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    • 35. 发明申请
    • VARIABLE RESISTANCE MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
    • 可变电阻存储器件及其制造方法
    • US20160197121A1
    • 2016-07-07
    • US14984477
    • 2015-12-30
    • Jin-Woo LEEYoun-Sean KANGSeung-Jae JUNGHyun-Su JUMasayuki TERAI
    • Jin-Woo LEEYoun-Sean KANGSeung-Jae JUNGHyun-Su JUMasayuki TERAI
    • H01L27/24H01L43/08H01L43/02H01L45/00H01L27/22
    • H01L27/2463H01L27/224H01L27/2409H01L43/12H01L45/1675
    • A variable resistance memory device includes a plurality of first conductive layer pattern, a plurality of second conductive layer patterns over the first conductive layer patterns, and a plurality of lower cell structures including a switching element and a variable resistance element, the lower cell structures being formed at intersections at which the first conductive layer patterns and the second conductive layer patterns overlap each other. The first conductive layer patterns, the second conductive layer patterns and the lower cell structures serves as one of a memory cell, a first dummy pattern structure and a second dummy pattern structure. The first dummy pattern structure is formed on both edge portions in the first direction, and the second conductive layer pattern of the first dummy pattern structure protrudes in the first direction from a sidewall of the lower cell structure thereunder, and the second dummy pattern structure is formed on both edge portions in the second direction, and the first conductive layer pattern of the second dummy pattern structure protrudes in the second direction from a sidewall of the lower cell structure thereon. Failures of the variable resistance memory device due to the etch residue may decrease.
    • 可变电阻存储器件包括多个第一导电层图案,多个第一导电层图案上的第二导电层图案,以及包括开关元件和可变电阻元件的多个下单元结构,下单元结构为 形成在第一导电层图案和第二导电层图案彼此重叠的交点处。 第一导电层图案,第二导电层图案和下单元结构用作存储单元,第一虚设图案结构和第二虚设图案结构之一。 第一虚设图形结构形成在第一方向的两个边缘部分上,第一虚设图案结构的第二导电层图案从其下部单元结构的侧壁沿第一方向突出,第二虚设图案结构为 形成在第二方向的两个边缘部分上,并且第二虚设图案结构的第一导电层图案在其下面的单元结构的侧壁上沿第二方向突出。 由于蚀刻残留导致的可变电阻存储器件的故障可能降低。