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21. 发明申请

US20180138143A1 WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES 审中-公开
公开(公告)号：US20180138143A1
公开(公告)日：2018-05-17
申请号：US15852876
申请日：2017-12-22
申请人： LOCKHEED MARTIN CORPORATION
发明人： Randall Mark STOLTENBERG , Alfred A. ZINN
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45193 , H01L2224/45664 , H01L2224/48091 , H01L2224/48465 , H01L2224/49096 , H01L2224/49175 , H01L2224/7815 , H01L2224/7825 , H01L2224/78301 , H01L2224/78601 , H01L2224/78611 , H01L2224/8502 , H01L2224/851 , H01L2224/85205 , H01L2224/8584 , H01L2224/8593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/05599 , H01L2924/20751 , H01L2924/20752 , H01L2224/85399
摘要： Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

22. 发明申请

US20160148898A1 WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS 有权
标题翻译：用于电线连接装置的电线系统
公开(公告)号：US20160148898A1
公开(公告)日：2016-05-26
申请号：US14549771
申请日：2014-11-21
申请人： Chi Wah CHENG , Hon Kam NG
发明人： Chi Wah CHENG , Hon Kam NG
IPC分类号： H01L23/00 , B65H59/00 , B65H51/20 , B65H63/06 , B65H51/02
CPC分类号： H01L24/78 , B65H51/02 , B65H51/20 , B65H59/00 , B65H63/02 , B65H63/06 , B65H2553/42 , B65H2701/361 , H01L2224/45014 , H01L2224/7855 , H01L2224/78601 , H01L2224/78611 , H01L2224/78901 , H01L2924/00014 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path.
摘要翻译：公开了一种用于引线接合装置的线卷轴系统，包括：布置成接收线的线卷轴; 用于将线的自由端馈送到引线接合装置的接合头的线引导件; 以及张紧机构，用于拉紧所述线以限定所述线卷轴和所述导线器之间的线路径。线滑系统包括成像模块，该成像模块包括具有图像传感器的相机。成像模块还包括图像处理单元。定位摄像机通过所述图像传感器对所述线路的至少一部分进行成像以产生图像数据。图像处理单元被配置为处理图像数据以确定线路的至少一部分的几何形状和/或几何形状的变化。

23. 发明授权

US08919632B2 Method of detecting wire bonding failures 有权
标题翻译：检测引线接合故障的方法
公开(公告)号：US08919632B2
公开(公告)日：2014-12-30
申请号：US13673558
申请日：2012-11-09
申请人： ASM Technology Singapore PTE Ltd
发明人： Wei Liu , Qian Zhang , Joon Ho Lee , Jung Min Kim
IPC分类号： B23K31/12 , B23K31/02 , B23K3/08
CPC分类号： B23K3/08 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/78301 , H01L2224/78353 , H01L2224/78601 , H01L2224/78801 , H01L2224/7892 , H01L2224/85205 , H01L2224/859 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate.
摘要翻译：公开了一种检测引线接合器的接合故障的方法，其包括可使用接合线在半导体管芯和衬底之间形成电连接的接合工具。该方法包括以下步骤：使用接合工具和接合线在位于半导体管芯上的第一表面上形成第一引线接合; 使用所述接合工具和所述接合线在所述基板上的第二表面上形成第二引线接合，使得所述引线环连接所述第一和第二引线接合，其中所述第一表面不导电; 使接合工具沿远离第二引线接合的方向移动，以使接合线从第二引线键断开; 检测第二引线键是否保持结合到基板上; 以及如果所述第二引线接合不再结合到所述基板上，则确定所述接合故障的发生。

