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31. 发明授权

US10844468B2 Copper alloy sheet material and current-carrying component 有权
公开(公告)号：US10844468B2
公开(公告)日：2020-11-24
申请号：US14912641
申请日：2014-08-26
申请人： DOWA METALTECH CO., LTD.
发明人： Kuniaki Miyagi , Takashi Suga , Tomotsugu Aoyama , Hiroto Narieda , Hideki Endo , Akira Sugawara
IPC分类号： C22F1/08 , C22C9/00 , C22F1/00 , C22C9/02 , H01B1/02
CPC分类号： C22F1/08 , C22C9/00 , C22C9/02 , C22F1/002 , H01B1/026
摘要： A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P—Fe/3.6)3 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %) ’ 100 is 50% or more. The density of an Fe—P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mm2 or less, and the density of an Mg—P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mm2 or less. The Cu—Fe—P—Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.

32. 发明申请

US20190264313A1 SHEET MATERIAL OF COPPER ALLOY AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20190264313A1
公开(公告)日：2019-08-29
申请号：US16345298
申请日：2017-10-24
申请人： Dowa Metaltech Co., Ltd.
发明人： Naota Higami , Takanobu Sugimoto , Tomotsugu Aoyama , Hiroto Narieda
IPC分类号： C22F1/08 , C22C9/04
摘要： There are provided an inexpensive sheet material of a copper alloy having an excellent bending workability and an excellent stress corrosion cracking resistance while maintaining a high strength, and a method for producing the same. The sheet material of the copper alloy is produced by a method comprising the steps of: melting and casting raw materials of a copper alloy which has a chemical composition comprising 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.01 to 2.0% by weight of silicon, 0.01 to 5.0% by weight of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy in a temperature range of from 900° C. to 400° C.; cooling the hot-rolled copper alloy at a cooling rate of 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at a temperature of 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at a temperature of 300 to 600° C.

33. 发明申请

US20170370015A1 SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20170370015A1
公开(公告)日：2017-12-28
申请号：US15542946
申请日：2016-01-15
申请人： DOWA METALTECH CO., LTD.
发明人： Shunki Sadamori , Hiroshi Miyazawa , Masafumi Ogata , Keisuke Shinohara
IPC分类号： C25D3/46 , H01R4/58 , H01H1/025 , C25D7/00 , C25D5/00 , H01R13/03 , B32B15/01
CPC分类号： C25D3/46 , B32B15/018 , C25D3/12 , C25D5/00 , C25D5/12 , C25D7/00 , H01H1/025 , H01H2011/046 , H01R4/58 , H01R13/03 , Y10T428/12896
摘要： A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm2 in a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

34. 发明授权

US09646739B2 Method for producing silver-plated product 有权
公开(公告)号：US09646739B2
公开(公告)日：2017-05-09
申请号：US14348118
申请日：2012-09-20
申请人： DOWA METALTECH CO., LTD.
发明人： Keisuke Shinohara , Masafumi Ogata , Hiroshi Miyazawa , Akira Sugawara
IPC分类号： H01B13/00 , H01B5/14 , H01B1/02 , C22C5/06 , C23C30/00 , C25D3/46 , C25D7/00 , C23C28/02 , H01R13/03 , H01H1/023 , H01H11/04 , H01R43/16 , C25D5/34
CPC分类号： H01B5/14 , C22C5/06 , C23C28/02 , C23C28/021 , C23C28/023 , C23C30/00 , C23C30/005 , C25D3/46 , C25D5/34 , C25D7/00 , H01B1/02 , H01B13/00 , H01H1/023 , H01H11/041 , H01R13/03 , H01R43/16 , Y10T428/12882
摘要： There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40% or more.

