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31. 发明专利

AU2005203591A1 Circuit module system and method 未知
公开(公告)号：AU2005203591A1
公开(公告)日：2006-03-23
申请号：AU2005203591
申请日：2005-08-11
申请人： STAKTEK GROUP LP
发明人： CADY JAMES W , WEHRLY JAMES DOUGLAS JR , GOODWIN PAUL
IPC分类号： H05K1/02 , G11C5/00 , H01L23/538 , H01L25/10 , H05K1/11 , H05K1/18
摘要： A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

32. 发明专利

AU2003304192A1 MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD 未知
公开(公告)号：AU2003304192A1
公开(公告)日：2005-01-04
申请号：AU2003304192
申请日：2003-09-15
申请人： STAKTEK GROUP LP
发明人： WEHRLY JAMES DOUGLAS JR , BUCHLE JEFF , RAPPORT RUSSELL , CADY JAMES W , WILDER JAMES , ROPER DAVID L
IPC分类号： H01L21/44 , H01L23/31 , H01L23/498 , H01L23/50 , H01L23/538 , H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/36
摘要： The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the other. The two CSPs are connected with flex circuitry. A form standard is disposed between the flex circuitry and a CSP in the stack. The form standard can take many configurations and may be used where flex circuits are used to connect CSPs to one another in stacked modules having two or more constituent CSPs. For example, in stacked modules that include four CSPs, three form standards are employed in preferred embodiments, although fewer may be used. The form standard provides a thermally conductive physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.

33. 发明申请

WO2006028693A3 STACKED INTEGRATED CIRCUIT CASCADE SIGNALING SYSTEM AND METHOD 审中-公开
标题翻译：堆叠集成电路CASCADE信号系统和方法
公开(公告)号：WO2006028693A3
公开(公告)日：2009-09-03
申请号：PCT/US2005029867
申请日：2005-08-23
申请人： STAKTEK GROUP LP , CADY JAMES , RAPPORT RUSSELL , WILDER JAMES
发明人： CADY JAMES , RAPPORT RUSSELL , WILDER JAMES
IPC分类号： H01L23/02 , H01L21/44 , H01L21/4763 , H01L21/48 , H01L21/50 , H01L23/04 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/105 , H01L23/4985 , H01L2225/107 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Integrated circuits (ICs) are stacked into modules that conserve PCB or other board surface area. The modules provide for lower capacitance memory signaling systems and methods for connecting stacked CSPs in a serial cascade arrangement. In one preferred embodiment, on-die terminations are used selectively to terminate a cascaded series of conductive paths. In another preferred embodiment, a form standard provides a physical form that allows many of the varying package sizes found in a broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.
摘要翻译：集成电路（IC）堆叠成可以节省PCB或其他板表面积的模块。这些模块提供了较低电容存储器信号系统和用于以串联级联布置连接堆叠CSP的方法。在一个优选实施例中，选择性地使用管芯端子来终止级联的导电路径。在另一个优选实施例中，形式标准提供了一种物理形式，其允许在采用标准连接柔性电路设计的同时，在宽范围的CSP封装系列中发现许多变化的封装尺寸。

34. 发明申请

WO2007136928A3 LOW PROFILE MANAGED MEMORY COMPONENT 审中-公开
标题翻译：低配置文件管理的内存组件
公开(公告)号：WO2007136928A3
公开(公告)日：2008-05-02
申请号：PCT/US2007065009
申请日：2007-03-27
申请人： STAKTEK GROUP LP , WEHRLY JAMES DOUGLAS JR , SZEWERENKO LELAND , HASKELL BERT
发明人： WEHRLY JAMES DOUGLAS JR , SZEWERENKO LELAND , HASKELL BERT
IPC分类号： G06F12/00 , H01L21/70 , H01L23/02 , H01L25/00
CPC分类号： G11C5/04 , H01L23/13 , H01L23/5387 , H01L23/5388 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method for combining at least two semiconductor die (12, 12FC, 14, 14FC) using multi-layer flex circuitry is provided. A first semiconductor die (12, 12FC) is attached and preferably electrically connected to a first layer of the flex circuitry (20) while a second semiconductor die (14, 14FC) is set, at least in part, into a window (FW) that extends into the flex circuitry (20) to expose a layer of the flex to which the second die (14, 14FC) is attached. When the second semiconductor die (14, 14FC) is a flip-chip device, it is connected through its contacts to the layer of flex exposed in the window and when it is a die with its contact side oriented away from the flex circuitry (20), it is preferably electrically connected with wire bonds to another conductive layer of the flex circuitry (20).
摘要翻译：提供了一种使用多层柔性电路组合至少两个半导体管芯（12,12FC，14,14FC）的系统和方法。第一半导体管芯（12,12FC）被附接并且优选地电连接到柔性电路（20）的第一层，而第二半导体管芯（14,14FC）至少部分地被设置到窗口（FW）中，其延伸到柔性电路（20）中以暴露第二管芯（14,14FC）附接到的柔性层。当第二半导体管芯（14,14FC）是倒装芯片器件时，其通过其触点连接到暴露在窗口中的柔性层，并且当其是其接触侧定向远离柔性电路（20 ），其优选地与引线键合电连接到柔性电路（20）的另一导电层。

