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31. 发明申请

US20120097985A1 Light Emitting Diode (LED) Package And Method Of Fabrication 审中-公开
标题翻译：发光二极管（LED）封装和制造方法
公开(公告)号：US20120097985A1
公开(公告)日：2012-04-26
申请号：US12909367
申请日：2010-10-21
申请人： Wen-Huang Liu , Chung-Che Dan , Yuan-Hsiao Chang , Hung-Jen Kao , Chen-Fu Chu , Hao-Chun Cheng
发明人： Wen-Huang Liu , Chung-Che Dan , Yuan-Hsiao Chang , Hung-Jen Kao , Chen-Fu Chu , Hao-Chun Cheng
IPC分类号： H01L33/48 , H01L33/52
CPC分类号： H01L33/54 , H01L25/0753 , H01L33/56 , H01L2224/48091 , H01L2224/48464 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) package includes a substrate, a light emitting diode (LED) die mounted to the substrate, a frame on the substrate, a wire bonded to the light emitting diode (LED) die and to the substrate, and a transparent dome configured as a lens encapsulating the light emitting diode (LED) die. A method for fabricating a light emitting diode (LED) package includes the steps of: providing a substrate; forming a frame on the substrate; attaching a light emitting diode (LED) die to the substrate; wire bonding a wire to the light emitting diode (LED) die and to the substrate; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode (LED) die.
摘要翻译：发光二极管（LED）封装包括：衬底，安装到衬底的发光二极管（LED）裸片，衬底上的框架，结合到发光二极管（LED）管芯和衬底的引线，以及透明圆顶被配置为封装发光二极管（LED）裸片的透镜。一种制造发光二极管（LED）封装的方法，包括以下步骤：提供衬底; 在基板上形成框架; 将发光二极管（LED）裸片附接到所述基板; 将导线引线连接到发光二极管（LED）管芯和衬底; 并且在所述框架上分配透明封装材料，所述框架被配置成形成用于封装所述发光二极管（LED）裸片的透明圆顶和透镜。

32. 发明申请

US20110316034A1 Side By Side Light Emitting Diode (LED) Having Separate Electrical And Heat Transfer Paths And Method Of Fabrication 有权
标题翻译：并联发光二极管（LED）具有独立的电热传递路径和制作方法
公开(公告)号：US20110316034A1
公开(公告)日：2011-12-29
申请号：US12824163
申请日：2010-06-26
申请人： Trung Tri Doan , Chen-Fu Chu , Wen-Huang Liu , Feng-Hsu Fan , Hao-Chun Cheng , Fu-Hsien Wang
发明人： Trung Tri Doan , Chen-Fu Chu , Wen-Huang Liu , Feng-Hsu Fan , Hao-Chun Cheng , Fu-Hsien Wang
IPC分类号： H01L33/02 , H01L33/62 , H01L33/64 , H01L33/48
CPC分类号： H01L33/62 , H01L33/641 , H01L2224/73265 , H01L2933/0066
摘要： A light emitting diode includes a thermal conductive substrate having at least one electrical isolation layer configured to provide vertical electrical isolation and a heat transfer path through the substrate from a front side (first side) to a back side (second side) thereof. The light emitting diode includes an anode having a through interconnect, and a cathode having a through interconnect, which are arranged side by side on the substrate. The light emitting diode also includes a LED chip mounted to the substrate between the anode and the cathode. A method for fabricating the light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect.
摘要翻译：发光二极管包括具有至少一个电隔离层的导热基板，该隔离层被配置为提供垂直电隔离和从基板的前侧（第一侧）到其后侧（第二侧）穿过基板的热传递路径。发光二极管包括具有贯通互连的阳极和在基板上并排布置的具有通孔互连的阴极。发光二极管还包括安装在阳极和阴极之间的衬底上的LED芯片。一种制造发光二极管的方法包括以下步骤：提供具有电隔离层的导热衬底，在衬底的第一侧经由衬底并排形成阳极通孔和阴极，形成阳极通过在阴极通孔中通过互连在阳极通孔和阴极之间的互连，通过互连将互连和阴极通过互连将衬底从衬底的第二侧延伸到阳极，并将LED芯片安装到与第一侧电连通的第一侧阴极通过互连和阳极通过互连。

