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    • 33. 发明授权
    • Power module and circuit board assembly thereof
    • 电源模块及其电路板组件
    • US08564394B2
    • 2013-10-22
    • US13408631
    • 2012-02-29
    • Han LiGang LiuJing ChenJinfa Zhang
    • Han LiGang LiuJing ChenJinfa Zhang
    • H01F5/00
    • H05K7/1432H01F27/292H01F2027/408H02M3/33592Y02B70/1475
    • A power module mounted on a system board comprises a printed circuit board having an extension part, at least one primary winding coil disposed on a first side of the extension part. The at least one primary winding coil is disposed at a primary side of the power module. The power module further comprises a PCB winding formed on the extension part at a secondary side of the power module, a first magnetic core assembly, and a connector. The first magnetic core assembly comprises a first magnetic part and a second magnetic part. The at least one primary winding coil and the extension part are enclosed between the first magnetic part and the second magnetic part.
    • 安装在系统板上的功率模块包括具有延伸部分的印刷电路板,设置在延伸部分的第一侧上的至少一个初级绕组线圈。 所述至少一个初级绕组线圈设置在所述功率模块的初级侧。 功率模块还包括形成在功率模块的次级侧的延伸部分上的PCB绕组,第一磁芯组件和连接器。 第一磁芯组件包括第一磁性部分和第二磁性部分。 所述至少一个初级绕组线圈和所述延伸部分被封装在所述第一磁性部分和所述第二磁性部分之间。
    • 34. 发明授权
    • Household gateway subsystem and digital household system based on bus
    • 家庭网关子系统和基于母线的数字家庭系统
    • US08335223B2
    • 2012-12-18
    • US12601685
    • 2008-02-29
    • Jianming ZhouJinglei LiuCongxing OuyangHan LiGuanghai Zhang
    • Jianming ZhouJinglei LiuCongxing OuyangHan LiGuanghai Zhang
    • H04L12/28
    • H04L12/2834
    • A household gateway subsystem, the subsystem includes: a host device, for connecting an external network with the interior of the household, and controlling various information appliances in the household based on a digital bus; a user operating device, for communicating with the host device via a digital bus interface, and providing various user operating interfaces and control units. A digital household system is also provided, the system includes: a household gateway subsystem, connected with an external communicating network by IP access; the household gateway subsystem includes: a host device; a user operating device, for communicating with the host device via a digital bus interface; a number of wireless signal transceivers, connected with the host device of the household gateway subsystem.
    • 家庭网关子系统,子系统包括:用于将外部网络与家庭内部连接的主机设备,并且基于数字总线控制家庭中的各种信息设备; 用户操作设备,用于经由数字总线接口与主机设备进行通信,并提供各种用户操作界面和控制单元。 还提供数字家庭系统,该系统包括:家庭网关子系统,通过IP接入与外部通信网络连接; 家庭网关子系统包括:主机设备; 用户操作设备,用于经由数字总线接口与主机设备进行通信; 一些无线信号收发器,与家庭网关子系统的主机设备相连。
    • 35. 发明授权
    • Method to measure the elastic modulus and hardness of thin film on substrate by nanoindentation
    • 通过纳米压痕测量衬底上薄膜的弹性模量和硬度的方法
    • US08265884B2
    • 2012-09-11
    • US12506648
    • 2009-07-21
    • Han LiJoost Vlassak
    • Han LiJoost Vlassak
    • B82Y30/00G01N33/00G01N3/42
    • G01N3/42G01N2203/0075G01N2203/0082G01N2203/0218G01N2203/0282G01N2203/0286
    • A method of measuring the elastic modulus and hardness of a thin film on substrate using nanoindentation technique is provided. The method includes calculating a series of experimental corrected stiffness and contact radius pairs associated with one or more presumed parameters and information obtained from a loading curve associated with the thin film and substrate. Also, the method includes calculating a series of theoretical corrected stiffness and contact radius pairs associated with the same one or more presumed parameters and information obtained from the loading curve associated with the thin film and substrate. Furthermore, the method includes using results obtained from the experimental and theoretical corrected stiffness and contact radius pairs to compute the elastic modulus and hardness of the film material.
    • 提供了使用纳米压痕技术测量衬底上的薄膜的弹性模量和硬度的方法。 该方法包括计算与一个或多个推测参数相关联的一系列实验校正刚度和接触半径对,以及从与薄膜和衬底相关联的负载曲线获得的信息。 此外,该方法还包括计算一系列理论校正刚度和接触半径对,该对数与相关的一个或多个推测参数和从与薄膜和基底相关联的载荷曲线获得的信息相关联。 此外,该方法包括使用从实验和理论校正刚度和接触半径对获得的结果来计算膜材料的弹性模量和硬度。
    • 39. 发明申请
    • POWER MODULE AND CIRCUIT BOARD ASSEMBLY THEREOF
    • 电源模块和电路板组件
    • US20110032683A1
    • 2011-02-10
    • US12851237
    • 2010-08-05
    • Han LiGang LiuJing ChenJinfa Zhang
    • Han LiGang LiuJing ChenJinfa Zhang
    • H05K7/02
    • H05K7/1432H01F27/292H01F2027/408H02M3/33592Y02B70/1475
    • A power module includes a first bobbin, a primary winding coil, a circuit board assembly and a first magnetic core assembly. The primary winding coil is wound around the first bobbin. The circuit board assembly includes a printed circuit board, a second winding structure, at least one current-sensing element, a rectifier circuit and an electrical connector. The second winding structure has an output terminal. The current-sensing element includes a first conductor. The first conductor is a conductive sheet. A first end of the first conductor is in contact with the output terminal of the second winding structure. A second end of the first conductor is connected to the rectifier circuit. The primary winding coil is aligned with the second winding structure of the circuit board assembly and arranged within the first magnetic core assembly. The primary winding coil and the electrical connector are electrically connected with a system board.
    • 功率模块包括第一线圈架,初级绕组线圈,电路板组件和第一磁芯组件。 初级绕组线圈缠绕在第一线轴上。 电路板组件包括印刷电路板,第二绕组结构,至少一个电流感测元件,整流器电路和电连接器。 第二绕组结构具有输出端子。 电流检测元件包括第一导体。 第一导体是导电片。 第一导体的第一端与第二绕组结构的输出端接触。 第一导体的第二端连接到整流电路。 初级绕组线圈与电路板组件的第二绕组结构对准并且布置在第一磁芯组件内。 初级绕组线圈和电连接器与系统板电连接。