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    • 36. 发明授权
    • Methods and software for printing materials onto a substrate
    • 将材料印刷到基材上的方法和软件
    • US08191018B1
    • 2012-05-29
    • US12175423
    • 2008-07-17
    • Steven MolesaErik ScherPatrick SmithMichael Kocsis
    • Steven MolesaErik ScherPatrick SmithMichael Kocsis
    • G06F17/50G06F19/00G06K9/00
    • G06F17/50G06F17/5081H05K3/0005H05K3/12
    • Methods and software for correcting printable circuit layouts. The methods generally including steps of identifying shapes in an input circuit layout, applying a plurality of correction rules to the shapes, and producing an output printed circuit layout in accordance with the identified shapes and the correction rules. The input circuit layout generally comprises a bitmapped image or other description of at least one printable layer of at least one electronic component, device, or die. Embodiments of the present invention further allow for more precise control of spreading and effective coverage of features (e.g., source/drain terminal regions, gates, capacitors, diodes, interconnects, etc.) on a substrate by a printed ink composition including electronic materials.
    • 可打印电路布局校正的方法和软件。 所述方法通常包括以下步骤:识别输入电路布局中的形状,对形状应用多个校正规则,以及根据所识别的形状和校正规则产生输出印刷电路布局。 输入电路布局通常包括至少一个电子部件,器件或管芯的至少一个可印刷层的位图图像或其它描述。 本发明的实施例还允许通过包括电子材料的印刷油墨组合物更精确地控制基底上的特征(例如,源极/漏极端子区域,栅极,电容器,二极管,互连等)的扩展和有效覆盖。