24. 发明申请

US20140332583A1 WIRE BONDING APPARATUS 审中-公开
标题翻译：电线连接装置
公开(公告)号：US20140332583A1
公开(公告)日：2014-11-13
申请号：US14339632
申请日：2014-07-24
申请人： SHINKAWA LTD.
发明人： Toru MAEDA
IPC分类号： H01L23/00
CPC分类号： H01L24/78 , B23K20/004 , H01L24/45 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/7801 , H01L2224/78301 , H01L2224/78601 , H01L2224/78611 , H01L2224/85013 , H01L2924/00014 , H01L2924/00015 , H01L2224/48 , H01L2924/00
摘要： Provided is a wire bonding apparatus including: a base (11); a bonding head (13) configured to move a capillary (15) in X, Y, and Z directions with respect to the base (11); and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes: hollow casings (31a), (31b) in which an inert gas is introduced so that an internal pressure is higher than an atmospheric pressure; holes (33a), (33b) respectively provided in the casings (31a), (31b) so that the wire (21) is inserted therebetween; and electrodes for plasma respectively disposed within the casings (31a), (31b) around circumferences of the holes (33a), (33b). The wire (21) is cleaned by having the wire (21) be inserted into plasma generated within the casings (31a), (31b) in a state in which air is not contained. With this, a surface of the wire used for wire bonding can be effectively cleaned.
摘要翻译：提供一种引线接合装置，包括：基座（11）; 结合头（13），其构造成相对于所述基部（11）在X，Y和Z方向上移动毛细管（15）; 和线清洁等离子体单元（30）。线清洗等离子体单元（30）包括：中空壳体（31a），（31b），其中引入惰性气体以使内部压力高于大气压力; 分别设置在壳体（31a），（31b）中的孔（33a），（33b），使得线（21）插入其间; 以及分别设置在孔（33a），（33b）周围的壳体（31a），（31b）内的等离子体用电极。在未包含空气的状态下，通过使导线（21）插入在壳体（31a），（31b）内产生的等离子体来清洁导线（21）。由此，可以有效地清洁用于引线接合的线的表面。

25. 发明授权

US06866148B2 Spool case for bonding wire, and method of handling spool using same 失效
标题翻译：用于接合线的线轴箱，以及使用它的处理线轴的方法
公开(公告)号：US06866148B2
公开(公告)日：2005-03-15
申请号：US10285196
申请日：2002-10-31
申请人： Chang Man You , Jung Woo Back
发明人： Chang Man You , Jung Woo Back
IPC分类号： B65D85/04 , B65H49/38 , B65H75/02 , B65H75/38 , H01L21/60 , B65D85/67
CPC分类号： B65D85/04 , B65H49/38 , B65H2407/51 , B65H2701/361 , H01L2224/78601 , H01L2224/851 , H01L2924/01078
摘要： A bonding wire spool case, and a method of handling a spool using the spool case, with a structure capable of effectively preventing the durability and the holding of the spool from being deteriorated due to the repeated coupling and decoupling operations of the spool with respect to the spool holder while preventing the bonding wire from being contaminated and damaged due to the carelessness of the worker. The bonding wire spool case includes a base having a bottom portion, a sidewall protruding from the bottom portion in a body at four sides thereof while internally forming a spool receipt portion, and a holder entrance formed at one or more sides of the sidewall to pass a spool holder. A spool wound with a bonding wire thereon is mounted to the spool receipt portion in the horizontal direction such that the central axis of the spool is maintained to be parallel to the bottom portion of the base. A cover is coupled to the base at the outer surface of the sidewall while preventing foreign material such as dust from being introduced.
摘要翻译：接合线卷轴壳体以及使用卷轴壳体处理卷轴的方法，具有能够有效地防止卷轴的耐久性和保持性的结构由于卷轴相对于卷轴的重复的耦合和解耦操作而劣化的结构卷轴保持器，同时防止接合线被工作人员粗心的污染和损坏。接合线卷轴壳体包括底部，底部具有从主体的底部的四个侧面突出的侧壁，同时内部形成卷轴接收部分，以及形成在侧壁的一侧或多侧的保持器入口以通过卷轴支架在其上缠绕有接合线的线轴在水平方向上安装到线轴接收部分，使得线轴的中心轴线保持平行于基座的底部。盖子在侧壁的外表面处连接到基座，同时防止诸如灰尘的异物被引入。

