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    • 33. 发明申请
    • NAND flash memory device and method of fabricating the same
    • NAND闪存器件及其制造方法
    • US20070012979A1
    • 2007-01-18
    • US11483466
    • 2006-07-10
    • Jai-Hyuk SongJeong-Hyuk Choi
    • Jai-Hyuk SongJeong-Hyuk Choi
    • H01L29/94
    • H01L27/115H01L27/11521H01L27/11524
    • A NAND type flash memory device includes a semiconductor substrate, word lines, first and second selection lines, tunnel insulation layers, and selection gate insulation layers. The semiconductor substrate includes a memory transistor region and a selection transistor region. The word lines are arranged in the memory transistor region of the semiconductor substrate, and the selection lines are arranged in the selection transistor region of the semiconductor substrate. The tunnel insulation layers are interposed between the word lines and the semiconductor substrate, and the selection gate insulation layers are interposed between the selection lines and the semiconductor substrate and have a thinner thickness than the thickness of the tunnel insulation layers. Also, the selection gate insulation layers have a thinner thickness in their center region than in their edge portions.
    • NAND型闪速存储器件包括半导体衬底,字线,第一和第二选择线,隧道绝缘层和选择栅极绝缘层。 半导体衬底包括存储晶体管区域和选择晶体管区域。 字线布置在半导体衬底的存储晶体管区域中,并且选择线被布置在半导体衬底的选择晶体管区域中。 隧道绝缘层插在字线和半导体衬底之间,并且选择栅极绝缘层介于选择线和半导体衬底之间,并且具有比隧道绝缘层的厚度更薄的厚度。 此外,选择栅极绝缘层的中心区域的厚度比其边缘部分薄。