35. 发明申请

US20170122681A1 HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20170122681A1
公开(公告)日：2017-05-04
申请号：US15278340
申请日：2016-09-28
申请人： DOWA METALTECH CO., LTD.
发明人： Tomotsugu Aoyama , Akira Sugawara
IPC分类号： F28F21/08 , C22C9/02 , B21B3/00 , H01L23/373 , H01L21/48 , C22F1/08 , H01L23/367
CPC分类号： F28F21/085 , B21B3/00 , B21B2003/005 , B21B2261/22 , C22C9/02 , C22F1/08 , H01L21/4878 , H01L23/367 , H01L23/3736
摘要： In a method for producing a heat radiating plate 20, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler 10 to obtain a strip 12; causing the strip 12 to pass through a gap between the rolls of a leveler 14 to correct the shape thereof; progressively feeding the corrected strip 12 to a progressive die 18 via a feeder 16 to progressively press-working the strip 12 to produce a heat radiating plate 20, the finish cold-rolling is carried out so that a ratio of the Vickers hardness HV after the finish cold-rolling to the Vickers hardness HV before the finish cold-rolling is not less than 1.2, and the corrected strip 12 is allowed to bend due to its own weight between the leveler 14 and the feeder 16 so that the minimum value of deflection (L1−L0) is 0.5 to 2.0 m assuming that L0 is a distance between a roll at the last sending side of the leveler 14 and a roll at the first entrance side of the feeder 16 and that L1 is the length of the strip 12 between the roll at the last sending side of the leveler 14 and the roll at the first entrance side of the feeder 16.

36. 发明授权

US09412482B2 Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same 有权
标题翻译： Cu-Ni-Co-Si系铜合金板材及其制造方法
公开(公告)号：US09412482B2
公开(公告)日：2016-08-09
申请号：US14068256
申请日：2013-10-31
申请人： DOWA METALTECH CO., LTD.
发明人： Toshiya Kamada , Takashi Kimura , Weilin Gao , Fumiaki Sasaki , Akira Sugawara
IPC分类号： C22C9/06 , H01B1/02 , C22F1/08
CPC分类号： H01B1/026 , C21D2201/05 , C21D2211/004 , C22C9/06 , C22F1/08
摘要： A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}≧3.0 (1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.
摘要翻译： Cu-Ni-Co-Si系铜合金板材具有存在于基体中的第二相粒子，超细二次粒子的数量密度为1.0×10 9个/ mm 2以上。细密度的第二相颗粒的密度不超过5.0×10 7个/ mm 2。粗二次粒子的数密度为1.0×10 5个/ mm 2以上且1.0×10 6个/ mm 2以下。该材料具有满足以下等式（1）的晶体取向：I {200} / I0 {200}≥3.0（1）其中I {200}表示{200}晶面的X射线衍射峰的积分强度在片材表面上; I0 {200}表示纯铜标准粉末样品中{200}晶面的X射线衍射峰的积分强度。

37. 发明申请

US20140291159A1 PARTIAL PLATING DEVICE AND PARTIAL PLATING METHOD 有权
标题翻译：部分镀层器件和部分镀层法
公开(公告)号：US20140291159A1
公开(公告)日：2014-10-02
申请号：US14351713
申请日：2012-10-18
申请人： DOWA METALTECH CO., LTD.
发明人： Kentaro Arai , Hiroshi Miyazawa
IPC分类号： C25D17/06
CPC分类号： C25D17/06 , C25D5/022 , C25D7/0635 , C25D7/0671 , C25D7/0685 , C25D17/00
摘要： A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.
摘要翻译：局部电镀装置包括滚筒夹具，该滚筒夹具具有设置在其外周面上的多个定位销，并且通过使金属构件与定位销接合而将金属构件周向地供给金属构件; 可旋转地支撑滚筒夹具的旋转轴，向金属构件供应电镀液体的喷射单元，以及减小滚筒夹具的圆周速度并且安装在旋转轴上的制动单元。电镀装置和部分电镀方法，其中在滚筒夹具的承载侧的金属构件的第一区域上不进行电镀，但是在金属构件的第二区域上进行电镀执行方面。