26. 发明申请

US20030080011A1 Spool case for bonding wire, and method of handling spool using same 失效
标题翻译：用于接合线的线轴箱，以及使用它的处理线轴的方法
公开(公告)号：US20030080011A1
公开(公告)日：2003-05-01
申请号：US10285196
申请日：2002-10-31
申请人： W. C. Heraeus GmbH & Co. KG
发明人： Chang Man You , Jung Woo Back
IPC分类号： B65D085/66
CPC分类号： B65D85/04 , B65H49/38 , B65H2407/51 , B65H2701/361 , H01L2224/78601 , H01L2224/851 , H01L2924/01078
摘要： A bonding wire spool case, and a method of handling a spool using the spool case, with a structure capable of effectively preventing the durability and the holding of the spool from being deteriorated due to the repeated coupling and decoupling operations of the spool with respect to the spool holder while preventing the bonding wire from being contaminated and damaged due to the carelessness of the worker. The bonding wire spool case includes a base having a bottom portion, a sidewall protruding from the bottom portion in a body at four sides thereof while internally forming a spool receipt portion, and a holder entrance formed at one or more sides of the sidewall to pass a spool holder. A spool wound with a bonding wire thereon is mounted to the spool receipt portion in the horizontal direction such that the central axis of the spool is maintained to be parallel to the bottom portion of the base. A cover is coupled to the base at the outer surface of the sidewall while preventing foreign material such as dust from being introduced.
摘要翻译：接合线卷轴壳体以及使用卷轴壳体处理卷轴的方法，具有能够有效地防止卷轴的耐久性和保持性的结构由于卷轴相对于卷轴的重复的耦合和解耦操作而劣化的结构卷轴保持器，同时防止接合线被工作人员粗心的污染和损坏。接合线卷轴壳体包括底部，底部具有从其四个侧面处的主体中的底部部分突出的侧壁，同时内部形成卷轴接收部分，以及形成在侧壁的一侧或多侧以通过的保持器入口卷轴支架在其上缠绕有接合线的线轴在水平方向上安装到线轴接收部分，使得线轴的中心轴线保持平行于基座的底部。盖子在侧壁的外表面处连接到基座，同时防止诸如灰尘的异物被引入。

27. 发明申请

WO2017031222A1 WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES 审中-公开
标题翻译：包含金属纳米粒子的线接合方法和系统
公开(公告)号：WO2017031222A1
公开(公告)日：2017-02-23
申请号：PCT/US2016/047388
申请日：2016-08-17
申请人： LOCKHEED MARTIN CORPORATION
发明人： STOLTENBERG, Randall Mark , ZINN, Alfred A.
IPC分类号： B23K37/00 , B23K31/00
CPC分类号： H01L24/85 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45193 , H01L2224/45664 , H01L2224/48091 , H01L2224/48465 , H01L2224/49096 , H01L2224/49175 , H01L2224/7815 , H01L2224/7825 , H01L2224/78301 , H01L2224/78601 , H01L2224/78611 , H01L2224/8502 , H01L2224/851 , H01L2224/85205 , H01L2224/8584 , H01L2224/8593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/05599 , H01L2924/20751 , H01L2924/20752 , H01L2224/85399
摘要： Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.
摘要翻译：通过使用金属纳米颗粒组合物可以促进引线接合操作。在这方面，可以提高球接合和楔接合工艺。引线接合方法可以包括通过分配头在轧制线源的第一位置提供电线支付，使第一金属纳米颗粒组合物和电线支付的第一部分与焊盘接触，并且至少部分地将金属纳米颗粒所述第一金属纳米颗粒组合物一起在所述接合焊盘和所述电线支付的所述第一部分之间形成粘合界面。粘附界面可以具有纳米颗粒形态。引线接合系统可以包括卷绕的线源，被配置为提供引线支撑的分配头，以及施用器，其被配置为将金属纳米颗粒组合物放置在至少一部分导线支撑上或者在接合焊盘上。

28. 发明申请

WO2012032645A1 半導体用ボンディングワイヤの巻線形態审中-公开
标题翻译：用于半导体接线的线圈绕组形式
公开(公告)号：WO2012032645A1
公开(公告)日：2012-03-15
申请号：PCT/JP2010/065579
申请日：2010-09-10
申请人：田中電子工業株式会社 , 彌永幸弘 , 本田里奈
发明人：彌永　幸弘 , 本田　里奈
IPC分类号： H01L21/60 , B65H55/04
CPC分类号： B65H55/04 , B65H65/00 , B65H75/26 , B65H75/285 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45144 , H01L2224/78601 , H01L2224/78611 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2224/48 , H01L2924/20752 , H01L2924/01204
摘要：【課題】　ボンディングワイヤをワイヤカットしても、スプリングバックがおきにくく、ワイヤがスプール上で多量に緩まないボンディングワイヤの巻線形態を提供する。【解決手段】　スプール胴部のワイヤ巻き付け部分に巻き付けたボンディングワイヤの本巻部分の巻き終わり端部（ワイヤ繰りだし時におけるアース部）における巻線構造であって、アースワイヤが、スプール胴部上に互いに密着し、かつ、整列して巻かれた列をなし、その列に複数のワイヤがそれぞれ離散して押し込まれた、高密着整列して巻かれている構造をなす第1層の巻回構造体である。
摘要翻译： [问题]为了提供用于半导体的接合线的线缠绕的形式，使得即使接合线被切割，回弹也不容易发生，并且线不会在线轴上松动。 [解决方案]设置缠绕在卷轴芯线的线绕部上的接合线的主绕组部分的绕组端部（线的退绕时的接地部）的绕线结构，第一层形成这样的结构，其中接地线在卷轴芯上彼此紧密地附着，并且线形成为对准地缠绕，这些线中的多根线彼此分离并插入以形成绕组具有强烈的粘合对准。

