会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 22. 发明申请
    • Release Device Applied in Electronic Package
    • 释放装置应用于电子封装
    • US20150064294A1
    • 2015-03-05
    • US14010521
    • 2013-08-27
    • SureGiant Technology Co., Ltd
    • Yun-Pin Yang
    • B29C33/60
    • B29C33/68B29K2901/12
    • The present invention relates to a release device applied in electronic package, wherein the release device is attached to the inner surface of a transfer modeling mold for electronic package. In the present invention, the release device consists of a substrate and a release layer formed on the substrate, wherein the substrate is made of a plastic material with the thickness of 0.016 mm˜0.5 mm, and the plastic material can be PET, PP, PC, PE, PI, or PVC. Differing from the substrate, the release layer is made of a pure silica gel or a silica gel/rubber compound with the thickness of 0.02 mm˜2 mm. The release device can provide a releasing force for facilitating the modeled device formed by using the transfer modeling mold be easily separated from the mold, and avoid part of manufacture material from remaining in the inner surface of the mold.
    • 本发明涉及应用于电子封装中的释放装置,其中释放装置附接到用于电子封装的转移建模模具的内表面。 在本发明中,剥离装置由基材和形成在基材上的剥离层构成,其中基材由厚度为0.016mm〜0.5mm的塑料制成,塑料可以是PET,PP, PC,PE,PI或PVC。 与基材不同,剥离层由纯硅胶或厚度为0.02mm〜2mm的硅胶/橡胶化合物制成。 释放装置可以提供释放力,以便于通过使用转移建模模具形成的建模装置容易地与模具分离,并且避免制造材料的一部分残留在模具的内表面中。