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31. 发明授权

US08388189B2 Socket device 有权
公开(公告)号：US08388189B2
公开(公告)日：2013-03-05
申请号：US13597953
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

32. 发明申请

US20120320609A1 Socket Device 有权
公开(公告)号：US20120320609A1
公开(公告)日：2012-12-20
申请号：US13597804
申请日：2012-08-29
申请人： Satoshi WATANABE , Keiichi SHIMIZU , Takeshi OSADA , Keiichi SHIMIZU , Toshiya TANAKA , Shigeru OSAWA , Takeshi HISAYASU , Hirokazu OTAKE , Hitoshi KAWANO , Makoto SAKAI
发明人： Satoshi WATANABE , Keiichi SHIMIZU , Takeshi OSADA , Keiichi SHIMIZU , Toshiya TANAKA , Shigeru OSAWA , Takeshi HISAYASU , Hirokazu OTAKE , Hitoshi KAWANO , Makoto SAKAI
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

33. 发明申请

US20120320565A1 Lighting System 有权
标题翻译：照明系统
公开(公告)号：US20120320565A1
公开(公告)日：2012-12-20
申请号：US13597992
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V33/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
摘要翻译：能够有效地散发灯装置的热量的照明器具可以被构造成附接到插座装置。在一些示例中，通过将灯装置附接到插座装置，灯装置的盖部与夹具本体接触，并通过弹性体抵压并与夹具本体紧密接触。通过灯装置的LED的照明而产生的热量从帽部传导到夹具本体并被有效地辐射。

34. 发明申请

US20120132530A1 TIN PLATING SOLUTION 审中-公开
标题翻译： TIN镀层溶液
公开(公告)号：US20120132530A1
公开(公告)日：2012-05-31
申请号：US13279280
申请日：2011-10-22
申请人： Shinjiro HAYASHI , Makoto SAKAI , Mutsuko SAITO
发明人： Shinjiro HAYASHI , Makoto SAKAI , Mutsuko SAITO
IPC分类号： C25D3/32 , C25D5/02
CPC分类号： C25D3/32 , H05K3/062
摘要： To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.
摘要翻译：提供具有通孔电镀均匀性，膜厚分布均匀性和无烧结沉积的镀锡溶液。镀锡溶液包括锡离子源，至少一种非离子表面活性剂，咪唑啉二羧酸酯和1,10-菲咯啉。

35. 发明申请

US20110280675A1 Method for Forming Through-Hole 审中-公开
标题翻译：形成通孔的方法
公开(公告)号：US20110280675A1
公开(公告)日：2011-11-17
申请号：US13177225
申请日：2011-07-06
申请人： Takuji Nomura , Makoto Sakai
发明人： Takuji Nomura , Makoto Sakai
IPC分类号： B23B35/00
CPC分类号： B23B51/0486 , B23B41/02 , B23B2240/08 , B23B2251/422 , Y10T408/03 , Y10T408/9098
摘要： A method for forming a through-hole on a work material using a drill having a drill head provided with a brazed-type cutting blade helps prevent generation of a spiral mark on an inner circumferential face of the through-hole and obtains a superior appearance and high working accuracy. In forming a through-hole H on a work material W by a drill head 1A with cutting blades 3A to 3C brazed to cutting blade mounting seats 13a to 13c, a drill head provided with roundness R on a blade edge outer end portion 31a of a cutting blade 3A responsible for cutting of the outermost periphery is used as the drill head 1A.
摘要翻译：使用具有设置有钎焊型切割刀头的钻头的钻头在工件上形成通孔的方法有助于防止在通孔的内周面上产生螺旋痕，并获得优异的外观和高工作精度。在通过钎焊到切割刀片安装座13a至13c的切割刀片3A至3C的钻头1A在工件材料W上形成通孔H时，在头部的刀刃外端部31a上设置有圆度R的钻头负责切割最外周的切割刀片3A被用作钻头1A。