35. 发明申请

WO2006121487A3 CIRCUIT MODULE WITH THERMAL CASING SYSTEMS AND METHODS 审中-公开
标题翻译：具有热壳系统和方法的电路模块
公开(公告)号：WO2006121487A3
公开(公告)日：2007-11-22
申请号：PCT/US2006007004
申请日：2006-02-28
申请人： STAKTEK GROUP LP , WEHRLY JAMES DOUGLAS JR , WILDER JAMES , WOLFE MARK , GOODWIN PAUL
发明人： WEHRLY JAMES DOUGLAS JR , WILDER JAMES , WOLFE MARK , GOODWIN PAUL
IPC分类号： H01L23/34
CPC分类号： H05K1/189 , H05K1/0203 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且一个或多个散热器布置成与模块的组成集成电路中的至少一些热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

36. 发明申请

WO2006121486A3 HIGH CAPACITY THIN MODULE SYSTEM AND METHOD 审中-公开
标题翻译：高容量薄模块系统和方法
公开(公告)号：WO2006121486A3
公开(公告)日：2007-07-26
申请号：PCT/US2006006921
申请日：2006-02-28
申请人： STAKTEK GROUP LP , WEHRLY JAMES DOUGLAS JR , WILDER JAMES , GOODWIN PAUL , WOLFE MARK
发明人： WEHRLY JAMES DOUGLAS JR , WILDER JAMES , GOODWIN PAUL , WOLFE MARK
IPC分类号： H05K1/14
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路装有集成电路，沿其主要一侧或两侧布置。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且包括当柔性电路产生时设置在较高热能装置（例如AMB）附近的高导热性芯或区域底物。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

37. 发明申请

WO2007044368A3 MINIMIZED PROFILE CIRCUIT MODULE SYSTEMS AND METHODS 审中-公开
标题翻译： MINIMISED PROFILE电路模块系统和方法
公开(公告)号：WO2007044368A3
公开(公告)日：2007-06-21
申请号：PCT/US2006038720
申请日：2006-10-03
申请人： STAKTEK GROUP LP , CADY JAMES W , WEHRLY JAMES DOUGLAS , GOODWIN PAUL
发明人： CADY JAMES W , WEHRLY JAMES DOUGLAS , GOODWIN PAUL
IPC分类号： H05K3/30 , A41C1/06 , A41C3/00 , H01L21/00 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40 , H01R13/405 , H05K3/34
CPC分类号： G11C5/143 , G11C5/04 , H01L23/5387 , H01L25/0652 , H01L25/105 , H01L25/50 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K1/189 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , Y10T29/4913 , Y10T29/49179 , H01L2924/00
摘要： Flexible circuitry is populated on one or both sides with integrated circuits (ICs) each of which ICs has an IC profile (height). A substantially flat, windowed fixture with a fixture profile less than the IC profiles of the ICs is applied over an IC-populated side of the flexible circuitry causing at least a part of the ICs to emerge from respective fixture windows. Material is removed simultaneously from that portion of the ICs that emerge from the windows to result in lower-profile ICs which, in a preferred embodiment exhibit profiles substantially coincident with the fixture profile established by the upper surface of the fixture. The method is used to advantage in devising circuit modules by disposing the flexible circuitry about a rigid substrate to form the circuit module with a low profile. Some embodiments use substrates that are windowed or have inset areas into which the lower profile CSPs may be set to reach profile requirements.
摘要翻译：柔性电路在一侧或两侧装有集成电路（IC），每个集成电路具有IC轮廓（高度）。具有小于IC的IC轮廓的夹具轮廓的基本平坦的窗口夹具被施加在柔性电路的IC填充侧上，使得至少一部分IC从相应的夹具窗口出现。材料从IC中从窗口露出的那部分同时被移除，以产生较低轮廓的IC，在一个优选实施例中，该IC具有与由夹具的上表面建立的夹具轮廓基本一致的轮廓。通过将柔性电路设置在刚性基板周围以形成低剖面的电路模块，该方法有利于设计电路模块。一些实施例使用被加窗或具有可以设置较低轮廓CSP的嵌入区域的基板以达到轮廓要求。