33. 发明授权

US08084780B2 Smart integrated semiconductor light emitting system including light emitting diodes and application specific integrated circuits (ASIC) 有权
标题翻译：智能集成半导体发光系统包括发光二极管和专用集成电路（ASIC）
公开(公告)号：US08084780B2
公开(公告)日：2011-12-27
申请号：US12540523
申请日：2009-08-13
申请人： Trung Tri Doan , Tien Wei Tan , Wen-Huang Liu , Chen-Fu Chu , Yung Wei Chen
发明人： Trung Tri Doan , Tien Wei Tan , Wen-Huang Liu , Chen-Fu Chu , Yung Wei Chen
IPC分类号： H01L33/00
CPC分类号： H05B33/0815 , H01L2224/16225 , H01L2924/12032 , H01L2924/13033 , H01L2924/13091 , H05B33/0842 , Y02B20/341 , H01L2924/00
摘要： A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) on the substrate, and at least one light emitting diode (LED) on the substrate in electrical communication with the application specific integrated circuit (ASIC). The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated system having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.
摘要翻译：发光二极管（LED）系统包括衬底，衬底上的专用集成电路（ASIC）以及与专用集成电路（ASIC）电连接的衬底上的至少一个发光二极管（LED）。发光二极管（LED）系统还可以包括聚合物透镜和用于产生白光的透镜或发光二极管（LED）上的荧光体层。此外，多个发光二极管（LED）可以安装在基板上，并且可以具有用于智能色彩控制照明的不同颜色。衬底和专用集成电路（ASIC）被配置为提供具有智能功能的集成系统。此外，衬底被配置为补充和扩展专用集成电路（ASIC）的功能，并且还可以包括用于执行附加电功能的内置集成电路。

34. 发明授权

US08933467B2 Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC) 有权
标题翻译：包括氮化物基发光二极管（LED）和专用集成电路（ASIC）的智能集成半导体发光系统
公开(公告)号：US08933467B2
公开(公告)日：2015-01-13
申请号：US13309718
申请日：2011-12-02
申请人： Trung Tri Doan , Tien Wei Tan , Wen-Huang Liu , Chen-Fu Chu , Yung Wei Chen
发明人： Trung Tri Doan , Tien Wei Tan , Wen-Huang Liu , Chen-Fu Chu , Yung Wei Chen
IPC分类号： H01L31/12 , H01L25/16
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48464 , H01L2224/73265 , H01L2924/12032 , H01L2924/13033 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC), and at least one light emitting diode (LED) that includes a Group-III nitride based material such as GaN, InGaN, AlGaN, AlInGaN or other (Ga, In or Al) N-based materials. The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated LED circuit having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.
摘要翻译：发光二极管（LED）系统包括衬底，专用集成电路（ASIC）和至少一个发光二极管（LED），其包括III族氮化物基材料，例如GaN，InGaN，AlGaN，AlInGaN或其他（Ga，In或Al）N基材料。发光二极管（LED）系统还可以包括聚合物透镜和用于产生白光的透镜或发光二极管（LED）上的荧光体层。此外，多个发光二极管（LED）可以安装在基板上，并且可以具有用于智能色彩控制照明的不同颜色。衬底和专用集成电路（ASIC）被配置为提供具有智能功能的集成LED电路。此外，衬底被配置为补充和扩展专用集成电路（ASIC）的功能，并且还可以包括用于执行附加电功能的内置集成电路。

35. 发明授权

US08384088B2 Vertical light emitting diode having an outwardly disposed electrode 有权
标题翻译：垂直发光二极管具有向外设置的电极
公开(公告)号：US08384088B2
公开(公告)日：2013-02-26
申请号：US12939984
申请日：2010-11-04
申请人： Chen-Fu Chu , Wen-Huang Liu , Hao-Chun Cheng
发明人： Chen-Fu Chu , Wen-Huang Liu , Hao-Chun Cheng
IPC分类号： H01L33/32
CPC分类号： H01L33/38 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a vertical light emitting diode (VLED) having an outwardly disposed electrode, the vertical light emitting diode comprises a conductive base, a semiconductor epitaxial structure formed on the conductive base, a passivation layer formed at the periphery of the semiconductor epitaxial structure, and a conductive frame formed on the passivation layer and contacting with the edge of the upper surface of the semiconductor epitaxial structure such that the conductive frame is electrically connected to the semiconductor epitaxial structure.
摘要翻译：本发明涉及一种具有向外设置的电极的垂直发光二极管（VLED），垂直发光二极管包括导电基底，形成在导电基底上的半导体外延结构，形成在半导体外延结构周边的钝化层以及形成在钝化层上并与半导体外延结构的上表面的边缘接触的导电框架，使得导电框架电连接到半导体外延结构。