36. 外观设计

USD628316S1 Light emitting diode lamp 有权
公开(公告)号：USD628316S1
公开(公告)日：2010-11-30
申请号：US29361672
申请日：2010-05-13
申请人： Junichiro Yamamoto , Makoto Sakai
设计人： Junichiro Yamamoto , Makoto Sakai

37. 外观设计

USD628314S1 Light emitting diode lamp 有权
公开(公告)号：USD628314S1
公开(公告)日：2010-11-30
申请号：US29361665
申请日：2010-05-13
申请人： Junichiro Yamamoto , Makoto Sakai , Kazufumi Yoshida
设计人： Junichiro Yamamoto , Makoto Sakai , Kazufumi Yoshida

38. 外观设计

USD617918S1 Light emitting diode lamp 有权
公开(公告)号：USD617918S1
公开(公告)日：2010-06-15
申请号：US29352753
申请日：2009-12-24
申请人： Junichiro Yamamoto , Makoto Sakai , Aiko Hiraga
设计人： Junichiro Yamamoto , Makoto Sakai , Aiko Hiraga

39. 发明申请

US20100070141A1 Electronic apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20100070141A1
公开(公告)日：2010-03-18
申请号：US12584983
申请日：2009-09-15
申请人： Tatsuki Tanaka , Makoto Sakai , Takashi Inamoto
发明人： Tatsuki Tanaka , Makoto Sakai , Takashi Inamoto
IPC分类号： B60R21/01 , H03H7/01
CPC分类号： B60R21/013
摘要： An electronic apparatus includes an integrated circuit, a capacitor, and first and second wires. The integrated circuit has a terminal connected to a power supply line or a signal line. The capacitor eliminates noise on the power supply line or the signal line. The first wire connects a first end of the capacitor to the terminal of the integrated circuit. The second wire connects a second end of the capacitor to a reference potential. A length of the first wire is substantially equal to a length of the second wire.
摘要翻译：电子设备包括集成电路，电容器以及第一和第二导线。集成电路具有连接到电源线或信号线的端子。电容消除电源线或信号线上的噪声。第一线将电容器的第一端连接到集成电路的端子。第二线将电容器的第二端连接到参考电位。第一线的长度基本上等于第二线的长度。

40. 发明申请

US20090001757A1 SPOILER DEVICE 有权
标题翻译： SPOILER设备
公开(公告)号：US20090001757A1
公开(公告)日：2009-01-01
申请号：US12215391
申请日：2008-06-27
申请人： Kazuki Terakawa , Makoto Sakai
发明人： Kazuki Terakawa , Makoto Sakai
IPC分类号： B62D37/02
CPC分类号： B62D35/007
摘要： According to an aspect of the present invention, a spoiler device for a vehicle for controlling air stream of the vehicle, the spoiler device covering a hinge member and pivoting in response to a pivotal movement of a back door supported by the hinge member in a pivotally movable manner in a vertical direction thereof, includes an upper wall portion adapted to be arranged adjacent to a roof of the vehicle and extending along the roof in a width direction of the vehicle, a lower wall portion formed integrally with the upper wall portion by blow forming and provided between the upper wall portion and a hinge shaft provided at the hinge member, the lower wall portion including an opening at a portion located above the hinge shaft, and a cover fixedly attached to the lower wall portion for covering the opening thereby to cover the hinge member.
摘要翻译：根据本发明的一个方面，一种用于控制车辆空气流的车辆的扰流装置，所述扰流装置覆盖铰链部件，并且响应于由所述铰链部件支撑的后门的枢转运动枢转地枢转包括：上壁部，其适于布置在车辆顶部附近并沿着车辆的宽度方向沿屋顶延伸，下壁部分通过吹动与上壁部分一体地形成形成并设置在上壁部分和设置在铰链部件处的铰链轴之间，下壁部分包括位于铰链轴上方的部分的开口，以及固定地附接到下壁部分以覆盖开口的盖，从而覆盖铰链构件。

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