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    • 34. 发明授权
    • Automatic system and method for providing PCB layout
    • 自动系统和方法提供PCB布局
    • US07917886B2
    • 2011-03-29
    • US12436764
    • 2009-05-06
    • Yung-Chieh ChenShen-Chun LiHsien-Chuan LiangShou-Kuo Hsu
    • Yung-Chieh ChenShen-Chun LiHsien-Chuan LiangShou-Kuo Hsu
    • G06F17/50
    • G06F17/5068H05K1/0251H05K3/0005H05K3/429
    • An automatic system for providing printed circuit board (PCB) layout of a PCB includes an input device, a data processing device, and a storage device. The data processing device includes an invoking module, a calculating module, and a determining module. The invoking module is to read a name and a thickness of each layer of the PCB from the storage device. The calculating module is to calculate an actual length of a via stub of each layer according to the name and thickness of each layer, and calculate an ideal length of the via stub of the PCB according to input information from the input device, and a preset formula. The determining module is to compare the ideal length and the actual length of the via stub of each layer to determine whether the layer can be used as a high-speed signal layout layer or not.
    • 用于提供PCB的印刷电路板(PCB)布局的自动系统包括输入装置,数据处理装置和存储装置。 数据处理装置包括调用模块,计算模块和确定模块。 调用模块是从存储设备读取PCB的每个层的名称和厚度。 计算模块是根据各层的名称和厚度来计算每一层的通孔短截线的实际长度,并根据输入设备的输入信息计算PCB的通孔短路的理想长度, 式。 确定模块是比较每个层的通孔短路的理想长度和实际长度,以确定该层是否可以用作高速信号布局层。
    • 35. 发明授权
    • Motherboard capable of reducing electromagnetic interference
    • 能够减少电磁干扰的主板
    • US08780536B2
    • 2014-07-15
    • US13275329
    • 2011-10-18
    • Shin-Ting YenYung-Chieh ChenDuen-Yi Ho
    • Shin-Ting YenYung-Chieh ChenDuen-Yi Ho
    • H05K5/00H05K7/00
    • H05K1/0216H05K1/0296H05K1/113H05K2201/10159H05K2201/10189H05K2201/10522
    • A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.
    • 主板包括印刷电路板(PCB),中央处理单元(CPU),调节器,第一存储器适配器和第二存储器适配器。 PCB包括顶表面,底表面,多个第一焊盘和布置在顶表面上的第一引线,以及布置在顶表面和底表面之间的多个第二引线。 PCB限定多个第一通孔,第二通孔和电源通孔。 CPU连接到第一个通孔。 电压调节器连接到电源通孔。 第一个存储器适配器与调节器相邻,并且表面安装焊接到第一个焊盘。 第一焊盘通过第一引线连接到第一通孔。 第二个存储器适配器焊接到第二个通孔。 第二通孔通过第二引线连接到第一通孔。
    • 36. 发明授权
    • Printed circuit board
    • 印刷电路板
    • US08406005B2
    • 2013-03-26
    • US13050954
    • 2011-03-18
    • Hsiao-Yun SuYung-Chieh ChenCheng-Hsien Lee
    • Hsiao-Yun SuYung-Chieh ChenCheng-Hsien Lee
    • H05K7/10H05K7/12
    • H05K1/0245H05K1/0251H05K2201/09718
    • A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component.
    • 印刷电路板包括连接到第一高速差分信号控制芯片的第一和第二传输线,连接到第二高速差分信号控制芯片的第三和第四传输线以及连接到连接器焊盘的第五和第六传输线。 为了使第一高速差分信号控制芯片与连接器焊盘通信,第一传输线通过第一连接部件连接到第五传输线,并且第二传输线通过第二连接部件连接到第六传输线 。 为了使第二速度差分信号控制芯片与连接器焊盘通信,第三传输线通过第一连接部件连接到第五传输线,并且第四传输线通过第二连接部件连接到第六传输线。
    • 37. 发明授权
    • Printed circuit board
    • 印刷电路板
    • US08502617B2
    • 2013-08-06
    • US13015889
    • 2011-01-28
    • Ying-Tso LaiYung-Chieh Chen
    • Ying-Tso LaiYung-Chieh Chen
    • H01P3/08
    • H01P3/026H05K1/0245H05K1/0366H05K2201/029H05K2201/09263
    • A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5.
    • 印刷电路板包括基座,位于基座上的信号层和位于信号层上的多对差分信号迹线。 基座由填充有环氧树脂的玻璃纤维束格栅制成。 每对差分信号迹线包括第一信号迹线和第二信号迹线。 第一和第二信号迹线中的每一个以锯齿形图案延伸。 第一个信号迹线包括多个波峰和波谷。 波峰定义连接第一个信号迹线的所有波峰的参考直线。 每个波峰与参考直线的距离与沿着参考直线的每个波峰与相邻波谷之间的正交距离的比率为1:5。