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31. 发明申请

US20100094320A1 Atherectomy and Thrombectomy Devices, Methods for Making, and Procedures for Using 审中-公开
标题翻译：动脉粥样硬化切除术和血栓切除术装置，制造方法和使用程序
公开(公告)号：US20100094320A1
公开(公告)日：2010-04-15
申请号：US12614006
申请日：2009-11-06
申请人： Vacit Arat , Richard T. Cohen , Ming Ting Wu , Pavel B. Lembrikov , Adam L. Cohen
发明人： Vacit Arat , Richard T. Cohen , Ming Ting Wu , Pavel B. Lembrikov , Adam L. Cohen
IPC分类号： A61B17/22
CPC分类号： A61B17/320725 , A61B17/320758 , A61B2017/003 , A61B2017/22071 , A61B2017/320004 , A61B2017/320008
摘要： Embodiments are directed to devices for removing material from interior walls of vessels such as during atherectomy or thrombectomy procedures where the devices includes an ablation tool and at least one ablation tool stabilizer that can be used to radially position the ablation tool at desired locations within a vessel. In some embodiments, the ablation tool may a rotary cutting element that has an axis of rotation that is approximately parallel to the local axis of a vessel to be cleared. In some embodiments, the ablation tool may have a single side and or a top that allows clearing of material and which is capable of both radial positioning and rotational positioning via the stabilization device or devices and which may also be capable of axial motion via the stabilization device.
摘要翻译：实施例涉及用于从血管内壁移除材料的装置，例如在动脉粥样硬化切除术或血栓切除术过程期间，其中装置包括消融工具和至少一个消融工具稳定器，其可用于将消融工具径向定位在容器内的期望位置处。在一些实施例中，消融工具可以具有旋转切割元件，旋转切割元件具有大致平行于待清除的容器的局部轴线的旋转轴线。在一些实施例中，消融工具可以具有允许清除材料并且能够经由稳定装置或装置进行径向定位和旋转定位的单侧和/或顶部，并且还可以通过稳定性轴向运动设备。

32. 发明申请

US20080211524A1 Electrochemically Fabricated Microprobes 审中-公开
标题翻译：电化学制造的微波
公开(公告)号：US20080211524A1
公开(公告)日：2008-09-04
申请号：US11928868
申请日：2007-10-30
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
IPC分类号： G01R1/073
CPC分类号： A61N1/00 , C25D1/00 , C25D1/003
摘要： Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
摘要翻译：用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。在一些实施例中，提供了多个探针的阵列。

33. 发明申请

US20130226209A1 MINIATURE SHREDDING TOOL FOR USE IN MEDICAL APPLICATIONS AND METHODS FOR MAKING 审中-公开
标题翻译：用于医疗应用的微型工具和制造方法
公开(公告)号：US20130226209A1
公开(公告)日：2013-08-29
申请号：US13859520
申请日：2013-04-09
申请人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen , Pierre E. Dupont , Pedro J. Del Nido , Nikolay V. Vasilyev
发明人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen , Pierre E. Dupont , Pedro J. Del Nido , Nikolay V. Vasilyev
IPC分类号： A61B17/14
CPC分类号： A61B17/14 , A61B10/02 , A61B17/1671 , A61B17/221 , A61B17/32002 , A61B17/320725 , A61B17/320758 , A61B90/361 , A61B2017/003 , A61B2017/00327 , A61B2017/00526 , A61B2017/00539 , A61B2017/00553 , A61B2017/2212 , A61B2017/2215 , A61B2017/320048 , A61B2017/320064 , A61B2017/320775
摘要： The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices include tissue anchoring projections, improved blade configurations, and/or shields or shrouds around the cutting blades to inhibit outflow of tissue that has been brought into the device.
摘要翻译：本发明一般涉及微尺度或毫米级装置的领域，以及使用多层多材料电化学制造方法来制造这种装置，具体实施方案涉及粉碎装置，更具体地说涉及用于医疗应用。在一些实施例中，组织去除装置包括围绕切割刀片的组织锚定突起，改进的刀片构造和/或屏蔽件或护罩，以抑制已经进入装置的组织的流出。

34. 发明授权

US08512578B2 Multi-step release method for electrochemically fabricated structures 有权
标题翻译：电化学制造结构的多步释放方法
公开(公告)号：US08512578B2
公开(公告)日：2013-08-20
申请号：US12892734
申请日：2010-09-28
申请人： Adam L. Cohen , Michael S. Lockard , Dale S. McPherson
发明人： Adam L. Cohen , Michael S. Lockard , Dale S. McPherson
IPC分类号： C25D5/02 , B81C1/00
CPC分类号： C23C18/1689 , B33Y10/00 , B81C1/0019 , C23C18/1605 , C23C18/1651 , C25D1/003 , G03F7/00
摘要： Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.
摘要翻译：多层结构由至少一种结构材料（例如镍）进行电化学制造，其被构造成限定期望的结构并且可以附着到基底上，并且由至少一种围绕期望的材料的牺牲材料（例如铜）结构体。在结构形成之后，通过多级蚀刻操作去除牺牲材料。在一些实施例中，待移除的牺牲材料可以位于基底上或附加部件内的通道等内。多级蚀刻操作可以通过中间后处理活动来分离，它们可以通过清洁操作或阻隔材料去除操作等分开。障碍物可以通过与结构材料或基底接触而固定就位，或者它们可以通过牺牲材料单独固定在适当位置，并且因此在所有保留牺牲材料被蚀刻之后可以被自由地去除。

