专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明专利

JP2005076017A Photocurable resin composition 有权
标题翻译：光固化树脂组合物
公开(公告)号：JP2005076017A
公开(公告)日：2005-03-24
申请号：JP2003312084
申请日：2003-09-04
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： YODA KIMIHIKO , GOTO KEIJI
IPC分类号： C08F290/00
摘要： PROBLEM TO BE SOLVED: To provide a photocurable resin composition having enough high adhesive strength, exhibiting extremely small decrease in the adhesive strength, even when left under a high moisture condition for a long period, and exhibiting small internal stress generated when an adhesive formed out thereof is cured.
SOLUTION: This photocurable resin composition contains a prepolymer, isobornyl methacrylate, an (meth)acrylate monomer expressed by chemical formula, and a photopolymerization initiator as essential components, wherein the prepolymer has such a main chain skeletal structure in its molecule as to be composed of any one of polybutadiene, polyisoprene, and a hydrogenated product thereof, or a mixture thereof, and further has one or more (meth)acryloyl groups at its both ends or side chains.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有足够高的粘合强度的光固化性树脂组合物，即使长时间处于高湿度条件下，粘合强度的降低也非常小，并且当表现出小的内应力时从其形成的粘合剂固化。该光固化性树脂组合物含有预聚物，甲基丙烯酸异冰片酯，以化学式表示的（甲基）丙烯酸酯单体，作为必需成分的光聚合引发剂，其中，分子内具有这样的主链骨架结构，由聚丁二烯，聚异戊二烯及其氢化产物或其混合物中的任一种组成，并且在其两端或侧链还具有一个或多个（甲基）丙烯酰基。版权所有（C）2005，JPO＆NCIPI

32. 发明专利

JP2002265514A CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, CURED OBJECT, AND COMPOSITE MATERIAL 失效
公开(公告)号：JP2002265514A
公开(公告)日：2002-09-18
申请号：JP2001069821
申请日：2001-03-13
申请人： DENKI KAGAKU KOGYO KK
发明人： YODA KIMIHIKO , TAGUCHI KOICHI
IPC分类号： C08F2/44 , C08F4/40 , C08F20/00 , C08F291/02 , C09J4/00
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition which can give a cured object a bonding strength equivalent to that of a thioamide compound. SOLUTION: This composition contains (1) a polymerizable vinyl monomer, (2) a curing agent, and (3) thiadiazoles. The composition may additionally contain (4) an elastomer component. It is desirable that the polymerizable vinyl monomer (1) is a polymerizable (meth)acrylic acid derivative and that the thiadiazole (3) is one having a structure of formula (A) (wherein R1 and R2 are not particularly limited and are each hydrogen, an alkyl, a phenyl, hydroxyl, an amino, mercapto, or the like, provided that they may be the same or different from each other). It may be a two-package in which the first package contains at least the curing agent (2), and the second package contains at least the thiazole (3).

33. 发明专利

JPH11147921A CURED OBJECT, CURABLE RESIN COMPOSITION, ADHESION COMPOSITION, BONDED OBJECT, DOOR STRUCTURE AND BONDING METHOD 失效
公开(公告)号：JPH11147921A
公开(公告)日：1999-06-02
申请号：JP31567797
申请日：1997-11-17
申请人： DENKI KAGAKU KOGYO KK
发明人： YODA KIMIHIKO , FUJITA TAKAYUKI , TAGUCHI KOICHI
IPC分类号： E06B3/72 , C08F290/02 , C09J4/06 , C09J155/00
摘要： PROBLEM TO BE SOLVED: To provide a cured object and a door structure which are free from problems upon thermal cycling and have good creep resistance, and to obtain a curable resin composition, and an adhesive composition. SOLUTION: There are provided a cured object made from a resin composition containing a polymerizable vinyl monomer, a liquid rubber terminated with a reactive double bond, an organic peroxide and a reducing agent and having a storage modulus of 3,000 MPa or below at -40 deg.C and 100 MPa at 23 deg.C and a door structure made of platy glass and a metallic skirt or frame, wherein the bonding is performed by using an adhesive composition comprising the curable resin composition.

