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    • 38. 发明公开
    • APPARATUS FOR THERMAL TREATMENT OF THIN FILM WAFER
    • 用于热处理薄膜晶片的装置
    • EP0702775A1
    • 1996-03-27
    • EP95911781.0
    • 1995-02-15
    • VARIAN ASSOCIATES, INC.
    • KYUNG, Hyun-SuCHOI, Won-SongSHIN, Jung-Ho
    • C30B25C30B31C30B35H01L21
    • H01L21/67115C30B25/12C30B31/14C30B35/005
    • The apparatus of the present invention is for the thermal treatment of a thin film wafer (200) and includes a vacuum chamber, a heater block (52), a holding clamp (60) for receiving the heater block and for holding a wafer (200) and which includes a specific weight to press the wafer against the heater block, a wafer supply means (70) for supplying the wafer to, positioning the wafer on and removing the wafer from the holding clamp, and an elevator means (80) for moving the holding clamp toward and away from the heater block to permit thermal treatment of the wafer in the vacuum chamber. The present invention advantageously supplies and removes the wafer together with minimizing damage to the wafer due to excess clamping force.
    • 本发明的设备用于薄膜晶片(200)的热处理并且包括真空室,加热器块(52),用于接收加热器块和用于保持晶片(200)的保持夹具(60) ),并且包括用于将晶片压向加热器块的特定重量;用于供应晶片的晶片供应装置(70);用于将晶片定位在保持夹具上并将晶片从保持夹具上取下的装置;以及升降装置(80),用于 使保持夹朝向和远离加热器块移动,以允许真空室中的晶片的热处理。 本发明有利地提供和移除晶片,同时最小化由于过量的夹持力而导致的晶片损坏。