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    • 31. 发明公开
    • Headphone
    • 耳机
    • EP2894875A1
    • 2015-07-15
    • EP14176052.0
    • 2014-07-08
    • Cheng Uei Precision Industry Co., Ltd.
    • Chang, Yu ChaoLee, Tsung Chieh
    • H04R1/10H04R5/033
    • H04R1/1058H04R1/1008H04R1/1041H04R1/1066H04R5/033H04R5/0335H04R2420/07
    • A headphone includes a headphone assembly which includes a head band, two joining structures and two in-ear components pivoted to two ends of the head band by the joining structures, and a sensor module which is disposed in the headphone assembly and includes an upper part, a lower part and a press sensor disposed between the upper part and the lower part and having a sensing face. The upper part and the lower part are designated with inner structures of the head band or the in-ear components. The press sensor detects the states of the headphone by judging whether the sensing face is pressed by the upper or lower part by virtue of elastic deformation or movement of the upper part and the lower part at the head band and the joining structure while wearing and removing the headphone. The headphone reacts the signals received from the press sensor to control actions thereof.
    • 一种头戴式耳机,包括头戴式耳机组件,头戴式耳机组件包括头带,两个接合结构和通过接合结构枢转到头带两端的两个入耳式部件,以及传感器模块,设置在头戴式耳机组件中并包括上部 ,下部和设置在上部和下部之间并具有感测面的按压传感器。 上部和下部指定头带或耳内部件的内部结构。 压力传感器通过判断感应面是由上部还是下部按压而检测头戴式耳机的状态,这是由于上部和下部在头带处的弹性变形或移动以及佩带和移除时的头带和接合结构 耳机。 耳机响应从按压传感器接收的信号以控制其动作。