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    • 33. 发明授权
    • Abrupt junction formation by atomic layer epitaxy of in situ delta doped dopant diffusion barriers
    • 通过原子层外延原位δ掺杂掺杂剂扩散阻挡层的突变结形成
    • US07485536B2
    • 2009-02-03
    • US11326178
    • 2005-12-30
    • Been-Yih JinBrian S. DoyleRobert S. ChauJack T. Kavalieros
    • Been-Yih JinBrian S. DoyleRobert S. ChauJack T. Kavalieros
    • H01L21/335
    • H01L29/0847H01L21/823807H01L21/823814H01L21/823878H01L29/165H01L29/66636H01L29/66795H01L29/7851
    • A method including forming a channel region between source and drain regions in a substrate, the channel region including a first dopant profile; and forming a barrier layer between the channel region and a well of the substrate, the barrier layer including a second dopant profile different from the first dopant profile. An apparatus including a gate electrode on a substrate; source and drain regions formed in the substrate and separated by a channel region; and a barrier layer between a well of the substrate and the channel region, the barrier layer including a dopant profile different than a dopant profile of the channel region and different than a dopant profile of the well. A system including a computing device including a microprocessor, the microprocessor including a plurality of transistor devices formed in a substrate, each of the plurality of transistor devices including a gate electrode on the substrate; source and drain regions formed in the substrate and separated by a channel region; and a barrier layer between a well of the substrate and the channel region.
    • 一种方法,包括在衬底中的源区和漏区之间形成沟道区,所述沟道区包括第一掺杂物分布; 以及在所述沟道区和所述衬底的阱之间形成阻挡层,所述阻挡层包括不同于所述第一掺杂剂分布的第二掺杂剂分布。 一种在基板上包括栅电极的装置; 源极和漏极区域形成在衬底中并被沟道区域分离; 以及在衬底的阱和沟道区之间的阻挡层,阻挡层包括不同于沟道区的掺杂物分布并且不同于阱的掺杂剂分布的掺杂剂分布。 一种包括包括微处理器的计算设备的系统,所述微处理器包括形成在衬底中的多个晶体管器件,所述多个晶体管器件中的每一个在所述衬底上包括栅电极; 源极和漏极区域形成在衬底中并被沟道区域分离; 以及衬底的阱和沟道区之间的阻挡层。
    • 38. 发明申请
    • Tri-gate patterning using dual layer gate stack
    • 使用双层栅极堆叠的三栅极图案化
    • US20090170267A1
    • 2009-07-02
    • US12006047
    • 2007-12-28
    • Uday ShahBrian S. DoyleJack T. KavalierosBeen-Yih Jin
    • Uday ShahBrian S. DoyleJack T. KavalierosBeen-Yih Jin
    • H01L21/336
    • H01L21/823821H01L29/66795H01L29/785
    • In general, in one aspect, a method includes forming an n-diffusion fin and a p-diffusion fin in a semiconductor substrate. A high dielectric constant layer is formed over the substrate. A first work function metal layer is created over the n-diffusion fin and a second work function metal layer, thicker than the first, is created over the n-diffusion fin. A silicon germanium layer is formed over the first and second work function metal layers. A ploysilicon layer is formed over the silicon germanium layer and is polished. The ploysilicon layer over the first work function metal layer is thicker than the ploysilicon layer over the second work function metal layer. A hard mask is patterned and used to etch the ploysilicon layer and the silicon germanium layer to create gate stacks. The etch rate of the silicon germanium layer is faster over the first work function metal layer.
    • 通常,在一个方面,一种方法包括在半导体衬底中形成n扩散鳍和p扩散鳍。 在衬底上形成高介电常数层。 在n扩散翅片上形成第一功函数金属层,并在n扩散鳍片上形成比第一功函数金属层厚的第二功函数金属层。 在第一和第二功函数金属层上形成硅锗层。 在硅锗层上方形成硅层,并进行抛光。 第一功函数金属层上的多晶硅层比第二功函数金属层上的多晶硅层厚。 硬掩模被图案化并用于蚀刻合金层和硅锗层以产生栅极堆叠。 硅锗层的蚀刻速率比第一功函数金属层更快。