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31. 外观设计

USD641666S1 Automobile 有权
公开(公告)号：USD641666S1
公开(公告)日：2011-07-19
申请号：US29383162
申请日：2011-01-13
申请人： Jin-Sung Yi
设计人： Jin-Sung Yi

32. 发明申请

US20110155436A1 CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法
公开(公告)号：US20110155436A1
公开(公告)日：2011-06-30
申请号：US12649824
申请日：2009-12-30
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H05K1/11 , B26D3/00
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

33. 发明申请

US20110103172A1 HIGH PERFORMANCE GREEN CONCRETE MIXER AND HIGH PERFORMANCE MIXING METHOD FOR GREEN CONCRETE 审中-公开
标题翻译：高性能绿色混凝土搅拌机和高性能混凝土搅拌方法
公开(公告)号：US20110103172A1
公开(公告)日：2011-05-05
申请号：US12749478
申请日：2010-03-29
申请人： Chao-Lung Hwang , Sung-Yi Lin
发明人： Chao-Lung Hwang , Sung-Yi Lin
IPC分类号： B28C9/00
CPC分类号： B28C5/166 , B01F7/165 , B01F9/0041 , B01F9/06 , B01F13/1013 , B01F13/1022 , B01F13/1027 , B01F2009/0063 , B28C5/1843 , B28C9/002
摘要： A high performance green concrete mixer and a high performance mixing method of green concrete are provided. The high performance green concrete mixer includes a pan mixer, plural drum mixers and a funnel. Each of the drum mixers is inclined relative to the pan mixer, while the funnel is connected between the pan mixer and the drum mixers.
摘要翻译：提供了高性能的绿色混凝土搅拌机和绿色混凝土的高性能混合方法。高性能绿色混凝土搅拌机包括搅拌机，多个搅拌机和漏斗。每个鼓式混合器相对于搅拌器倾斜，而漏斗连接在搅拌器和滚筒混合器之间。

34. 发明申请

US20110069838A1 Apparatus and method for reducing channel reproduction delay in mobile terminal 有权
标题翻译：降低移动终端通道再现延迟的装置和方法
公开(公告)号：US20110069838A1
公开(公告)日：2011-03-24
申请号：US12924116
申请日：2010-09-21
申请人： Ji-Wuck Jung , Young-Jip Kim , Joon-Ho Park , Jin-Woo Jeon , Jae-Sung Yi
发明人： Ji-Wuck Jung , Young-Jip Kim , Joon-Ho Park , Jin-Woo Jeon , Jae-Sung Yi
IPC分类号： H04K1/00
CPC分类号： H04W12/02 , H04L63/06 , H04L65/4076 , H04L2209/601 , H04N7/1675 , H04N21/4126 , H04N21/4331 , H04N21/4405 , H04W12/04 , H04W12/06
摘要： An apparatus and a method reduce delay when reproducing digital broadcasting in a mobile terminal. More particularly, the apparatus and method reduce a reproduction delay, from having to stand by until an encrypted stream that matches with a traffic key is received, by receiving the traffic key in advance prior to the encrypted stream when a mobile terminal receives encrypted broadcasting. The apparatus includes a controller. The controller receives and stores a traffic key corresponding to an encrypted channel even when not entering the encrypted channel, and deciphers and reproduces the relevant channel using the stored traffic key when entering the encrypted channel.
摘要翻译：一种装置和方法在移动终端中再现数字广播时减少延迟。更具体地说，当移动终端接收加密的广播时，装置和方法通过在加密流之前预先接收业务密钥，从而必须等待直到接收到与业务密钥相匹配的加密流的再现延迟。该装置包括控制器。即使不进入加密信道，控制器接收并存储对应于加密信道的业务密钥，并且在输入加密信道时使用存储的业务密钥对相关信道进行解密和再现。

35. 发明授权

US07886414B2 Method of manufacturing capacitor-embedded PCB 有权
标题翻译：制造电容器嵌入式PCB的方法
公开(公告)号：US07886414B2
公开(公告)日：2011-02-15
申请号：US12081862
申请日：2008-04-22
申请人： Woon-Chun Kim , Sung Yi , Hwa-Sun Park , Hong-Won Kim , Dae-Jun Kim , Jin-Seon Park
发明人： Woon-Chun Kim , Sung Yi , Hwa-Sun Park , Hong-Won Kim , Dae-Jun Kim , Jin-Seon Park
IPC分类号： H01G7/00
CPC分类号： H05K1/162 , H05K3/108 , H05K3/386 , H05K3/4626 , H05K2201/0195 , H05K2201/09672 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/4913 , Y10T29/49155 , Y10T29/49167
摘要： A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.
摘要翻译：公开了一种制造电容器嵌入式PCB的方法。该方法可以包括制造具有形成在电介质层的一侧上的至少一个内部电极的电容器基板; 将半固化绝缘层与芯层的一侧对准，并将电容器基板与半固化绝缘层对准，使得内电极面向半固化绝缘层; 并且集中地堆叠芯层，半固化绝缘层和电容器基板。

36. 外观设计

USD628941S1 Automobile 有权
公开(公告)号：USD628941S1
公开(公告)日：2010-12-14
申请号：US29357975
申请日：2010-03-19
申请人： Jin-Sung Yi
设计人： Jin-Sung Yi