34. 发明专利

JPH0931692A STRUCTURE 失效
公开(公告)号：JPH0931692A
公开(公告)日：1997-02-04
申请号：JP18898095
申请日：1995-07-25
申请人： DENKI KAGAKU KOGYO KK
发明人： YODA KIMIHIKO , SOMA HIDEYA , TAKEDA TSUTOMU
IPC分类号： B62D65/00 , B05D1/04 , B05D1/36 , B05D7/14 , C09D5/44 , C09D5/46 , C09J133/00 , C09J133/04 , C25D13/12
摘要： PROBLEM TO BE SOLVED: To obtain a structure joined or filled with an acrylic electrically conductive curable resin compsn. as a structure with the surfaces of the structure and the resin compsn. coated by electro-deposition or electrostatic coating. SOLUTION: This structure is a structure joined or filled with an acrylic electrically conductive curable resin compsn. giving a cured body whose volume resistivity is Ω.cm and the surfaces of the structure and the resin compsn. have been coated by electrodeposition or electrostatic coating. The cured body has 10-70% tensile breaking extension and 1-150kg/mm modulus of tensile elasticity.

35. 发明专利

JP2014152190A Energy ray-curable resin composition 有权
标题翻译：能量可固化树脂组合物
公开(公告)号：JP2014152190A
公开(公告)日：2014-08-25
申请号：JP2013020633
申请日：2013-02-05
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： GOTO KEIJI , YUASA JUNICHI , BUMA JUNICHIRO , YODA KIMIHIKO
IPC分类号： C08F290/06 , C09J4/02 , C09J4/06 , C09J11/04 , C09J11/06 , C09J151/00
摘要： PROBLEM TO BE SOLVED: To provide an energy ray-curable resin composition excellent in a cold-heat cycle resistance.SOLUTION: An energy ray-curable resin composition contains: (A) monofunctional (meth)acrylate which contains (a-1) monofunctional (meth)acrylate having a hydrocarbon group having 6 to 20 carbon atoms, (a-2) hydroxyl group-containing monofunctional (meth)acrylate, and (a-3) monofunctional (meth)acrylate having a carboxyl group or a phosphoric ester group; (B) an oligomer having two or more (meth)acryloyl groups in the molecule; (C) a diene-based core-shell type graft copolymer; and (D) a photo-radical polymerization initiator.
摘要翻译：要解决的问题：提供耐冷热循环阻力优异的能量射线固化性树脂组合物。解决方案：能量射线固化性树脂组合物含有：（A）含有（a-1）单官能（甲基）丙烯酸酯的单官能（甲基）丙烯酸酯具有碳原子数为6〜20的烃基的（甲基）丙烯酸酯，（a-2）含羟基的单官能（甲基）丙烯酸酯，和（a-3）具有羧基或磷酸酯基的单官能（甲基）丙烯酸酯 ; （B）分子中具有两个以上（甲基）丙烯酰基的低聚物; （C）二烯类核 - 壳型接枝共聚物; 和（D）光自由基聚合引发剂。