29. 发明专利

JP2016157745A ボールボンディング用パラジウム(Pd)被覆銅ワイヤ有权
标题翻译：用于球接的钯（Pd） - 辅助铜线
公开(公告)号：JP2016157745A
公开(公告)日：2016-09-01
申请号：JP2015033170
申请日：2015-02-23
申请人：田中電子工業株式会社
发明人：天野裕之 , 濱本拓也 , 永江祐佳 , 崎田雄祐 , 三苫修一 , 高田満生 , 桑原岳
IPC分类号： H01L21/60
CPC分类号： H01L2224/05624 , H01L2224/43 , H01L2224/4312 , H01L2224/4321 , H01L2224/43848 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48 , H01L2224/48463 , H01L2224/48507 , H01L2224/78601 , H01L2224/85045 , H01L2924/12041 , H01L2924/14
摘要：【課題】FAB(フリーエアボール)による溶融ボール形成の不安定性を解決するボールボンディング用パラジウム(Pd)被覆銅ワイヤを提供する。【解決手段】銅(Cu)又は銅合金からなる芯材にパラジウム(Pd)の被覆層が形成された、線径が10〜25μmのボールボンディング用パラジウム(Pd)被覆銅ワイヤにおいて、パラジウム(Pd)の被覆層にはパラジウム(Pd)単独の無垢層が存在し、かつ、パラジウム(Pd)の被覆層上に芯材からの銅(Cu)のしみ出し層が形成され、銅(Cu)のしみ出し層の表面が酸化されている。【選択図】図1
摘要翻译：要解决的问题：提供用于球接的钯（Pd）涂层铜线，其通过FAB（自由空气球）解决熔融球形成中的不稳定性。解决方案：在用于球接的钯（Pd）涂层铜线具有10-25μm的线尺寸，其中在由铜（Cu）或铜合金构成的芯材上形成钯（Pd）的涂层，在涂层中仅存在固体钯（Pd）层的钯（Pd），并且在钯（Pd）的涂层上形成来自芯材的铜（Cu）的渗出层，铜（Cu）的渗出层的表面被氧化。选择图 1

30. 发明专利

JP5296233B2 Wire bonding apparatus 有权
公开(公告)号：JP5296233B2
公开(公告)日：2013-09-25
申请号：JP2012023722
申请日：2012-02-07
申请人：株式会社新川
发明人：前田　　徹
IPC分类号： H01L21/60
CPC分类号： H01L24/78 , B23K20/004 , H01L24/45 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/7801 , H01L2224/78301 , H01L2224/78601 , H01L2224/78611 , H01L2224/85013 , H01L2924/00014 , H01L2924/00015 , H01L2224/48 , H01L2924/00
摘要： A wire bonding apparatus includes a base (11), a bonding head (13) for moving a capillary (15) with respect to the base (11) in the X, Y, and Z directions, and a wire-cleaning plasma unit (30). The wire-cleaning plasma unit (30) includes hollow casings (31a) and (31b) to which an inert gas is introduced in order to make the inner pressure thereof higher than atmospheric pressure, holes (33a) and (33b) provided for the casings (31a) and (31b) respectively such that wire (21) can be inserted therethrough, and plasma electrodes provided around the holes (33a) and (33b) inside the casings (31a) and (31b). The wire (21) is made to pass through plasma generated inside the casings (31a) and (31b) in a non-air state and is cleaned. By doing so, the surface of the wire used for wire bonding is effectively cleaned.

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