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31. 发明公开

KR1020140033736A 도금방식으로 성장시킨 메탈 마스크와 그 제작방법 审中-实审
标题翻译：金属掩模
公开(公告)号：KR1020140033736A
公开(公告)日：2014-03-19
申请号：KR1020120099949
申请日：2012-09-10
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： C25D1/10 , C25D5/48
CPC分类号： C25D5/022 , C25D21/12
摘要： The present invention relates to a metal mask grown in a plating method. The characteristic of the present invention is to determine the size of a micro hole on a metal mask in a plating method by considering not only a temperature difference between actual work where the metal mask is used and the plating method where the metal mask is manufactured but also a thermal expansion coefficient of the metal mask. The metal mask manufactured by considering thermal expansion comprises as follows: a sensitive material coating process which evenly coats a sensitive material on an electric conductor substrate; a light exposing process which makes the sensitive material be exposed to light by radiating light on a film composed of a transparent unit and an opaque unit; a space unit forming process which forms a space unit by chemically removing a light unexposed unit; a metal mask plating process which forms a metal mask by performing coating on the space unit through the application of electricity on the electric conductor substrate in a plating tank; a light exposed unit removing process which chemically removes the light exposed unit; and a separating process which separates the metal mask from the electric conductor substrate. After the metal mask plating process, a polishing process can be included in order to smoothly polish the surface of the metal mask. In the light exposing process for making the sensitive material be exposed to light, the light exposed unit can be tapered. In addition, prior to the metal mask plating process, a frame can be installed in order to perform plating on the metal mask and at the same time to integrate the frame with the metal mask. A releasing agent coating process for coating a releasing agent on the electric conductor substrate can be included in order to facilitate releasing work.
摘要翻译：本发明涉及以电镀方法生长的金属掩模。本发明的特征在于，不仅考虑使用金属掩模的实际工作与制造金属掩模的电镀方法之间的温差，而且通过考虑电镀方法来确定金属掩模上的微孔的尺寸，也是金属掩模的热膨胀系数。通过考虑热膨胀而制造的金属掩模包括如下：将敏感材料均匀涂覆在导电体基材上的敏感材料涂布方法; 通过在由透明单元和不透明单元构成的膜上照射光使敏感材料暴露于光的曝光过程; 通过化学去除未曝光的单元形成空间单元的空间单元形成处理; 金属掩模电镀工艺，其通过在电镀槽中的导电体基板上施加电力在空间单元上进行涂覆而形成金属掩模; 光曝光单元去除处理，其化学去除曝光单元; 以及将金属掩模与导电体基板分离的分离工艺。在金属掩模电镀工艺之后，可以包括抛光工艺以平滑地抛光金属掩模的表面。在使敏感材料曝光的光曝光过程中，光曝光单元可以是锥形的。此外，在金属掩模电镀处理之前，可以安装框架以在金属掩模上进行电镀，并且同时将框架与金属掩模集成。可以包括用于在导电体基材上涂布脱模剂的脱模剂涂布方法，以便于脱模工作。

32. 发明公开

KR1020130008370A 엘시디 구조 无效
标题翻译：液晶显示结构
公开(公告)号：KR1020130008370A
公开(公告)日：2013-01-22
申请号：KR1020110069077
申请日：2011-07-12
申请人： 김정식 , 성낙훈 , 황춘섭
发明人： 김정식 , 성낙훈 , 황춘섭
IPC分类号： G02F1/1335 , G02B5/00
CPC分类号： G02F1/133526 , G02B5/0215
摘要： PURPOSE: A LCD structure is provided to improve brightness by using a lenticle screen instead of a conventional first polarizing plate and a prism sheet. CONSTITUTION: A backlight unit includes a light guide plate and a prism sheet. A lenticular screen(300) has waves in the upper and the lower direction. Convex portions(301~30n) are consecutively formed in the upper surface of the glass substrate in the lenticular screen. The convex portions form a convex lens shape.
摘要翻译：目的：提供一种LCD结构，通过使用透镜屏来代替传统的第一偏振片和棱镜片来提高亮度。构成：背光单元包括导光板和棱镜片。透镜屏（300）在上下方向上具有波。凸部（301〜30n）在玻璃基板的上表面连续地形成。凸部形成凸透镜形状。

