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    • 34. 发明授权
    • Method and apparatus for individually cooling components of electronic systems
    • 用于单独冷却电子系统部件的方法和装置
    • US06876549B2
    • 2005-04-05
    • US10696999
    • 2003-10-31
    • Abdlmonem H. BeitelmalChandrakant D. Patel
    • Abdlmonem H. BeitelmalChandrakant D. Patel
    • G06F1/20H05K7/20H01L23/34
    • H05K7/20727G06F1/206H05K7/20736H05K7/20836Y02D10/16
    • A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one variable speed fan, e.g., blower, configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller. By substantially controlling the amount of cooling fluid supplied to each of the components based upon the amount of heat generated by each component, the cooling system of the present invention may operate in a more efficient manner, thereby requiring substantially less energy than conventional cooling systems.
    • 冷却系统被配置为向电子系统的发热部件(例如处理器,微控制器,高速显示卡,盘驱动器,半导体器件等)供应单独计量的冷却流体。 冷却系统包括至少一个变速风扇,例如鼓风机,其配置成通过集中式集气室供应流体,此后通过多个喷嘴提供给电子系统的部件。 每个喷嘴都包含一个阀,以控制通过每个喷嘴的流体流量。 提供控制器以控制变速风扇的操作,并且每个阀的操作也由控制器控制。 基于每个部件产生的热量,通过基本上控制供应给每个部件的冷却流体的量,本发明的冷却系统可以以更有效的方式进行操作,从而比传统的冷却系统要求更少的能量。