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31. 发明授权

US07246931B2 LED light source 有权
标题翻译： LED光源
公开(公告)号：US07246931B2
公开(公告)日：2007-07-24
申请号：US11302732
申请日：2005-12-13
申请人： Min-Hsun Hsieh , Chou-Chih Yin , Chia-Liang Hsu , Jen-Shui Wang , Chia-Fen Tsai , Chien-Yuan Wang
发明人： Min-Hsun Hsieh , Chou-Chih Yin , Chia-Liang Hsu , Jen-Shui Wang , Chia-Fen Tsai , Chien-Yuan Wang
IPC分类号： F21V7/04
CPC分类号： F21K9/61 , F21K9/00 , F21Y2115/10
摘要： A tube type light emitting diode light source including a light source generator, a light guide and a diffuser is provided. The light source generator includes LEDs arranging in a line. The light guide has a grooved light incident surface and a grooved light-guiding surface. The grooved light incident surface encompasses the LEDs, and the grooved light-guiding surface is adapted for changing the propagating direction of an incident light. The diffuser covers the light guide.
摘要翻译：提供了包括光源发生器，光导和扩散器的管式发光二极管光源。光源发生器包括排列成一行的LED。光导具有凹槽的光入射表面和带槽的光导表面。带槽的光入射表面包围LED，并且带槽的光导表面适于改变入射光的传播方向。扩散器覆盖光导。

32. 发明授权

US09202983B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US09202983B2
公开(公告)日：2015-12-01
申请号：US13421898
申请日：2012-03-16
申请人： Ching-Huai Ni , Chia-Liang Hsu , Yi-Ming Chen
发明人： Ching-Huai Ni , Chia-Liang Hsu , Yi-Ming Chen
IPC分类号： H01L31/12 , H01L27/32 , H01L33/38 , H01L33/22
CPC分类号： H01L33/382 , H01L33/22 , H01L33/24 , H01L33/30 , H01L33/32 , H01L2933/0016
摘要： A light-emitting device comprises a substrate; a semiconductor stack comprising a first type semiconductor layer, a second type semiconductor layer and an active layer formed between the first type semiconductor layer and the second type semiconductor layer; a bonding layer formed between the substrate and the semiconductor stack; and a plurality of buried electrodes physically buried in the first type semiconductor layer.
摘要翻译：发光装置包括基板; 包括第一类型半导体层，第二类型半导体层和形成在第一类型半导体层和第二类型半导体层之间的有源层的半导体堆叠; 形成在所述基板和所述半导体叠层之间的接合层; 以及物理地埋在第一类型半导体层中的多个埋置电极。

33. 发明申请

US20130201483A1 METHOD AND APPARATUS FOR TESTING LIGHT-EMITTING DEVICE 有权
标题翻译：用于测试发光装置的方法和装置
公开(公告)号：US20130201483A1
公开(公告)日：2013-08-08
申请号：US13365820
申请日：2012-02-03
申请人： Chia-Liang Hsu , Chih-Chiang Lu
发明人： Chia-Liang Hsu , Chih-Chiang Lu
IPC分类号： G01J1/04 , G01J1/42
CPC分类号： G01R31/308 , G01J1/42 , G01J2001/4252 , G01R31/2635 , G01R31/44
摘要： Disclosed is a method for testing a light-emitting device comprising the steps of: providing a light-emitting device comprising a plurality of light-emitting diodes; driving the plurality of the light-emitting diodes with current; generating an image of the light-emitting device; and determining a luminous intensity of each of the light-emitting diodes with the image. An apparatus for testing a light-emitting device comprising a plurality of light-emitting diodes is also disclosed. The apparatus comprises: a current source to provide a current to drive the plurality of the light-emitting diodes; an image receiving device for receiving an image of the light-emitting device in the driven state; and a processing unit for determining a luminous intensity of each of the light-emitting diodes with the image.
摘要翻译：公开了一种用于测试发光器件的方法，包括以下步骤：提供包括多个发光二极管的发光器件; 用电流驱动多个发光二极管; 产生发光装置的图像; 以及用图像确定每个发光二极管的发光强度。还公开了一种用于测试包括多个发光二极管的发光器件的装置。该装置包括：电流源，用于提供驱动多个发光二极管的电流; 图像接收装置，用于接收驱动状态下的发光装置的图像; 以及处理单元，用于利用图像确定每个发光二极管的发光强度。