36. 发明申请

US20120091466A1 Smart Integrated Semiconductor Light Emitting System Including Nitride Based Light Emitting Diodes (LED) And Application Specific Integrated Circuits (ASIC) 有权
标题翻译：包括氮化物发光二极管（LED）和专用集成电路（ASIC）的智能集成半导体发光系统
公开(公告)号：US20120091466A1
公开(公告)日：2012-04-19
申请号：US13309718
申请日：2011-12-02
申请人： Trung Tri Doan , Tien Wei Tan , Wen-Huang Liu , Chen-Fu Chu , Yung Wei Chen
发明人： Trung Tri Doan , Tien Wei Tan , Wen-Huang Liu , Chen-Fu Chu , Yung Wei Chen
IPC分类号： H01L33/08 , H01L33/32
CPC分类号： H01L25/167 , H01L2224/48091 , H01L2224/48464 , H01L2224/73265 , H01L2924/12032 , H01L2924/13033 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC), and at least one light emitting diode (LED) that includes a Group-III nitride based material such as GaN, InGaN, AlGaN, AlInGaN or other (Ga, In or Al) N-based materials. The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated LED circuit having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.
摘要翻译：发光二极管（LED）系统包括衬底，专用集成电路（ASIC）和至少一个发光二极管（LED），其包括III族氮化物基材料，例如GaN，InGaN，AlGaN，AlInGaN或其他（Ga，In或Al）N基材料。发光二极管（LED）系统还可以包括聚合物透镜和用于产生白光的透镜或发光二极管（LED）上的荧光体层。此外，多个发光二极管（LED）可以安装在基板上，并且可以具有用于智能色彩控制照明的不同颜色。衬底和专用集成电路（ASIC）被配置为提供具有智能功能的集成LED电路。此外，衬底被配置为补充和扩展专用集成电路（ASIC）的功能，并且还可以包括用于执行附加电功能的内置集成电路。

37. 发明授权

US08614453B2 Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof 失效
标题翻译：芯片型发光器件具有精确涂覆的波长转换层及其封装结构
公开(公告)号：US08614453B2
公开(公告)日：2013-12-24
申请号：US13118336
申请日：2011-05-27
申请人： Wen-Huang Liu , Chung-Che Dan , Yuan-Hsiao Chang , Hung-Jen Kao
发明人： Wen-Huang Liu , Chung-Che Dan , Yuan-Hsiao Chang , Hung-Jen Kao
IPC分类号： H01L33/00
CPC分类号： H01L23/24 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014
摘要： The invention relates to a chip-type light emitting device including one or more light emitting semiconductors and one or more frames provided over a top of the one or more light emitting semiconductors.
摘要翻译：本发明涉及包括一个或多个发光半导体的芯片型发光器件和设置在一个或多个发光半导体的顶部上的一个或多个框架。