33. 发明公开

KR1020150130092A 실버 페이스트 회로부를 가지는 기판의 제조방법과 그에 의한 기판 审中-实审
标题翻译：具有银浆电路和基板的基板的制造方法
公开(公告)号：KR1020150130092A
公开(公告)日：2015-11-23
申请号：KR1020140057224
申请日：2014-05-13
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： H05K3/12 , H05K3/20
摘要： 본발명은실버페이스터충진홈을가진실버페이스터용몰드에실버페이스터를충진하여실버페이스터회로부를형성하는실버페이스터회로부형성공정과; 상기충진된실버페이스터에의하여형성된실버페이스터회로부의경화공정과; 상기경화된실버페이스터회로부를접착제를통하여기판에결합시키는기판결합공정과; 실버페이스터용몰드에서실버페이스터회로부가결합된기판을분리하는기판분리공정을포함하는것을특징으로하는실버페이스트회로부를가지는기판의제조방법과그에의한실버페이스트회로부를가지는기판에대한것이다.
摘要翻译：本发明涉及一种用于制造具有银膏电路部分的基板的方法和由此制造的基板。使用银糊电路部分制造衬底的方法包括：通过用银膏填充包括银糊状沟槽的银膏的模具来形成银膏电路部分的银膏电路部分形成过程; 固化由填充的银浆形成的银糊电路部分的工序; 通过粘合剂将固化的银浆电路部与基板结合的基板结合工序; 以及将与银膏电路部分组合的基板与用于银浆的模具分离的基板分离工艺。

34. 发明公开

KR1020150022472A 전주 도금법에 의하여 제작되는 비 자성 스프링과 그 제작방법 审中-实审
标题翻译：通过镀层生产的非磁性弹簧及其生产方法
公开(公告)号：KR1020150022472A
公开(公告)日：2015-03-04
申请号：KR1020130100396
申请日：2013-08-23
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： C25D1/04 , C25D21/12
CPC分类号： C25D1/04 , C25D5/04 , C25D5/10 , C25D21/12
摘要： 본 발명은 전주 도금법에 의하여 제작되는 휴대폰 카메라의 자동 초점 조절 장치에 사용되는 비자성의 스프링의 제작방법과 그에 의한 스프링에 대한 것이다.
본 발명의 스프링은 두께가 30미크론에서 60미크론 사이의 것으로 대부분 제작이 되어진다. 스프링의 두께는 극히 얇으나 두께의 평판도는 3/1000 미리미터 이상의 오차 범위에 들어오도록 제작이 되어야 한다.
본 발명에서 요구되는 스프링은 조립되는 과정에서 자석에 부착이 되면 안되는 특성을 가지므로 비자성이 요구된다. 또한 휴대폰 카메라의 자동 초점 조절 장치에 사용되므로 적절한 탄성과 강도가 요구가 되어 진다.
본 발명의 전주 도금법에 의하여 제작이 되는 스프링은 비자성을 위하여 슬파민산 니켈에 인을 포함하는 도금층을 형성하는 특징이 있다. 이때 인의 비율을 5% ~ 30%로 구성한다.
도금조 내에는 바스켓과 회전하는 도전체가 구성되어지며, 상기 바스켓은 금속덩어리를 내포하며 양극의 전극을 연결되며, 바스켓은 전후로 주기적인 반복적인 이송운동을 하도록 하며; 상기 회전하는 도전체는 다각형으로 구성되며, 상기 회전하는 도전체는 음극을 연결되며, 50% ~70%가 도금조의 액체에 침지된다.
상기 다각형의 도전체의 각 면에는 마스터 기판이 부착되며, 상기 마스터 기판에 도금이 행하여 진다. 마스터 기판은 스프링의 형상을 가진 공간부가 형성된다.
마스터 기판은 도전성 기판에 감광재를 도포하고, 상기 감광재에 패턴 필름을 통하여 노광부와 비노광부를 형성하며, 상기 비노광부를 화학적으로 제거하여 공간부를 형성한다.
摘要翻译：本发明涉及一种在电动照相机的自动聚焦装置中使用的电铸方法制造的非磁性弹簧及其制造方法。本发明的弹簧的厚度通常为30-60微米。弹簧的厚度非常薄，但弹簧应在弹性平面度为3/1000mm以上的误差范围内制造。本发明需要非磁性弹簧来防止弹簧在制造中间附着于磁铁。此外，弹簧需要用于手机相机的自动聚焦装置的适当的弹性和刚性。通过本发明的电铸方法制造的弹簧的特征在于，在非磁性特征中形成包含磷和氨基磺酸镍的镀层。磷的比例为5-30％。在镀浴内部形成有用筐体旋转的导电体。筐包括金属簇，并与两极的电极连接。篮子周期性地向前和向后移动。旋转导电体形成为多边形，并与阴极连接。将50-70％的篮子浸入电镀液中的流体中。主基板附着在多边形导电体的每个表面上，并且母板基板被镀覆。在主基板上形成弹簧形激励空间单元。主基板在感光基板上涂覆敏化材料。通过使用图案膜在感光材料上形成曝光单元和非曝光单元。通过化学去除非曝光单元形成空间单元。