34. 发明授权

US08395175B2 Light-emitting semiconductor device and package thereof 有权
标题翻译：发光半导体器件及其封装
公开(公告)号：US08395175B2
公开(公告)日：2013-03-12
申请号：US13569612
申请日：2012-08-08
申请人： Chia-Liang Hsu
发明人： Chia-Liang Hsu
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/44 , H01L33/46 , H01L33/60 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： The present application discloses a light-emitting semiconductor device including a transparent layer having an upper surface, a lower surface, and a sidewall; a wavelength conversion structure arranged on the upper surface; an epitaxial structure arranged on the lower surface and having a side surface devoid of the transparent layer and the wavelength conversion structure; and a reflective wall arranged to cover the sidewall.
摘要翻译：本申请公开了一种包括具有上表面，下表面和侧壁的透明层的发光半导体器件; 布置在所述上表面上的波长转换结构; 外延结构，其布置在下表面上并具有不具有透明层和波长转换结构的侧表面; 以及布置成覆盖侧壁的反射壁。

35. 发明申请

US20130003344A1 LIGHT-EMITTING DEVICE PACKAGE 审中-公开
标题翻译：发光装置包装
公开(公告)号：US20130003344A1
公开(公告)日：2013-01-03
申请号：US13614144
申请日：2012-09-13
申请人： Chia-Liang Hsu
发明人： Chia-Liang Hsu
IPC分类号： H01L33/60 , G09F13/04
CPC分类号： H01L25/0753 , G02B6/0025 , G02B6/0031 , G02B6/0073 , H01L33/48 , H01L33/486 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A light-emitting diode device is disclosed. The light-emitting diode device includes a carrier including a platform; a transparent substrate formed on the platform including a first surface; a multi-LED structure including a first light-emitting structure formed on the first surface, the first light-emitting structure including a first first-type semiconductor layer, a first second-type semiconductor layer, and a first active layer formed between the first first-type semiconductor layer and the first second-type semiconductor layer; a second light-emitting structure formed on the first surface, the second light-emitting structure including a second first-type semiconductor layer, a second second-type semiconductor layer, and a second active layer formed between the second first-type semiconductor layer and the second second-type semiconductor layer; and a connecting layer formed between the first light-emitting structure and the second light-emitting structure; wherein an angle between the first surface of the transparent substrate and the platform is not equal to zero.
摘要翻译：公开了一种发光二极管器件。发光二极管装置包括：载体，包括平台; 形成在所述平台上的透明基板，包括第一表面; 包括形成在第一表面上的第一发光结构的多LED结构，所述第一发光结构包括第一第一类型半导体层，第一第二类型半导体层和形成在第一表面之间的第一有源层第一类型半导体层和第一第二类型半导体层; 第二发光结构，形成在第一表面上，第二发光结构包括第二第一类型半导体层，第二第二类型半导体层和形成在第二第一类型半导体层和第二有源层之间的第二有源层，所述第二二次半导体层; 以及形成在所述第一发光结构和所述第二发光结构之间的连接层; 其中所述透明基板的第一表面和所述平台之间的角度不等于零。

36. 发明申请

US20120256164A1 OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF 有权
标题翻译：光电器件及其制造方法
公开(公告)号：US20120256164A1
公开(公告)日：2012-10-11
申请号：US13528059
申请日：2012-06-20
申请人： Shih-I Chen , Chia-Liang Hsu , Tzu-Chieh Hsu , Chun-Yi Wu , Chien-Fu Huang
发明人： Shih-I Chen , Chia-Liang Hsu , Tzu-Chieh Hsu , Chun-Yi Wu , Chien-Fu Huang
IPC分类号： H01L33/06
CPC分类号： H01L33/46 , H01L33/22 , H01L33/42 , H01L33/44
摘要： An optoelectronic device has a substrate and a first window layer on the substrate with a first sheet resistance, a first thickness, and a first impurity concentration. A second window layer has a second sheet resistance, a second thickness, and a second impurity concentration. A semiconductor system is between the first window layer and the second window layer. The second window layer has a semiconductor material different from the semiconductor system, and the second sheet resistance is greater than the first sheet resistance. A method for manufacturing is provided, having the steps of providing a substrate, forming a semiconductor system on the substrate, and forming a window layer on the semiconductor system. The window layer has a semiconductor material different from the semiconductor system. Selectively removing the window layer forms a width difference greater than 1 micron between the window layer and semiconductor system.
摘要翻译：光电器件具有衬底和衬底上的第一窗口层，具有第一薄层电阻，第一厚度和第一杂质浓度。第二窗口层具有第二薄层电阻，第二厚度和第二杂质浓度。半导体系统在第一窗口层和第二窗口层之间。第二窗口层具有与半导体系统不同的半导体材料，第二薄层电阻大于第一薄层电阻。提供一种制造方法，其具有以下步骤：提供衬底，在衬底上形成半导体系统，并在半导体系统上形成窗口层。窗口层具有与半导体系统不同的半导体材料。选择性地去除窗口层在窗口层和半导体系统之间形成大于1微米的宽度差。