36. 发明专利

JP2014127392A Resin composition for organic el device, and organic el device 有权
标题翻译：有机EL器件和有机EL器件的树脂组合物
公开(公告)号：JP2014127392A
公开(公告)日：2014-07-07
申请号：JP2012284244
申请日：2012-12-27
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： GOTO KEIJI , HISHA YUKI , HOSHINO TAKAKO , FUKAO KENJI , YODA KIMIHIKO
IPC分类号： H05B33/04 , C08F2/38 , H01L51/50 , H05B33/02
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for an organic EL device, low in viscosity and good in storage stability.SOLUTION: A resin composition for an organic EL device contains: (a) a polyene compound; (b) a polythiol compound having an alkylene oxide group; (c) a polymerization inhibitor of at least one or more of the group consisting of a quinone compound and a nitrosoamine-based compound; and (d) a photopolymerization initiator. The quinone compound included in the (c) is preferably a hydroxynon monomethyl ether or hydroxynon, and the nitrosoamine-based compound included in the (c) is preferably an N-nitrosophenyl hydroxylamine ammonium salt or an N-nitrosophenyl hydroxylamine aluminum salt.
摘要翻译：要解决的问题：提供一种有机EL装置用树脂组合物，粘度低，储存稳定性好。解决方案：有机EL元件用树脂组合物含有：（a）多烯化合物; （b）具有环氧烷基的多硫醇化合物; （c）由醌化合物和亚硝基胺类化合物组成的组中的至少一种或多种的阻聚剂; 和（d）光聚合引发剂。包含在（c）中的醌化合物优选为羟基壬基单醚或羟基壬子，（c）中所含的亚硝基类化合物优选为N-亚硝基苯基羟胺铵盐或N-亚硝基苯基羟胺铝盐。

37. 发明专利

JP2013234208A Resin composition and adhesive 审中-公开
标题翻译：树脂组合物和粘合剂
公开(公告)号：JP2013234208A
公开(公告)日：2013-11-21
申请号：JP2010198245
申请日：2010-09-03
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： HISHA YUKI , YODA KIMIHIKO
IPC分类号： C08F290/00 , C08F220/26 , C08F220/36 , C09J4/02 , C09J11/06 , C09J109/00
CPC分类号： C09J4/06 , C08F290/00 , C08K5/0025 , C08K5/34924 , C08L15/00 , C08F220/10
摘要： PROBLEM TO BE SOLVED: To provide a resin composition that exhibits high adhesive strength and water resistance.SOLUTION: There is provided a resin composition comprising: component (A), which is a (meth)acrylate having one or more (meth)acryloyl groups in molecule terminals or side chains, having one or more main-chain skeletons selected from the group consisting of polybutadienes, polyisoprenes, and hydrogenated products of the previous two, and having a number-average molecular weight of 500-50,000; component (B), which is a di- or tri-(meth)acrylate of 1,3,5-tris(hydroxyalkyl)isocyanuric acid; component (C), which is a (meth)acrylate having a hydroxyl group; component (D), which is a silane coupling agent; and component (E), which is a photopolymerization initiator.
摘要翻译：要解决的问题：提供一种表现出高粘合强度和耐水性的树脂组合物。解决方案：提供一种树脂组合物，其包含：（A）成分是具有一个或多个（甲基）丙烯酰基的（甲基）丙烯酸酯在分子末端或侧链中，具有一个或多个选自前两者的聚丁二烯，聚异戊二烯和氢化产物的主链骨架，数均分子量为500-50,000; 组分（B），它是1,3,5-三（羟基烷基）异氰脲酸的二 - 或三（甲基）丙烯酸酯; （C），其为具有羟基的（甲基）丙烯酸酯; 组分（D），它是硅烷偶联剂; 和作为光聚合引发剂的成分（E）。

38. 发明专利

JP2008101106A Curable composition 有权
标题翻译：可固化组合物
公开(公告)号：JP2008101106A
公开(公告)日：2008-05-01
申请号：JP2006284702
申请日：2006-10-19
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： YODA KIMIHIKO , HISHA YUKI
IPC分类号： C08F290/00 , C09J4/02 , C09J11/00 , C09J109/00
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition which has a high uniform adhesive strength to hard adhesive materials such as liquid crystal polymers, cycloolefin polymers, polyarylates, or polycarbonates, and having good moisture resistance.
SOLUTION: This curable composition comprises (A) a (meth)acrylate having two or more (meth)acryloyl groups at the terminals or side chains of the molecule, comprising one or more selected from the group consisting of polybutadiene, polyisoprene, and a hydrogenation product of polybutadiene or polyisoprene, and having a mol. wt. of 500 to 50,000, (B) a (meth)acrylate having an allyl structure and/or a benzyl group, (C) a (meth)acrylate having a hydroxyl group in the molecule, (D) an antioxidant, and (E) a photoinitiator. Its cured product and jointed product are also provided.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供对硬质粘合剂材料如液晶聚合物，环烯烃聚合物，聚芳酯或聚碳酸酯具有高均匀粘合强度并具有良好耐湿性的固化性树脂组合物。解决方案：该可固化组合物包含（A）在分子的末端或侧链具有两个或多个（甲基）丙烯酰基的（甲基）丙烯酸酯，其包含选自聚丁二烯，聚异戊二烯，和聚丁二烯或聚异戊二烯的氢化产物，重量。（B）具有烯丙基结构和/或苄基的（甲基）丙烯酸酯，（C）分子中具有羟基的（甲基）丙烯酸酯，（D）抗氧化剂，和（E）光引发剂。还提供其固化产品和连接产品。版权所有（C）2008，JPO＆INPIT

