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    • 38. 发明申请
    • ALUMINUM PRINTED CIRCUIT BOARD FOR LIGHTING AND DISPLAY BACKPLANES
    • 用于照明和显示背板的铝印刷电路板
    • WO2014121191A1
    • 2014-08-07
    • PCT/US2014/014428
    • 2014-02-03
    • CRYSTALPLEX CORPORATION
    • FREEMAN, William R.
    • H01L23/62F21V7/20
    • F21K9/20H01L33/486H01L33/54H01L33/641H01L2224/48091H01L2224/49109H05K1/053H05K2201/09745H05K2201/10106H01L2924/00014
    • Metal printed circuit boards, particularly aluminum based printed circuit boards are provided. Methods of making the metal printed circuit boards are also provided. Lighting systems, such as LED lighting systems, employing the disclosed metal printed circuit boards are also provided. Some embodiments include a method comprising screen printing on a mask; anodizing the aluminum with a rather thick layer (70um to 80um) of anodization to form a dielectric layer; patterning the anodized layer exposing the areas where traces and pads will later be located; zincating in preparation for electroless nickel (EN) deposition. The zincation step requires that the nitric acid etch is either eliminated or made less aggressive so that it does not remove significant amounts of the anodized dielectric layer. The zincate treatment itself removes some anodization (about 40um), which was the motivation for the excessively thick initial anodized layer; and EN plate deposition to desired thickness.
    • 提供金属印刷电路板,特别是铝基印刷电路板。 还提供了制造金属印刷电路板的方法。 还提供了采用公开的金属印刷电路板的诸如LED照明系统的照明系统。 一些实施例包括包括在掩模上的丝网印刷的方法; 用相当厚的阳极氧化层(70um至80um)阳极氧化铝以形成电介质层; 图案化阳极氧化层,暴露稍后将放置痕迹和垫的区域; 锌化制备无电镀镍(EN)沉积。 锌化步骤需要硝酸蚀刻被消除或制成较少侵蚀性,使得它不会去除大量的阳极化电介质层。 锌酸盐处理本身消除了一些阳极氧化(约40um),这是过厚的初始阳极氧化层的动机; 和EN板沉积到所需的厚度。