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31. 发明授权

US5027995A Process for bonding semiconductor chips to substrates 失效
标题翻译：将半导体芯片接合到基板的工艺
公开(公告)号：US5027995A
公开(公告)日：1991-07-02
申请号：US657292
申请日：1991-02-19
申请人： Alois Karl , Karl Osojnik , Werner Spaeth , Guenther Waitl
发明人： Alois Karl , Karl Osojnik , Werner Spaeth , Guenther Waitl
IPC分类号： H01L21/60 , H01L21/607 , H01L23/485 , H01L31/0203 , H01L33/40
CPC分类号： H01L33/40 , H01L24/10 , H01L24/13 , H01L24/81 , H01L31/0203 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/48091 , H01L2224/48247 , H01L2224/81207 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107
摘要： A semiconductor chip (1) is bonded to a substrate (2) serving as a component housing, a contact part, an insulative part or a connecting part without the use of a high-temperature process or any additional bonding medium such as solder or flux. The backside of the semiconductor chip (1) or substrate (2) is structured to include specially formed bumps (3) for the necessary connections. A ductile metal is used for these bumps (3). The bond to the substrate (2) is formed by using pressure and/or ultrasonic energy. The process according to this invention is particularly suitable for bonding components in data link receivers, optoelectronic couplers, transmitters (LEDs, IREDs) and ISDN modules.
摘要翻译：半导体芯片（1）在不使用高温工艺的情况下与用作部件壳体，接触部件，绝缘部件或连接部件的基板（2）接合，或者粘合剂。半导体芯片（1）或基板（2）的背面被构造成包括用于所需连接的专门形成的凸块（3）。这些凸块（3）使用延展性金属。通过使用压力和/或超声能量来形成与基板（2）的结合。根据本发明的方法特别适用于连接数据链路接收机，光电耦合器，发射器（LED，IRED）和ISDN模块中的组件。

32. 发明授权

US4875750A Optoelectronic coupling element and method for its manufacture 失效
标题翻译：光电耦合元件及其制造方法
公开(公告)号：US4875750A
公开(公告)日：1989-10-24
申请号：US151372
申请日：1988-02-02
申请人： Werner Spaeth , Guenther Waitl , Werner Kuhlmann , Hans-Ludwig Althaus , Rolf Birkmann , Waltraud Klos , Axel Schubert
发明人： Werner Spaeth , Guenther Waitl , Werner Kuhlmann , Hans-Ludwig Althaus , Rolf Birkmann , Waltraud Klos , Axel Schubert
IPC分类号： G02B6/32 , G02B6/36 , G02B6/42
CPC分类号： G02B6/4249 , G02B6/4204
摘要： An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.
摘要翻译：一种用于制造耦合元件的光电耦合元件和方法。耦合元件包括光波导，微透镜，第一载体芯片和发光和/或光检测半导体元件。微透镜的形状优选为球形，并且适于光学耦合光波导和半导体元件。半导体元件可以是第一载体芯片的一部分，或者根据另一实施例，半导体元件可以是第二载体芯片的一部分。该耦合元件的目的是便于将微透镜精确地安装在光波导和半导体元件之间的位置，并且还便于微透镜的调节以最佳地执行其光耦合功能。用于制造耦合元件的方法提供了在载体芯片中形成具有梯形形状侧面的插座。微透镜用诸如玻璃的连接介质安装在容器内。容器的尺寸由微透镜的尺寸和微透镜与载体之间的接触点决定。根据本发明的光电耦合元件的应用尤其在LED发射机结构元件，接收器结构元件和激光模块中。这种生产方法基本上避免了由于诸如机械变形的影响而导致的载体芯片的损伤。另外，尽管这些部件的尺寸很小，但是这种类型的联接元件可以经济高效地批量生产。

33. 发明授权

US4158133A Filters for photo-detectors 失效
标题翻译：光电探测器滤光片
公开(公告)号：US4158133A
公开(公告)日：1979-06-12
申请号：US826394
申请日：1977-08-16
申请人： Werner Spaeth , Laszlo Bacs
发明人： Werner Spaeth , Laszlo Bacs
IPC分类号： G02B5/28 , H01L31/0216 , H01L31/04 , H01L31/10 , H01J39/12
CPC分类号： G02B5/288 , H01L31/02165
摘要： Optical filters are directly mounted on the surface of photo-detectors. The filters have maximum radiation permeability for the operating range of the photo-detector. For that region of the spectrum which lies outside of the operating range, the filters are of maximum impermeability and considerably decrease interfering currents resulting from the incidence of foreign light. The direct mounting of the filters on the detector surface effects not only technical but also economical advantages.
摘要翻译：光学滤波器直接安装在光电检测器的表面上。滤光片对于光电检测器的工作范围具有最大的辐射透过率。对于位于工作范围之外的频谱区域，滤波器具有最大的不可渗透性，并显着减少由于异物的入射而产生的干扰电流。将过滤器直接安装在检测器表面上不仅具有技术性且经济的优点。

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