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    • 32. 发明授权
    • ICs with end gates having adjacent electrically connected field poly
    • 具有端栅的IC具有相邻的电连接场聚
    • US08138074B1
    • 2012-03-20
    • US12939738
    • 2010-11-04
    • James Walter Blatchford
    • James Walter Blatchford
    • H01L21/00
    • H01L27/0207Y10S257/901
    • A method of forming an IC includes forming a first and a second gate portion using a poly mask. The first portion includes a first active poly gate having a line width W1 over an end of a first active area framed by a first active area edge and a first adjacent active field poly feature having a line width 0.8W1 to 1.3W1 in a first field region. The first field poly feature has a horizontal portion and a first extension portion along a gate width direction extending over the first active area edge having a first minimum spacing (S1). The second gate portion includes a second active poly gate over an end of a second active area framed by a second active area edge electrically connected to a second field poly feature in a second field region having a horizontal portion and a second extension portion along a gate width direction extending over the second active area edge having a second minimum spacing (S2). A dummy field poly feature is between the second active poly gate and the second field poly feature. S1≧1.25S2.
    • 一种形成IC的方法包括使用聚合掩模形成第一和第二栅极部分。 第一部分包括第一有源多晶硅栅极,第一有源多晶硅栅极在第一有源区边缘构成的第一有源区的端部上具有线宽度W1,第一有源多晶硅栅极在第一场中具有线宽0.8W1至1.3W1的第一相邻有源场多晶硅特征 地区。 第一场多晶体特征具有沿着栅极宽度方向的水平部分和第一延伸部分,该第一延伸部分在第一有效区域边缘上延伸,具有第一最小间距(S1)。 第二栅极部分包括在第二有源区域的端部上的第二有源多晶硅栅极,该第二有源区域由第二有源区域边缘构成,第二有源区域边缘电连接到具有水平部分的第二场区域中的第二场多晶体特征,以及沿栅极的第二延伸部分 宽度方向在第二有效区域边缘上延伸,具有第二最小间隔(S2)。 第二有源多晶硅栅极和第二场多晶硅层之间的虚场多晶硅特征。 S1≥1.25S2。
    • 34. 发明授权
    • Perturbational technique for co-optimizing design rules and illumination conditions for lithography process
    • 用于光刻工艺共同优化设计规则和照明条件的扰动技术
    • US08607170B2
    • 2013-12-10
    • US13410088
    • 2012-03-01
    • James Walter Blatchford
    • James Walter Blatchford
    • G06F17/50
    • G06F17/5081G03F7/70125G03F7/70433
    • A process of generating design rules, OPC rules and optimizing illumination source models for an integrated circuit layout, to form short lines, terminated lines and crossovers between adjacent parallel route tracks, may include the steps of generating a set of template structures which use a set of characteristic design rules, and performing a plurality of source mask optimization (SMO) operations on the set of template structures with different values for the design rules in each SMO operation. In a first embodiment, the SMO operations are run using a predetermined set of values for each of the design rules, spanning a desired range of design rule values. In a second embodiment, the SMO operations are performed in a conditional iterative process in which values of the design rules are adjusted after each iteration based on results of the iteration.
    • 产生设计规则,OPC规则和优化用于集成电路布局的照明源模型以在相邻并行路径轨道之间形成短线,终止线和交叉的过程可以包括以下步骤:生成使用集合的模板结构集合 的特征设计规则,并且在每个SMO操作中对于设计规则具有不同值的模板结构集合执行多个源掩码优化(SMO)操作。 在第一实施例中,使用针对每个设计规则的预定值来运行SMO操作,跨越期望的设计规则值范围。 在第二实施例中,在条件迭代过程中执行SMO操作,其中基于迭代结果在每次迭代之后调整设计规则的值。
    • 35. 发明授权
    • Two-track cross-connects in double-patterned metal layers using a forbidden zone
    • 使用禁区的双图案金属层中的双轨交叉连接
    • US08461038B2
    • 2013-06-11
    • US13410236
    • 2012-03-01
    • James Walter Blatchford
    • James Walter Blatchford
    • H01L21/3213H01L21/4763H01L21/28
    • H01L23/528G03F7/0035G03F7/70466H01L21/0274H01L21/31144H01L21/76816H01L21/76838H01L2924/0002H01L2924/00
    • An integrated circuit is formed by forming a first interconnect pattern in parallel route tracks, and forming a second interconnect pattern in alternating parallel route tracks. The first interconnect pattern includes a first lead pattern in the parallel route tracks, and the second interconnect pattern includes a second lead pattern in an immediately adjacent route track. The first interconnect pattern includes a crossover pattern which extends from the first lead pattern to the second lead pattern. An exclusion zone in the route track immediately adjacent to the crossover pattern is free of a lead pattern for a lateral distance of two to three times the width of the crossover pattern. Metal interconnect lines are form in the first interconnect pattern and the second interconnect pattern areas, including a continuous metal crossover line through the crossover pattern area. The exclusion zone is free of the metal interconnect lines.
