by the general formula; (D) a hydrosilylation reaction catalyst; (E) a white pigment; and (F) non-spherical silica, spherical silica or glass fibers, a reactive thermoplastic article obtained by the composition to reaction under specified conditions, a cured product obtained by heating the article, and an optical semiconductor device having the cured product. The reactive silicone composition is a solid at an ordinary temperature and gives a reactive thermoplastic article that is fluidized at elevated temperatures. The reactive thermoplastic article is once fluidized upon heating and then gives a cured product. The cured product exhibits little reduction in mechanical strength or discoloration caused by heat or light and has high light reflectance. And the optical semiconductor device exhibits high luminous efficiency and causes little thermal degradation or photodegradation of a light reflection material.
摘要翻译：本发明涉及一种反应性硅氧烷组合物，其包含：（A）由平均单元式表示的含烯基的有机聚硅氧烷; （B）由通式表示的含烯基的有机聚硅氧烷; （C）由通式表示的与硅原子键合的含氢原子的有机聚硅氧烷; （D）氢化硅烷化反应催化剂; （E）白色颜料; 和（F）非球形二氧化硅，球形二氧化硅或玻璃纤维，通过组合物在特定条件下反应获得的反应性热塑性制品，通过加热制品获得的固化产物和具有固化产物的光学半导体装置。反应性硅氧烷组合物在常温下为固体，得到在升高的温度下流化的活性热塑性制品。反应性热塑性制品在加热后一度流化，然后得到固化产物。固化产物的机械强度或由热或光引起的变色几乎不降低并且具有高的光反射率。并且光学半导体器件表现出高的发光效率，并且导致光反射材料的热降解或光降解很少。

36. 发明申请

WO2013146334A1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化硅酮组合物，其固化产物和光学半导体器件
公开(公告)号：WO2013146334A1
公开(公告)日：2013-10-03
申请号：PCT/JP2013/057337
申请日：2013-03-11
申请人： DOW CORNING TORAY CO., LTD.
发明人： MIYAMOTO, Yusuke , YOSHITAKE, Makoto
IPC分类号： C08L83/04 , H01L23/29
CPC分类号： C09J183/04 , C08G77/045 , C08G77/12 , C08G77/16 , C08G77/20 , C08K5/5425 , C08K5/5435 , C08L83/04 , H01L23/24 , H01L23/296 , H01L23/3107 , H01L33/56 , H01L2224/48091 , H01L2224/73265 , C08L83/00 , H01L2924/00014
摘要： A curable silicone composition comprising: (A) (A 1 ) an organopolysiloxane having at least two alkenyl groups in a molecule and free of silicon-bonded hydroxyl groups or silicon-bonded hydrogen atoms, or a mixture of said component (A 1 ) and (A 2 ) a branched chain organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a diorganodialkoxysilane represented by a general formula; (D) a straight chain organosiloxane oligomer having at least one silicon-bonded hydroxyl group in a molecule and free of silicon-bonded hydrogen atoms; and (E) a hydrosilylation catalyst, can form a cured product which exhibits excellent initial adhesive properties and transparency and exhibits excellent adhesive durability and retention of transparency under conditions of high temperature and high humidity.
摘要翻译：一种可固化的有机硅组合物，其包含：（A）（A1）分子中具有至少两个烯基并且不含与硅键合的羟基或与硅键合的氢原子的有机聚硅氧烷，或所述组分（A1）和（A2 ）由平均单元式表示的支链有机聚硅氧烷; （B）分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）由通式表示的二有机二烷氧基硅烷; （D）在分子中具有至少一个与硅键合的羟基并且不含与硅键合的氢原子的直链有机硅氧烷低聚物; 和（E）氢化硅烷化催化剂，可以形成显示出优异的初始粘合性和透明性的固化产物，并且在高温和高湿度条件下表现出优异的粘合剂耐久性和保持透明性。

37. 发明申请

WO2013115416A1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化硅酮组合物，其固化产物和光学半导体器件
公开(公告)号：WO2013115416A1
公开(公告)日：2013-08-08
申请号：PCT/JP2013/052965
申请日：2013-02-01
申请人： DOW CORNING TORAY CO., LTD.
发明人： YOSHITAKE, Makoto , YAMAZAKI, Ryosuke
IPC分类号： C08L83/04 , H01L33/56 , C08G77/04
CPC分类号： C08L83/14 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/38 , C08G77/70 , C08G77/80 , C08K3/22 , C08K3/36 , C08L83/04 , C08L2205/02 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole% of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole%; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包括：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机聚硅氧烷，其中所有硅原子键合的有机基团的30至60摩尔％为具有2至6个碳原子的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中，该成分中所有与硅原子键合的有机基团中的苯基含量为20〜70摩尔％（E）由平均单元式表示的有机聚硅氧烷; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）除了白色颜料以外的无机填料，具有优异的成型性，能够形成通过热和光几乎不变色和降低机械强度的固化产物，具有高的光反射率，具有优异的尺寸稳定性，并且能够良好用于光学半导体器件的密封剂附着。