37. 发明申请

US20100288739A1 LASER PROCESSING DEVICE 审中-公开
标题翻译：激光加工设备
公开(公告)号：US20100288739A1
公开(公告)日：2010-11-18
申请号：US12579755
申请日：2009-10-15
申请人： Jae-Kwang Lee , Sung Yi , Soon-Gyu Yim
发明人： Jae-Kwang Lee , Sung Yi , Soon-Gyu Yim
IPC分类号： B23K26/38
CPC分类号： B23K26/032 , G01B9/02081 , G01B11/02 , H05K3/0035 , H05K2203/0207 , H05K2203/108 , H05K2203/163
摘要： Disclosed is a laser processing device, which includes a processing beam source configured to irradiate a processing laser towards an object, a measuring beam source configured to irradiate a modulated measuring laser, an irradiator configured to align a path of the measuring laser with a path of the processing laser directed towards the object, a beam receiver configured to receive the measuring laser reflected from the object, an I/Q demodulator configured to calculate a phase difference between the measuring laser irradiated from the measuring beam source and the measuring laser received at the beam receiver, and a data processor configured to calculate a processed length of the object by using the phase difference. The invention can be used to measure the length of a laser-processed portion at the same time as the laser processing itself, so that the laser processing may be performed with improved precision.
摘要翻译：公开了一种激光处理装置，其包括被配置为朝向物体照射处理激光的处理光束源，被配置为照射调制测量激光的测量光束源，配置成将测量激光的路径与所述处理激光器被引导到所述物体，被配置为接收从所述物体反射的所述测量激光器的光束接收器; I / Q解调器，被配置为计算从所述测量光束源照射的所述测量激光器与在所述测量激光器处接收的所述测量激光器之间的相位差以及数据处理器，被配置为通过使用所述相位差来计算所述对象的处理长度。本发明可以用于与激光加工本身同时测量激光加工部分的长度，使得可以以更高的精度执行激光加工。

38. 发明申请

US20100246551A1 Performance optimization for wireless networks with mixed modulation types 有权
标题翻译：具有混合调制类型的无线网络的性能优化
公开(公告)号：US20100246551A1
公开(公告)日：2010-09-30
申请号：US12802375
申请日：2010-06-04
申请人： Tania Sung-Yi Chen , Bretton Douglas , Arnold Bilstad
发明人： Tania Sung-Yi Chen , Bretton Douglas , Arnold Bilstad
IPC分类号： H04W40/00
CPC分类号： H04W48/18 , H04W84/12 , H04W88/06 , H04W88/10
摘要： In one embodiment, different physical layer standards are segregated into different frequency channels. In one implementation, 802.11b traffic and 802.11g traffic are segregated into different frequency channels. A network management tool allows the user to specify channels to either, e.g., 802.11b-only, 802.11g-only, 802.11b preferred and 802.11g discouraged, or 802.11g preferred and 802.11b discouraged. Access points are given the capability of preventing or discouraging client traffic of either given type.
摘要翻译：在一个实施例中，将不同的物理层标准分离成不同的频率信道。在一个实现中，将802.11b业务和802.11g业务分离到不同的频率信道中。网络管理工具允许用户指定信道，例如仅限于802.11b，仅802.11g，802.11b优先，802.11g不鼓励，或802.11g优先和802.11b不鼓励。接入点具有防止或阻止任一给定类型的客户端流量的能力。

39. 发明申请

US20100127292A1 Wafer level led package structure for increasing light-emitting efficiency and method for making the same 审中-公开
标题翻译：用于提高发光效率的晶片级LED封装结构和制造它的方法
公开(公告)号：US20100127292A1
公开(公告)日：2010-05-27
申请号：US12461742
申请日：2009-08-24
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L33/00 , H01L21/30
CPC分类号： H01L33/38 , H01L33/508 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.
摘要翻译：用于提高发光效率的晶片级LED封装结构包括：发光单元，绝缘单元，两个第一导电单元和两个第二导电单元。发光单元具有形成在正导电层和负导电层之间的发光体，正导电层，负导电层和反射绝缘层。发光体具有底部材料层和顶部材料层。绝缘单元形成在底部材料层的顶表面的外部区域周围，并形成在反射绝缘层的顶表面上。一个第一导电单元形成在正导电层和绝缘单元的一部分上，另一个第一导电单元形成在负导电层和绝缘单元的一部分上。两个第二导电单元分别形成在两个第一导电单元上。

40. 发明申请

US20100052164A1 Wafer level package and method of manufacturing the same 审中-公开
标题翻译：晶圆级封装及其制造方法
公开(公告)号：US20100052164A1
公开(公告)日：2010-03-04
申请号：US12289702
申请日：2008-10-31
申请人： Seung Seoup Lee , Sung Yi
发明人： Seung Seoup Lee , Sung Yi
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/3114 , H01L21/76804 , H01L21/76817 , H01L21/76885 , H01L24/02 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02333 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/05557 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/181 , H01L2924/00
摘要： The present invention relates to a wafer level package and a method of manufacturing the same and provides a wafer level package structure including a wafer having a die pad; a redistribution line formed to be connected on a top surface of the die pad; a metal post connected to a top surface of the redistribution line and formed in a flexure hinge structure; and a molding resin formed between the metal posts.
摘要翻译：本发明涉及一种晶片级封装及其制造方法，提供一种晶片级封装结构，其包括具有管芯焊盘的晶片; 形成为连接在所述管芯焊盘的上表面上的再分配线; 连接到再分配线的顶表面并形成在弯曲铰链结构中的金属柱; 以及形成在金属柱之间的模制树脂。

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