35. 发明公开

KR1020140044120A 브릿지 라인의 상부면과 메인 라인의 상부면이 동일 평면상에 위치되는 것을 특징으로 하는 마스크와 그의 제작방법. 审中-实审
标题翻译：屏蔽线上的上桥面和同一平面上的主线
公开(公告)号：KR1020140044120A
公开(公告)日：2014-04-14
申请号：KR1020120110122
申请日：2012-10-04
申请人： 성낙훈 , 김정식
发明人： 성낙훈 , 김정식
IPC分类号： B41C1/14 , B41N1/24 , H05K3/34
摘要： A mask of the present invention forms a bridge line for supporting a main line forming the mask. In the present invention, the upper surface of the bridge line and the upper surface of the main line are located on the same plane. A plating process can be a representative embodiment of the present invention for forming the main line and the bridge line. Of course, the present invention is intended for all kinds of mask wherein the upper surfaces of the bridge line and the main line are on the same plane. The bridge line firmly supports the main line. As the most representative embodiment of the present invention, a plating method which simultaneously performs a light exposure for producing a base unit of the main line on a photosensitive layer for producing the bridge line can be provided.
摘要翻译：本发明的掩模形成用于支撑形成掩模的主线的桥线。在本发明中，桥线的上表面和主线的上表面位于同一平面上。电镀工艺可以是用于形成主线和桥接线的本发明的代表性实施例。当然，本发明适用于桥接线路和主线路的上表面在同一平面上的各种掩模。桥线牢固支撑主线。作为本发明的最具代表性的实施方式，可以提供同时进行用于制造用于制造桥接线的感光层上的主线的基底单元的曝光的电镀方法。

36. 发明公开

KR1020140042201A 날개부를 구비한 메탈 마스크와 그의 제작방법. 审中-实审
标题翻译：金属面膜与生产方法
公开(公告)号：KR1020140042201A
公开(公告)日：2014-04-07
申请号：KR1020120108628
申请日：2012-09-28
申请人： 성낙훈 , 김정식
发明人： 성낙훈 , 김정식
IPC分类号： B41C1/14 , B41N1/24 , H05K3/34
摘要： The present invention relates to a wing type metal mask made by a plating method. The wing type metal mask made by a plating method comprises a main line and a wing part for supporting the main line. A ring part protruding from an upper part of the main line towards the side of the main line and is formed to be integrated with the main line. It is desirable that the present invention coats the metal mask with release agents and facilitates the release of fillers. A manufacturing method for the metal mask made by a plating method performs a wing part plating process and performs a main line plating process after the wing part plating process. The wing part protrudes from the upper part of the main line towards the side of the main line and is formed to be integrated with the main line. The present invention can include a metal mask coated with release agents.
摘要翻译：本发明涉及一种通过电镀方法制成的翼型金属掩模。由电镀方法制成的翼型金属掩模包括主线和用于支撑主线的翼部。从主线的上部朝向主线的一侧突出并形成为与主线一体化的环形部。理想的是，本发明用脱模剂涂覆金属掩模，并有利于填料的释放。通过电镀法制造的金属掩模的制造方法进行翼部电镀处理，并且在翼部电镀处理之后进行主线电镀处理。翼部从主线的上部向主线侧突出，形成为与主线一体化。本发明可以包括涂覆有脱模剂的金属掩模。