38. 发明授权

US08324082B1 Method for fabricating conductive substrates for electronic and optoelectronic devices 有权
标题翻译：制造电子和光电器件导电基板的方法
公开(公告)号：US08324082B1
公开(公告)日：2012-12-04
申请号：US13233070
申请日：2011-09-15
申请人： Wen-Huang Liu , Yung-Wei Chen
发明人： Wen-Huang Liu , Yung-Wei Chen
IPC分类号： H01L21/301 , H01L21/46 , H01L21/78
CPC分类号： H01L33/486 , B33Y80/00 , H01L25/167 , H01L2224/48227 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014
摘要： A method for fabricating a conductive substrate for an electronic device includes the steps of providing a semiconductor substrate; forming a plurality of grooves part way through the semiconductor substrate; filling the grooves with a polymer insulating material to form a plurality of polymer filled grooves; thinning the substrate from the back side to expose the polymer filled grooves; and singulating the semiconductor substrate into a plurality of conductive substrates. An optoelectronic device includes a conductive substrate; a polymer filled groove configured to separate the conductive substrate into a first semiconductor substrate and a second semiconductor substrate; a first front side electrode on the first semiconductor substrate and a second front side electrode on the second semiconductor substrate; and a light emitting diode (LED) chip on the first semiconductor substrate in electrical communication with the first front side electrode and with the second front side electrode.
摘要翻译：一种电子器件用导电性基板的制造方法，其特征在于，具备：半导体基板; 在半导体衬底上形成多个槽; 用聚合物绝缘材料填充凹槽以形成多个聚合物填充凹槽; 从背面使基材变薄，露出聚合物填充的凹槽; 以及将所述半导体衬底分离成多个导电衬底。光电器件包括导电基片; 聚合物填充槽，被配置为将所述导电衬底分离成第一半导体衬底和第二半导体衬底; 第一半导体衬底上的第一前侧电极和第二半导体衬底上的第二前侧电极; 以及与所述第一前侧电极和所述第二前侧电极电连通的所述第一半导体衬底上的发光二极管（LED）芯片。

39. 发明授权

US07771815B2 Molding glass lens and mold thereof 失效
标题翻译：成型玻璃透镜及其模具
公开(公告)号：US07771815B2
公开(公告)日：2010-08-10
申请号：US11892950
申请日：2007-08-28
申请人： San-Woei Shyu , Chia-Wei Wang , Jau-Jan Deng , Wen-Huang Liu , Chien-Min Wu
发明人： San-Woei Shyu , Chia-Wei Wang , Jau-Jan Deng , Wen-Huang Liu , Chien-Min Wu
IPC分类号： B32B3/02 , B32B3/00 , B32B23/02 , G02B3/00 , G02B7/00 , G02B9/00 , G02B11/00
CPC分类号： C03B11/08 , C03B2215/404 , C03B2215/49 , C03B2215/65 , Y10T428/21 , Y10T428/219 , Y10T428/24479 , Y10T428/24488 , Y10T428/24777
摘要： A molding glass lens and a mold thereof are disclosed. The molding glass lens consists of an upper optical surface, a lower optical surface, two outers surrounding the optical surfaces and at least three grooves arranged in the form of a circle disposed on the lower outer and/or the upper outer. The disposition of the grooves has no affecting in original size of the outers as well as assembling with other mechanical parts in les group. The mold of the lens includes an upper molding unit and a lower molding unit. Cavity of each molding unit is composed of a central part for forming an optical surface of the lens and an outer circular part for forming outer of the lens. At least three protrudent parts with the same height are disposed in the form of a circle on the outer circular of the lower molding unit and/or the upper molding unit. Thus the air in the mold cavity is easy to exhaust through the gap formed by protrudent parts and glass preform. Therefore, air bubbles generated during the molding processes are prevented and precision of the glass lens is provided.
摘要翻译：公开了一种成型玻璃透镜及其模具。成型玻璃透镜由上光学表面，下光学表面，围绕光学表面的两个外部和设置在下外部和/或上部外部上的以圆形排列的至少三个凹槽组成。凹槽的布置对外观的原始尺寸以及与les组中的其他机械部件的组装没有影响。透镜的模具包括上模制单元和下模制单元。每个模制单元的腔体由用于形成透镜的光学表面的中心部分和用于形成透镜外部的外部圆形部分组成。具有相同高度的至少三个凸起部分以下部模制单元和/或上部模制单元的外圆周上的圆形形式设置。因此，模腔中的空气容易通过突出部分和玻璃预制件形成的间隙排出。因此，防止了在成型过程中产生的气泡并提供了玻璃透镜的精度。

40. 外观设计

USD620460S1 Light emitting diode device 有权
标题翻译：发光二极管装置
公开(公告)号：USD620460S1
公开(公告)日：2010-07-27
申请号：US29346323
申请日：2009-10-30
申请人： Wen-Huang Liu
设计人： Wen-Huang Liu

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