    • 通过在并行路径轨道中形成第一互连图案并且在交替的平行路径轨道中形成第二互连图案来形成集成电路。 第一互连图案包括平行路径轨道中的第一引线图案,并且第二互连图案包括紧邻的路线轨道中的第二引线图案。 第一互连图案包括从第一引线图案延伸到第二引线图案的交叉图案。 紧邻交叉图案的路径轨道中的排除区域不具有横跨距离为交叉图案的宽度的2至3倍的横向距离的引线图案。 金属互连线形成在第一互连图案和第二互连图案区域中,包括通过交叉图案区域的连续金属交叉线。 排除区域不含金属互连线。
    • 36. 发明授权
    • Gate CD control using local design on both sides of neighboring dummy gate level features
    • Gate CD控制采用局部设计,在相邻虚拟门级功能的两侧
    • US08455180B2
    • 2013-06-04
    • US12915974
    • 2010-10-29
    • James Walter BlatchfordYong Seok ChoiThomas J. Aton
    • James Walter BlatchfordYong Seok ChoiThomas J. Aton
    • G03F7/20
    • G03F7/20G03F1/36G03F1/38G06F17/50G06F17/5068H01L21/28123
    • A method of forming an IC including MOS transistors includes using a gate mask to form a first active gate feature having a line width W1 over an active area and a neighboring dummy feature having a line width 0.8W1 to 1.3W1. The neighboring dummy feature has a first side adjacent to the first active gate feature, and a nearest gate level feature on a second side opposite the first side. The neighboring dummy feature defines a gate pitch based on a distance to the first active gate feature or the neighboring dummy feature maintains a gate pitch in a gate array including the first active gate feature. The spacing between the neighboring dummy feature and the nearest gate level feature (i) maintains the gate pitch or (ii) provides a SRAF enabling distance that is ≧2 times the gate pitch and the gate mask includes a SRAF over the SRAF distance.
    • 形成包括MOS晶体管的IC的方法包括使用栅极掩模形成在有源区上具有线宽度W1的第一有源栅极特征和具有线宽0.8W1至1.3W1的相邻虚拟特征。 相邻的虚拟特征具有与第一有效栅极特征相邻的第一侧和与第一侧相对的第二侧上的最近的栅极级特征。 相邻的虚拟特征基于到第一有源栅极特征的距离来限定栅极间距,或者相邻的虚设特征维持包括第一有源栅极特征的栅极阵列中的栅极间距。 相邻虚拟特征和最近的门级特征之间的间隔(i)维持栅极间距,或(ii)提供> = 2倍栅极间距的SRAF使能距离,并且栅极掩模包括在SRAF距离上的SRAF。
    • 37. 发明申请
    • TWO-TRACK CROSS-CONNECT IN DOUBLE-PATTERNED STRUCTURE USING RECTANGULAR VIA
    • 使用矩形横截面的双曲线结构中的双轨交叉连接
    • US20120223439A1
    • 2012-09-06
    • US13410241
    • 2012-03-01
    • James Walter BlatchfordScott William Jessen
    • James Walter BlatchfordScott William Jessen
    • H01L23/522H01L21/768
    • H01L23/481H01L21/76816H01L21/76838H01L21/76895H01L23/5226H01L23/528H01L2924/0002H01L2924/00
    • An integrated circuit may be formed by forming a first interconnect pattern in a first plurality of parallel route tracks, and forming a second interconnect pattern in a second plurality of parallel route tracks, in which the second plurality of route tracks are alternated with the first plurality of route tracks. The first interconnect pattern includes a first lead pattern and the second interconnect pattern includes a second lead pattern, such that the route track containing the first lead pattern is immediately adjacent to the route track containing the second lead pattern. Metal interconnect lines are formed in the first interconnect pattern and the second interconnect pattern. A stretch crossconnect is formed in a vertical connecting level, such as a via or contact level, which electrically connects only the first lead and the second lead. The stretch crossconnect is formed concurrently with other vertical interconnect elements.
    • 可以通过在第一多个平行路径轨道中形成第一互连图案并且在第二多个平行路径轨道中形成第二互连图案来形成集成电路,其中第二多个路线轨道与第一多个平行路线轨道交替 的路线。 第一互连图案包括第一引线图案,并且第二互连图案包括第二引线图案,使得包含第一引线图案的路径轨道紧邻包含第二引线图案的路径轨迹。 金属互连线形成在第一互连图案和第二互连图案中。 拉伸交叉连接形成在仅连接第一引线和第二引线的垂直连接电平,例如通孔或接触电平。 拉伸交叉连接与其他垂直互连元件同时形成。