37. 发明授权

US08217559B2 Single chip multicolor package 有权
标题翻译：单芯片多色封装
公开(公告)号：US08217559B2
公开(公告)日：2012-07-10
申请号：US12628546
申请日：2009-12-01
申请人： Chia-Liang Hsu
发明人： Chia-Liang Hsu
IPC分类号： H05B33/02 , H05B33/04 , H05B33/14 , H05B33/22
CPC分类号： H01L33/50 , H01L33/46 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014
摘要： An opto-electronic device package structure for multicolor light is disclosed. The package structure comprises a transparent carrier, a circuit layer on the transparent carrier, an opto-electronic device emitting the light of the first wavelength and is electrically connecting with the circuit layer on the transparent carrier, a first wavelength conversion structure on the lateral side of the opto-electronic device, a reflective layer on the first wavelength conversion structure, and a transparent material for package on the reflective layer and on the opto-electronic device.
摘要翻译：公开了一种用于多色光的光电器件封装结构。封装结构包括透明载体，透明载体上的电路层，发射第一波长的光并与透明载体上的电路层电连接的光电器件，在侧面上的第一波长转换结构的光电器件，第一波长转换结构上的反射层，以及用于在反射层和光电器件上封装的透明材料。

38. 外观设计

USD656908S1 Light emitting device 有权
公开(公告)号：USD656908S1
公开(公告)日：2012-04-03
申请号：US29396659
申请日：2011-07-05
申请人： Chia-Liang Hsu , Jhih-Sian Wang , Yi-Ming Chen
设计人： Chia-Liang Hsu , Jhih-Sian Wang , Yi-Ming Chen

39. 发明申请

US20120056229A1 LIGHT EMITTING STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光结构及其制造方法
公开(公告)号：US20120056229A1
公开(公告)日：2012-03-08
申请号：US13227841
申请日：2011-09-08
申请人： Chia-Liang Hsu
发明人： Chia-Liang Hsu
IPC分类号： H01L33/58 , H01L33/50
CPC分类号： H01L33/60 , H01L33/0079 , H01L33/38 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/16 , H01L2933/0033 , H01L2933/0066
摘要： A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second electrode can form a concave on which the semiconductor light-emitting element is located.
摘要翻译：发光结构包括包括第一连接点和第二连接点的半导体发光元件。发光结构还包括电连接到第一连接点的第一电极和与第二连接点电连接的第二电极。第一电极和第二电极可以形成半导体发光元件所在的凹部。

40. 发明授权

US08110845B2 Light-emitting device containing a composite electroplated substrate 有权
标题翻译：含有复合电镀基板的发光装置
公开(公告)号：US08110845B2
公开(公告)日：2012-02-07
申请号：US13181222
申请日：2011-07-12
申请人： Chia-Liang Hsu , Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Fu Huang
发明人： Chia-Liang Hsu , Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Fu Huang
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L33/405 , H01L33/46
摘要： The application is related to a method of forming a substrate of a light-emitting diode by composite electroplating. The application illustrates a light-emitting diode comprising the following elements: a light-emitting epitaxy structure, a reflective layer disposed on the light-emitting epitaxy structure, a seed layer disposed on the reflective layer, a composite electroplating substrate disposed on the seed layer by composite electroplating, and a protection layer disposed on the composite electroplating substrate.
摘要翻译：该应用涉及通过复合电镀形成发光二极管的基板的方法。本发明示出了包括以下元件的发光二极管：发光外延结构，设置在发光外延结构上的反射层，设置在反射层上的种子层，设置在种子层上的复合电镀基板通过复合电镀，以及设置在复合电镀基板上的保护层。

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