37. 发明公开

KR1020140037635A 도전성 페이스트를 충진시켜서 회로기판을 제작하는 방법과 그 방법에 의하여 제작된 회로기판 审中-实审
标题翻译：电路板生产填充导电胶
公开(公告)号：KR1020140037635A
公开(公告)日：2014-03-27
申请号：KR1020120104021
申请日：2012-09-19
申请人： 성낙훈 , 김정식
发明人： 성낙훈 , 김정식
IPC分类号： H05K3/10 , G03F7/20
CPC分类号： H05K1/095 , G03F7/12 , H01B1/02 , H01B1/22 , H05K1/028 , H05K3/4664
摘要： The present invention relates to a method of manufacturing a circuit board by filling conductive paste, in which method the circuit board is manufactured by producing a non-conductive master board having columns from a conductive master mold and filling conductive paste in which conductive powder and a bonding liquid resin between the columns of the master board. In the circuit board according to the present invention, a circuit and columns are formed. The circuit is formed by filling a conductive bonding resin such as silver paste in a space, and the columns are jointed to the non-conductive board. The columns and the circuit are coupled to each other on the board and are bonded to each other with a strong force, so that they are strong to an external impact. Although the circuit manufactured of silver paste generally may be easily oxidized, the silver paste according to the present invention constitutes a protective wall for preventing oxidation around the silver paste so that the silver paste can prevent oxidation. Because the height of the circuit may be adjusted by the height of a photosensitive material applied on the board, the thickness of the circuit can be manufactured to have a desired level.
摘要翻译：本发明涉及一种通过填充导电膏来制造电路板的方法，其中通过制造具有导电母模的具有列的非导电母板并填充导电性粉末和在主板的列之间粘结液体树脂。在根据本发明的电路板中，形成电路和列。电路通过在空间中填充银糊等导电性接合树脂而形成，并且该列与非导电板接合。柱和电路在板上彼此耦合并且以强力彼此结合，使得它们对外部冲击强。尽管由银膏制成的电路通常可以容易氧化，但是根据本发明的银膏构成防止银膏周围的氧化的保护壁，从而银膏可以防止氧化。由于可以通过施加在电路板上的感光材料的高度来调节电路的高度，所以可以制造电路的厚度以达到期望的水平。

38. 发明公开

KR1020140035723A 극미세 금속 부품의 제조방법과 그에 의한 극미세 금속 부품 审中-实审
标题翻译：超微量金属制品
公开(公告)号：KR1020140035723A
公开(公告)日：2014-03-24
申请号：KR1020120102337
申请日：2012-09-14
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： G03F7/00 , H05K3/18 , H05K3/06
CPC分类号： G03F7/0045 , G03F1/80 , G03F7/0043 , G03F7/16 , G03F7/26 , H01B1/22 , H01L21/288 , H01L21/304 , H05K3/025
摘要： The present invention relates to a nanometal product by a plating method. The present invention relates to the nanometal product which comprises a thin sputtering conductive layer formed on a nonconductive support plate, and a plating layer formed by performing plating on the sputtering conductive layer. A manufacturing method for the nanometal product comprises: a sensitizer application process of applying a sensitizer on the nonconductive support plate on which the thin conductive layer is formed; an exposure process of irradiating light through a film in which a pattern is formed on the sensitizer and forms an exposure part and an non-exposure part; a nanometal product formation process of forming a conductive nanometal product by conducting a plating process on a space part after forming the space part by removing the non-exposure part; an exposure removal process of forming a space part by removing the exposure part; and an etching process of removing the thin conductive layer exposed through the space part formed by removing the exposure part by performing etching.
摘要翻译：本发明涉及一种通过镀覆方法制备的纳米金属产品。本发明涉及纳米金属产品，其包括形成在非导电支撑板上的薄的溅射导电层和通过在溅射导电层上进行电镀形成的镀层。纳米金属产品的制造方法包括：敏化剂施加过程，其在形成有薄导电层的非导电支撑板上施加敏化剂; 通过在增感剂上形成图案的膜照射光并形成曝光部和非曝光部的曝光处理; 一种纳米金属产品形成工艺，其通过除去非曝光部分在形成所述空间部分之后在空间部分上进行电镀处理来形成导电纳米金属产品; 通过去除曝光部分形成空间部分的曝光去除处理; 以及通过进行蚀刻去除通过去除曝光部分而形成的空间部分暴露的薄导电层的蚀刻工艺。