38. 发明申请

WO2006028643A3 CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：电路模块系统和方法
公开(公告)号：WO2006028643A3
公开(公告)日：2006-11-30
申请号：PCT/US2005028547
申请日：2005-08-10
申请人： STAKTEK GROUP LP , GOODWIN PAUL , CADY JAMES , WEHRLY JAMES DOUGLAS JR
发明人： GOODWIN PAUL , CADY JAMES , WEHRLY JAMES DOUGLAS JR
IPC分类号： H05K7/20 , G11C5/00 , H01L25/10 , H05K1/02 , H05K1/11 , H05K1/18
CPC分类号： H05K1/189 , G11C5/04 , H01L25/105 , H01L2224/16 , H01L2924/00014 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , H01L2224/0401
摘要： Flexible circuitry (12) is populated with integrated circuits (18), (ICs) disposed along one or both of its major sides. Contacts (20) distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate (14) thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.
摘要翻译：柔性电路（12）中装有集成电路（18），（IC），沿其主要侧面或其两侧设置。沿柔性电路分布的触点（20）提供与IC的连接。优选地，柔性电路围绕刚性的导热基板（14）的边缘设置，从而将集成电路放置在基板的一侧或两侧上，在该基板的一侧或两侧上具有一层或两层集成电路。在替代方案中，也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在基板中的窗口，凹穴或切口区域中。其他实施例可以仅填充柔性电路的一侧或者可以移除衬底材料以减少模块轮廓。在优选实施例中，沿着柔性电路分布的触点被配置为插入到诸如在通用和服务器计算机中找到的边缘连接器插座中。优选的衬底由导热材料构成。预期在优选实施例中，来自衬底的延伸可以减少热模块负载并且促进在操作期间模块的集成电路之间的热变化减小。

39. 发明申请

WO2006124085A2 MEMORY MODULE SYSTEM AND METHOD 审中-公开
标题翻译：存储器模块系统和方法
公开(公告)号：WO2006124085A2
公开(公告)日：2006-11-23
申请号：PCT/US2006004690
申请日：2006-02-09
申请人： STAKTEK GROUP LP , RAPPORT RUSSELL , GOODWIN PAUL , CADY JAMES W
发明人： RAPPORT RUSSELL , GOODWIN PAUL , CADY JAMES W
IPC分类号： H01L23/495
CPC分类号： H05K1/117 , G11C5/04 , H01L2924/0002 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/0061 , H05K3/4691 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/10189 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572 , H01L2924/00
摘要： A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.
摘要翻译：提供了一种电路模块，其中两个辅助基板或卡或刚性柔性组件的刚性部分填充有集成电路（IC）。辅助基板与柔性电路连接。柔性电路的一侧具有适于连接到边缘连接器的触点。柔性电路围绕优选金属衬底的边缘缠绕，以将两个次要衬底中的一个设置在衬底的第一侧上，并且在衬底的第二侧上设置另一个辅助衬底。

40. 发明申请

WO2006121478A2 SYSTEM COMPONENT INTERPOSER 审中-公开
标题翻译：系统组件插件
公开(公告)号：WO2006121478A2
公开(公告)日：2006-11-16
申请号：PCT/US2006004676
申请日：2006-02-09
申请人： STAKTEK GROUP LP , GOODWIN PAUL
发明人： GOODWIN PAUL
IPC分类号： H05K7/02
CPC分类号： H01L25/105 , H01L2224/16225 , H01L2224/73253 , H01L2225/107 , H01L2225/1094 , H01L2924/00014 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/0058 , H05K3/3436 , H05K3/363 , H05K2201/10734 , H05K2201/2009 , H05K2201/2018 , H05K2203/1572 , H05K2203/302 , H01L2224/0401
摘要： In some embodiments, a high density circuit module is provided having a support frame supporting a flexible circuit. A main integrated circuit and one or more supporting integrated circuit are mounted to the flexible circuit. Electrical connections between the main integrated circuit and the one or more integrated circuits are made on the flexible circuit. In other embodiments, a main integrated circuit such as, for example, a network processor, is mounted to a flexible circuit. Supporting integrated circuits, such as, for example, memory devices used by the network processor, are mounted on side portions of the flexible circuit. The side portions are folded to place the supporting integrated circuits higher than the main integrated circuit. Such placement may direct cooling airflow over the main integrated circuit's heat sink.
摘要翻译：在一些实施例中，提供了具有支撑柔性电路的支撑框架的高密度电路模块。主要集成电路和一个或多个支持集成电路安装到柔性电路。主集成电路和一个或多个集成电路之间的电连接在柔性电路上制成。在其他实施例中，诸如网络处理器的主要集成电路安装到柔性电路。支持集成电路，例如网络处理器使用的存储器件，安装在柔性电路的侧部上。侧面部分被折叠以使支撑集成电路比主集成电路高。这种放置可以引导主集成电路的散热器上的冷却气流。

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