39. 发明专利

JP2008101105A Curable composition 审中-公开
标题翻译：可固化组合物
公开(公告)号：JP2008101105A
公开(公告)日：2008-05-01
申请号：JP2006284701
申请日：2006-10-19
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： BUMA JUNICHIRO , YODA KIMIHIKO
IPC分类号： C08F290/00 , C09J4/06
摘要： PROBLEM TO BE SOLVED: To provide a curable composition which has a high adhesive strength to liquid crystal displays and having good moisture resistance, especially to provide a curable composition which has low elasticity, photocurability, and high surface curability. SOLUTION: This curable composition comprises (A) a (meth)acrylate having one or more (meth)acryloyl groups at the terminals or side chains of the molecule, comprising one or more selected from the group consisting of polybutadiene, polyisoprene, and a hydrogenation product of polybutadiene or polyisoprene, and having a mol. wt. of 500 to 50,000, (B) a (meth)acrylate having an allyl structure and having a (meth)acrylate and/or a tetrahydro furfuryl group, (C) an antioxidant, (D) a photoinitiator, and (E) an epoxy-based silane coupling agent. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种对液晶显示器具有高粘合强度并且具有良好耐湿性的可固化组合物，特别是提供一种具有低弹性，光固化性和高表面固化性的可固化组合物。解决方案：该可固化组合物包含（A）在分子的末端或侧链具有一个或多个（甲基）丙烯酰基的（甲基）丙烯酸酯，其包含一种或多种选自聚丁二烯，聚异戊二烯，和聚丁二烯或聚异戊二烯的氢化产物，重量。（B）具有烯丙基结构并具有（甲基）丙烯酸酯和/或四氢糠基的（甲基）丙烯酸酯，（C）抗氧化剂，（D）光引发剂和（E）环氧树脂的硅烷偶联剂。版权所有（C）2008，JPO＆INPIT

40. 发明专利

JP2003212914A ADHESIVE COMPOSITION, CURED PRODUCT, AND COMPOSITE MATERIAL 审中-公开
公开(公告)号：JP2003212914A
公开(公告)日：2003-07-30
申请号：JP2002020105
申请日：2002-01-29
申请人： DENKI KAGAKU KOGYO KK
发明人： YODA KIMIHIKO , SAKURAI TETSUYA , TAGUCHI KOICHI
IPC分类号： C08F2/44 , C08F291/02 , C09J4/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition having a good adhesion balance and a long pot life and being excellent in workability which is the advantage of a two-pack SGA (second generation adhesive). SOLUTION: There are provided a curable resin composition containing a polymerizable vinyl monomer, a curing agent, and trimethylthiourea; a curable resin composition containing an elastomer component in addition to the above components; a curable resin composition as above, wherein the polymerizable vinyl monomer is a polymerizable (meth)acrylic acid derivative; an adhesive composition comprising a curable resin composition as above, wherein the polymerizable vinyl monomer is a polymerizable OH-containing (meth)acrylic acid derivative; a cured product of the adhesive composition; a composite material formed by bonding with the adhesive composition; and a composite wherein the adherends are metals. COPYRIGHT: (C)2003,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式