38. 发明申请

US20140248809A1 FITTING TYPE CONNECTING TERMINAL AND METHOD FOR PRODUCING SAME 有权
标题翻译：连接型连接端子及其制造方法
公开(公告)号：US20140248809A1
公开(公告)日：2014-09-04
申请号：US14351586
申请日：2012-10-10
申请人： DOWA METALTECH CO., LTD , YAZAKI CORPORATION
发明人： Akifumi Onodera , Masatoshi Nakamura , Akira Sugawara , Hiroto Narieda
IPC分类号： H01R13/02 , H01R43/16
CPC分类号： H01R13/02 , H01R13/03 , H01R13/187 , H01R43/16 , Y10T29/49224
摘要： In a fitting type connecting terminal having male and female terminals, each of which has a tin plating layer formed on an electrically conductive base material, a surface of a contact portion of one of the male and female terminals with the other thereof has a plurality of grooves or recessed portions which are spaced from each other in longitudinal directions, and the grooves or recessed portions are formed so as to satisfy d≦b, d≦a≦L and a+c≦L assuming that the width of each of the grooves or recessed portions is a (μm), the depth thereof being b (μm), the distance between two of the grooves or recessed portions adjacent to each other in the longitudinal directions being c (μm), the sliding distance producible between the male terminal and the female terminal in a state that the male terminal is fitted into and fixed to the female terminal being L (μm), and the maximum grain size of the oxide of abrasion powder producible due to sliding between the male terminal and the female terminal being d (μm).
摘要翻译：在具有阳，阴端子的配合型连接端子中，每个具有形成在导电基材上的镀锡层，其中一个阳，阴端子的一个接触部分的表面与另一个具有多个凹槽或凹部在纵向上彼此间隔开，并且凹槽或凹部形成为满足d＆nlE; b，d＆nlE; a＆nlE; L和a + c＆nlE; L，假设每个凹槽的宽度或凹部为（μm），其深度为b（μm），在长度方向上彼此相邻的两个槽或凹部之间的距离为c（μm），在公端子之间产生的滑动距离并且在母端子嵌入并固定到母端子的状态下的母端子为L（μm），并且由于阳端子之间的滑动而可生产的磨损粉末的氧化物的最大晶粒尺寸女性终端为d（μm）。

39. 发明申请

US20140083671A1 HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：热辐射板及其制造方法
公开(公告)号：US20140083671A1
公开(公告)日：2014-03-27
申请号：US14036551
申请日：2013-09-25
申请人： DOWA METALTECH CO., LTD.
发明人： Satoru Ideguchi , Hideyo Osanai , Hirotaka Kotani
IPC分类号： F28F21/08
CPC分类号： F28F21/08 , H01L21/4871 , H01L21/4882 , H01L23/367 , H01L23/3672 , H01L23/3677 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
摘要翻译：金属材料的散热板10包括平板部分10a，从平板部分的一个主表面突出并与平板部分一体化的多个柱状突出部分10b，以及加强板部件 12，其具有比平板部分和柱状突出部分更高的熔点，并且布置在布置在平板部分中并且靠近平板的一个主表面的区域中所述加强构件穿过所述平板部分，以在大致平行于所述平板部分的一个主表面的方向延伸并且具有暴露于外部的端面，除了所述端面之外的加强构件的整个表面被接合直接到平板部分。

40. 发明授权

US12049690B2 Copper alloy plate and method for producing same 有权
公开(公告)号：US12049690B2
公开(公告)日：2024-07-30
申请号：US17602391
申请日：2020-01-30
申请人： DOWA METALTECH CO., LTD.
发明人： Kazuki Yoshida , Takanobu Sugimoto , Tomotsugu Aoyama , Hiroto Narieda
IPC分类号： C22F1/08 , C22C9/04
CPC分类号： C22F1/08 , C22C9/04
摘要： There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

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