35. 发明授权

US08475458B2 Miniature shredding tool for use in medical applications and methods for making 有权
公开(公告)号：US08475458B2
公开(公告)日：2013-07-02
申请号：US12490301
申请日：2009-06-23
申请人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen , Ming Ting Wu , Gregory P. Schmitz , Eric C. Miller
发明人： Michael S. Lockard , Uri Frodis , Adam L. Cohen , Richard T. Chen , Ming Ting Wu , Gregory P. Schmitz , Eric C. Miller
IPC分类号： A61B17/00
CPC分类号： A61B17/32002 , A61B10/02 , A61B17/14 , A61B17/1659 , A61B17/1671 , A61B17/221 , A61B17/320725 , A61B17/320758 , A61B90/361 , A61B2017/00261 , A61B2017/003 , A61B2017/00327 , A61B2017/00526 , A61B2017/00539 , A61B2017/00553 , A61B2017/2212 , A61B2017/2215 , A61B2017/320048 , A61B2017/320064 , A61B2017/320775 , B33Y80/00 , F16H55/06 , F16H55/18 , Y10T74/19623
摘要： The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.

36. 发明申请

US20120222960A1 Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature 有权
标题翻译：形成具有减小的应力和/或曲率的三维结构的方法
公开(公告)号：US20120222960A1
公开(公告)日：2012-09-06
申请号：US13409950
申请日：2012-03-01
申请人： Ananda H. Kumar , Jorge Sotelo Albarran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
发明人： Ananda H. Kumar , Jorge Sotelo Albarran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： B81C1/00666 , C25D5/022
摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
摘要翻译：用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。呈现了六个主要实施例的组，它们分为十一个主要实施例。一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

37. 发明申请

US20120181180A1 Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures 有权
标题翻译：在电化学制造结构期间维持层的平行化和/或实现层的期望厚度的方法和装置
公开(公告)号：US20120181180A1
公开(公告)日：2012-07-19
申请号：US13356398
申请日：2012-01-23
申请人： Uri Frodis , Adam L. Cohen , Michael S. Lockard
发明人： Uri Frodis , Adam L. Cohen , Michael S. Lockard
IPC分类号： C25D5/48 , C25D21/12 , C25D5/02
CPC分类号： C25D5/48 , B33Y10/00 , B81C1/00492 , B81C99/0065 , B81C2201/0104 , B81C2201/0197 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/10 , C25D21/12 , H01L21/2885 , H01L21/76885 , Y10T156/1052
摘要： Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
摘要翻译：本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

38. 发明申请

US20120114861A1 Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material 审中-公开
标题翻译：用于生产多层结构的电化学制造方法包括在材料沉积物平面化中使用金刚石加工
公开(公告)号：US20120114861A1
公开(公告)日：2012-05-10
申请号：US13253856
申请日：2011-10-05
申请人： Adam L. Cohen , Uri Frodis , Michael S. Lockard , Ananda H. Kumar , Gang Zhang , Dennis R. Smalley
发明人： Adam L. Cohen , Uri Frodis , Michael S. Lockard , Ananda H. Kumar , Gang Zhang , Dennis R. Smalley
IPC分类号： B05D3/12 , B05D1/36 , C25D5/48
CPC分类号： C25D1/003 , B81C1/00492 , B81C99/0065 , B81C2201/0104 , B81C2201/0197 , C25D5/02 , C25D5/022 , C25D5/10 , C25D21/12 , H01L21/2885 , H01L21/76885
摘要： Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb). Some embodiments provide for reducing tool wear when using difficult-to-machine materials by (1) depositing difficult to machine materials selectively and potentially with little excess plating thickness and/or (2) pre-machining depositions to within a small increment of desired surface level (e.g. using lapping) and then using diamond fly cutting to complete the process, and/or (3) forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.
摘要翻译：用于形成单层和多层中尺度和微结构结构的电化学制造方法包括使用金刚石加工（例如飞切或车削）来平坦化层。一些实施例侧重于牺牲和结构材料的系统，其可以以最小的工具磨损（例如Ni-P和Cu，Au和Cu，Cu和Sn，Au和Cu，Au和Sn以及Au和Sn-Pb）进行金刚石加工，。一些实施例提供了通过（1）选择性地沉积难以加工的材料并且潜在地以很少的镀层厚度沉积和/或（2）预加工沉积到期望表面的小增量内，以便在使用难加工材料时减少刀具磨损（例如使用研磨），然后使用金刚石飞切切割来完成该过程，和/或（3）从硬质材料的薄壁区域形成与结构材料的宽固体区域相反的结构或部分结构。

39. 发明申请

US20110147223A1 Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature 审中-公开
标题翻译：形成具有减小的应力和/或曲率的三维结构的方法
公开(公告)号：US20110147223A1
公开(公告)日：2011-06-23
申请号：US13006814
申请日：2011-01-14
申请人： Ananda H. Kumar , Jorge Sotelo Alberran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
发明人： Ananda H. Kumar , Jorge Sotelo Alberran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
IPC分类号： C25D5/48 , C25D5/10
CPC分类号： B81C1/00666 , C25D5/022
摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
摘要翻译：用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。呈现了六个主要实施例的组，它们分为十一个主要实施例。一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

40. 发明申请

US20110080236A1 Miniature RF and Microwave Components and Methods for Fabricating Such Components 审中-公开
标题翻译：微型射频和微波元件及其制造方法
公开(公告)号：US20110080236A1
公开(公告)日：2011-04-07
申请号：US12899071
申请日：2010-10-06
申请人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
发明人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
IPC分类号： H01P1/207 , C25D5/02
CPC分类号： H01P1/202 , B33Y10/00 , B33Y70/00 , B81B2201/042 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H05K3/4647 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018
摘要： RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
摘要翻译：提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器，和/或其他主动或被动部件。部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。

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