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    • 34. 发明申请
    • ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
    • 电子元件安装系统和电子元件安装方法
    • US20090293265A1
    • 2009-12-03
    • US12090274
    • 2006-12-20
    • Masafumi InoueMitsuhaya TsukamotoSyoichi NishiMasahiro Kihara
    • Masafumi InoueMitsuhaya TsukamotoSyoichi NishiMasahiro Kihara
    • B23P19/00
    • H05K13/082Y10T29/49128Y10T29/4913Y10T29/53174
    • One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality.According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data. Then, once the substrate has been delivered to an electronic component placing apparatus, the substrate height measurement apparatus again measures the height of the substrate at specific height measurement points to obtain substrate height correction data, and based on the initial substrate height data and the substrate height correction data, updates a control parameter for controlling the component placing operation performed by a loading head. In this manner, discrepancies in the positions of the heights of individual substrates can be accurately corrected, and mounting defects due to positioning errors in the direction of the heights of the substrates can be prevented.
    • 本发明的一个目的是提供一种电子部件安装系统和电子部件安装方法,其可以防止由于基板的厚度方向上的定位误差引起的安装缺陷,并且可以提供特定的安装质量。 根据通过连接多个用于安装电子部件的装置的电子部件安装系统,印刷检查装置的高度测量装置22测量在基板的上表面上指定的高度测量点处的高度, 并输出测量结果作为衬底高度数据。 然后,一旦基板被输送到电子部件放置装置,基板高度测量装置再次测量特定高度测量点处的基板的高度,以获得基板高度校正数据,并且基于初始基板高度数据和基板 高度校正数据,更新用于控制由装载头执行的部件放置操作的控制参数。 以这种方式,可以精确地校正单个基板的高度位置的差异,并且可以防止由于基板的高度方向上的定位误差而导致的安装缺陷。
    • 40. 发明授权
    • Component mounting system and mounting method
    • 组件安装系统和安装方法
    • US06757966B2
    • 2004-07-06
    • US10037094
    • 2001-10-25
    • Masafumi InoueMitsuhaya TsukamotoMasat Fujioka
    • Masafumi InoueMitsuhaya TsukamotoMasat Fujioka
    • H05K334
    • H05K13/0465H05K1/0269H05K3/0008H05K3/1216H05K13/0817H05K13/083Y10T29/49002Y10T29/49131Y10T29/49144Y10T29/49826Y10T29/53052Y10T29/53091Y10T29/53178
    • A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.
    • 一种部件安装系统,其包括用于在形成在板上的电极上印刷焊料的打印机; 第一检查单元,用于检测印刷焊料的位置并输出焊料位置检测结果; 组件安装单元,用于从部件供给器托架拾取部件,并使用安装头将部件放置在板上; 第二检查单元,用于检查放置的部件的位置并输出部件位置检测结果; 焊接单元,用于通过加热和熔化焊料将部件焊接到板上; 至少基于焊料位置检测结果或分量位置检测结果,至少更新用于控制打印机操作的控制参数或部件安装单元操作的控制参数的主控制器。 上述配置使得能够在整个安装过程中进行准确和有效的质量控制。