38. 发明申请

WO2013047898A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 审中-公开
标题翻译：可固化硅胶组合物及其固化产品
公开(公告)号：WO2013047898A1
公开(公告)日：2013-04-04
申请号：PCT/JP2012/075737
申请日：2012-09-27
申请人： DOW CORNING TORAY CO., LTD. , HIRAI, Kazuo , YOSHITAKE, Makoto
发明人： HIRAI, Kazuo , YOSHITAKE, Makoto
IPC分类号： C08L83/04 , C08L83/10
CPC分类号： C08G77/44 , C08G77/12 , C08G77/20 , C08L83/04 , C08L83/10
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: -(R 1 R 2 SiO) m -, wherein R 1 is a C 1-6 alkyl group or the phenyl group, R 2 is a C 2-10 alkenyl group, and m is a positive number from 5 to 50; (B) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: -(R 3 HSiO) n -, wherein R 3 is a C 1-6 alkyl group or the phenyl group and n is a positive number from 10 to 100; and (C) a hydrosilylation reaction catalyst, cures to form a cured product that has a small thermal expansion coefficient.
摘要翻译：一种可固化有机硅组合物，其包含：（A）至少具有由以下通式表示的直链聚硅氧烷嵌段的有机聚硅氧烷： - （R 1 R 2 SiO）m - ，其中R 1是C 1-6烷基或苯基，R 2是 C2-10烯基，m为5〜50的正数; （B）至少具有由以下通式表示的直链聚硅氧烷嵌段的有机聚硅氧烷： - （R3HSiO）n-，其中R3是C1-6烷基或苯基，n是从10到 100; 和（C）氢化硅烷化反应催化剂，固化形成热膨胀系数小的固化物。

39. 发明申请

WO2012173167A1 CROSS-LINKABLE SILICONE COMPOSITION AND CROSS-LINKED PRODUCT THEREOF 审中-公开
标题翻译：交联硅胶组合物及其交联产品
公开(公告)号：WO2012173167A1
公开(公告)日：2012-12-20
申请号：PCT/JP2012/065181
申请日：2012-06-07
申请人： DOW CORNING TORAY CO., LTD. , YOSHITAKE, Makoto
发明人： YOSHITAKE, Makoto
IPC分类号： C08L83/04
CPC分类号： C08G77/38 , C08G77/12 , C08G77/20 , C08G77/80 , C08L83/04 , C08L83/00
摘要： A cross-linkable silicone composition comprising at least the following components: (A) an organopolysiloxane represented by an average unit formula and containing phenyl and alkenyl groups; (B) an organopolysiloxane represented by a general formula and containing phenyl and alkenyl groups; (C) an organopolysiloxane having in one molecule at least one phenyl group and two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst, can be cross-linked by a hydrosilylation reaction and forms a solid body which has high hardness at room temperature and becomes significantly soft or a liquefied at high temperature.
摘要翻译：一种可交联的有机硅组合物，其至少包含以下组分：（A）由平均单元式表示并含有苯基和烯基的有机聚硅氧烷; （B）由通式表示并含有苯基和烯基的有机聚硅氧烷; （C）在一个分子中具有至少一个苯基和两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂可以通过氢化硅烷化反应进行交联，并形成在室温下具有高硬度并变得显着柔软或在高温下液化的固体。

40. 发明申请

WO2010087523A1 CURABLE SILICONE COMPOSITION THAT PROVIDES A HIGHLY TRANSPARENT CURED SILICONE MATERIAL 审中-公开
标题翻译：提供高度透明的固化硅材料的可固化硅胶组合物
公开(公告)号：WO2010087523A1
公开(公告)日：2010-08-05
申请号：PCT/JP2010/051661
申请日：2010-01-29
申请人： DOW CORNING TORAY CO., LTD. , HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
发明人： HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
IPC分类号： C08L83/04 , C09D183/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C09D183/04 , C08L83/00 , C08K5/56
摘要： A curable silicone composition characteristically comprises (A) (A-1) a dialkylpolysiloxane that has at least two alkenyl groups in each molecule and a viscosity of at least 1,000 mPa•s to not more than 50,000 mPa•s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO 4/2 unit, R 1 R 2 SiO 1/2 unit, and R 1 3 SiO 1/2 unit wherein R 1 is alkyl and R 2 is alkenyl and that contains the alkenyl group in the range from at least 0.5 mass% to less than 3.5 mass%; (B) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst and provides a highly transparent cured silicone material that characteristically has a hardness is in the range from at least 30 to not more than 80, the parallel light transmittance at 25 °C is at least 90%, and the parallel light transmittance at 200 °C is a value that is at least 99% of the parallel light transmittance at 25 °C.
摘要翻译：可固化的有机硅组合物特征在于包含（A）（A-1）在每个分子中具有至少两个烯基的二烷基聚硅氧烷和至少1,000mPa·s至50,000mPa·s以下的粘度和（A-2）包含SiO 4/2单元，R1R2SiO1 / 2单元和R1 3SiO1 / 2单元的含烯基的树脂形式的有机聚硅氧烷，其中R1是烷基，R2是链烯基并且含有至少0.5质量％％至小于3.5质量％; （B）具有至少三个与硅键合的氢原子的有机聚硅氧烷; 和（C）氢化硅烷化反应催化剂，并且提供特征在于硬度在至少30至不大于80的范围内的高度透明的固化的硅氧烷材料，25℃下的平行透光率为至少90％，以及在200℃下的平行透光率是在25℃下的平行光透射率的至少99％的值。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式