39. 发明公开

KR1020140032243A 충진부와 회로부가 일체로 된 극미세 회로기판 审中-实审
标题翻译：极致微结构电路板
公开(公告)号：KR1020140032243A
公开(公告)日：2014-03-14
申请号：KR1020120098908
申请日：2012-09-06
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： G03F7/20 , H05K3/18
摘要： The present invention relates to an ultrafine circuit board with an integrated non-conductive material-filled part and conductive circuit part and a manufacturing method thereof. In the present invention, the non-conductive material-filled part and the conductive circuit part are integrated in the upper part of a non-conductive supporting board, the non-conductive material-filled part is formed on the non-conductive supporting board, and the non-conductive material-filled part is formed between circuits in the conductive circuit part. A conductive layer which is formed on the non-conductive supporting board by sputtering is plated with a conductive metal. A manufacturing method of the ultrafine circuit board with an integrated non-conductive material-filled part and conductive circuit part comprises a photoresist-spreading process spreading photoresist onto the non-conductive supporting board with a thin conductive layer; an exposure process forming an exposed part and unexposed part by irradiating the photoresist with light through a patterned film; an etching process forming a space part by removing the unexposed part and removing the exposed thin conductive layer on the bottom of the formed space part; a non-conductive material-filling process filling the space part with non-conductive materials; an exposed part-removing process forming a space part by removing the exposed part in order to exposed the thin conductive layer on the bottom of the exposed part; and a circuit part-forming process forming the conductive circuit part by plating the space part with removed exposed part.
摘要翻译：本发明涉及具有集成非导电材料填充部分和导电电路部分的超细电路板及其制造方法。在本发明中，非导电材料填充部分和导电电路部分集成在非导电支撑板的上部，非导电材料填充部分形成在非导电支撑板上，并且在导电电路部分中的电路之间形成非导电材料填充部分。通过溅射形成在非导电支撑板上的导电层用导电金属镀覆。具有集成的非导电材料填充部分和导电电路部分的超细电路板的制造方法包括：在具有薄导电层的非导电支撑板上铺展光致抗蚀剂的工艺; 曝光处理形成曝光部分和未曝光部分，通过用光照射光刻胶通过图案化膜; 通过去除未曝光部分并去除形成的空间部分的底部上的暴露的薄导电层来形成空间部分的蚀刻工艺; 非导电材料填充工艺用非导电材料填充空间部分; 暴露的部分去除工艺通过去除暴露部分形成空间部分，以便将暴露部分的底部上的薄导电层暴露出来; 以及通过用去除的露出部分电镀所述空间部分来形成所述导电电路部分的电路部件形成工艺。

40. 发明公开

KR1020130087170A 도금방법에 의하여 노광부와 일체로 결합된 극미세 회로를 가지는 기판의 제조방법과 그에 의하여 제작된 극미세 회로기판 审中-实审
标题翻译：通过镀层法制造的基板与由曝光部分组合的极限分电路的制造方法和由方法制造的极端分钟电路板
公开(公告)号：KR1020130087170A
公开(公告)日：2013-08-06
申请号：KR1020120008247
申请日：2012-01-27
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： H05K3/18 , G03F7/20
摘要： PURPOSE: A method for manufacturing a board including an ultra-narrow circuit integrated with a light exposure unit and an ultra-narrow circuit board thereof are provided to implement integration by easily composing a circuit unit. CONSTITUTION: A sensitizer is applied to the top of the board. A light exposure unit (3) and a non-exposure unit are formed. A space unit is formed on the non-exposure unit. A sputtering metal layer (6) is formed in the top of the light exposure unit and the bottom of the space unit. A plating circuit unit (8) is formed on the sputtering metal layer.
摘要翻译：目的：提供一种用于制造包括与曝光单元和超窄电路板集成的超窄电路板的板的方法，以通过容易地构成电路单元来实现集成。构成：敏化剂应用于电路板的顶部。形成曝光单元（3）和非曝光单元。在非曝光单元上形成空间单元。溅射金属层（6）形成在曝光单元的顶部和空间单元的底部。在溅射金属层上形成电镀电路单元（8）。

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