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    • 39. 发明授权
    • Reduced silicon gouging and common source line resistance in semiconductor devices
    • 在半导体器件中减少硅沟槽和普通源极线电阻
    • US06953752B1
    • 2005-10-11
    • US10358756
    • 2003-02-05
    • Yue-Song HeSameer HaddadZhi-Gang WangRichard Fastow
    • Yue-Song HeSameer HaddadZhi-Gang WangRichard Fastow
    • H01L21/311H01L21/8247
    • H01L27/11521
    • In the present method of undertaking a self aligned source etch of a semiconductor structure, a substrate has oxide thereon. First and second adjacent stacked gate structures are provided on the substrate. Oxide spacers are provided on the respective first and second adjacent sides of the first and second gate stacked structures, and polysilicon spacers are provided on the respective oxide spacers. A self aligned source etch is undertaken using the gate structures, oxide spacers, and polysilicon spacers as a mask. The polysilicon spacers are then removed, and metal, for example cobalt, is provided on the substrate, using the oxide spacers as a mask. A silicidation step is undertaken to form metal silicide common source line on the substrate.
    • 在进行半导体结构的自对准源蚀刻的本方法中,衬底在其上具有氧化物。 第一和第二相邻的堆叠栅极结构设置在基板上。 在第一和第二栅极堆叠结构的相应的第一和第二相邻侧上设置氧化物间隔物,并且在各个氧化物间隔物上设置多晶硅间隔物。 使用栅极结构,氧化物间隔物和多晶硅间隔物作为掩模进行自对准源蚀刻。 然后去除多晶硅间隔物,并且使用氧化物间隔物作为掩模在衬底上提供金属(例如钴)。 进行硅化步骤以在衬底上形成金属硅化物共同源极线。
    • 40. 发明申请
    • Memory cell array with staggered local inter-connect structure
    • 具有交错局部互连结构的存储单元阵列
    • US20050077567A1
    • 2005-04-14
    • US10685044
    • 2003-10-14
    • Mark RandolphSameer HaddadTimothy ThurgateRichard Fastow
    • Mark RandolphSameer HaddadTimothy ThurgateRichard Fastow
    • G11C16/04H01L21/8246H01L21/8247H01L27/115H01L29/788
    • H01L27/11568G11C16/0483H01L27/115H01L27/11521
    • A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.
    • 存储单元阵列包括在半导体衬底上制造的存储器单元的二维阵列。 存储单元布置成多行和多列。 每列存储单元包括多个交替沟道区和源极/漏极区。 导电互连位于每个源极/漏极区域上方并且仅耦合到另一个源极/漏极区域。 另一个源/漏区位于与该列相邻的第二列中。 导电互连被定位成使得每隔一个导电布线连接到列的右侧的相邻列,并且每隔一个导电布线连接到列的左侧的相邻列。 多个源极/漏极控制线在相邻列的存储器单元之间延伸,并且电耦合到在相邻列之间耦合的每个导电互连。