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    • 25. 发明申请
    • SILICON-CONTAINING ANTIREFLECTIVE COATINGS INCLUDING NON-POLYMERIC SILSESQUIOXANES
    • 含硅防反射涂层,包括非聚合物SILESQUIOXANES
    • WO2014171984A2
    • 2014-10-23
    • PCT/US2014/012624
    • 2014-01-23
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONSHIN-ETSU CHEMICAL CO., LTD.
    • GLODDE, MartinHUANG, Wu-songPEREZ, JavierSOORIYAKUMARAN, RatnamKINSHO, TakeshiOGIHARA, TsutomuTACHIBANA, SeiichiroUEDA, Takafumi
    • G03F7/0757G03F7/0045G03F7/0751G03F7/0755G03F7/091G03F7/325
    • Embodiments include a silicon-containing antireflective material including a silicon- containing base polymer, a non-polymeric silsesquioxane material, and a photoacid generator. The silicon-containing base polymer may contain chromophore moieties, transparent moieties, and reactive sites on an SiO x background, where x ranges from approximately 1 to approximately 2. Exemplary non-polymeric silsesquioxane materials include polyhedral oligomeric silsesquioxanes having acid labile side groups linked to hydrophilic groups Exemplary acid labile side groups may include tertiary alkyl carbonates, tertiary alkyl esters, tertiary alkyl ethers, acetals and ketals, Exemplary hydrophilic groups may include phenols, alcohols, carboxylic acids, amides, and sulfonamides. Embodiments further include lithographic structures including an organic anti-reflective layer, the above-described silicon-containing anti-reflective layer above the organic anti-reflective layer, and a photoresist layer above the above-described silicon-containing anti-reflective layer. Embodiments further include a method of forming a lithographic structure utilizing the above-described silicon-containing anti- reflective layer.
    • 实施方案包括含硅抗反射材料,其包含含硅基础聚合物,非聚合物倍半硅氧烷材料和光酸产生剂。 含硅基础聚合物可以在SiO x背景上含有发色团部分,透明部分和反应位点,其中x范围从约1至约2.示例性非聚合物倍半硅氧烷材料包括多面体低聚倍半硅氧烷 具有与亲水基团连接的酸不稳定侧基示例性的酸不稳定侧基可以包括叔烷基碳酸酯,叔烷基酯,叔烷基醚,缩醛和缩酮。示例性的亲水基团可以包括酚,醇,羧酸,酰胺和磺酰胺。 实施例还包括光刻结构,其包括有机抗反射层,在有机抗反射层上方的上述含硅抗反射层以及在上述含硅抗反射层上方的光致抗蚀剂层。 实施例还包括利用上述含硅抗反射层形成光刻结构的方法。
    • 29. 发明申请
    • ANNULAR SUSTAINED RELEASE PREPARATION AND PRODUCTION METHOD THEREOF
    • 环保可持续发展的准备和生产方法
    • WO2011118828A1
    • 2011-09-29
    • PCT/JP2011/057513
    • 2011-03-22
    • SHIN-ETSU CHEMICAL CO., LTD.SAGUCHI, RyuichiFUKUMOTO, Takehiko
    • SAGUCHI, RyuichiFUKUMOTO, Takehiko
    • A01N25/18A01M1/02A01P19/00
    • A01M1/2044
    • Provided is an annular sustained release preparation to be used by opening a center portion thereof, the preparation having a strength enough to avoid cleaving at a welded end portion. More specifically, provided is an annular sustained release preparation comprising at least two polymer tubes having both ends sealed and integrated by pressure-welding or at least one polymer tube and at least one polymer rod having both ends sealed and integrated by pressure-welding; and a sex pheromone liquid contained by at least one of the tubes or the tube; wherein an annular space can be formed by pulling the tubes or the tube and the rod apart from each other at a center portion therebetween, the central portion not having been pressure-welded; and an angle formed between a line connecting respective centers of diameters of the tubes welded to each other or the tube and the rod welded to each other and the pressure application direction is from 0 to 45°.
    • 提供一种通过打开其中心部分而使用的环形缓释制剂,该制剂具有足以避免在焊接端部处分裂的强度。 更具体地,提供了一种环形缓释制剂,其包括至少两个聚合物管,其两端通过压焊或至少一个聚合物管密封并整合,并且至少一个聚合物棒的两端通过压焊密封和集成; 和由至少一个管或管包含的性信息素液体; 其中可以通过在它们之间的中心部分处拉动所述管或所述管和所述杆彼此分离而形成环形空间,所述中心部分未被压焊; 并且在彼此焊接的管或连接管的直径的管线与彼此焊接的杆和压力施加方向之间形成的角度为0°至45°。
    • 30. 发明申请
    • HEAT CONDUCTIVE CURED PRODUCT AND MAKING METHOD
    • 导热固化产品和制造方法
    • WO2009107757A2
    • 2009-09-03
    • PCT/JP2009/053626
    • 2009-02-20
    • Shin-Etsu Chemical Co., Ltd.ENDO, AkihiroASAINE, MasayaMARUYAMA, Takahiro
    • ENDO, AkihiroASAINE, MasayaMARUYAMA, Takahiro
    • C09D183/04Y10T428/31663
    • A heat conductive cured product which can be handled even in a single layer or thin film form, can be readily attached to a heat-generating component or heat-dissipating member, and exhibits an appropriate tack and heat conductivity in a thin film form is provided as well as a method for preparing the same. A heat conductive cured product is prepared by applying a heat conductive composition as a thin film to a substrate which has been treated to have a silicone pressure-sensitive adhesive releasable surface, and curing the composition, the composition comprising as essential components, (a) an organopolysiloxane having alkenyl radicals, (b) a heat conductive filler, the filler containing at least 30 vol% of aluminum powder based on its total volume, (c) an organohydrogenpolysiloxane, (d) a platinum group metal catalyst, (e) a reaction regulator, and (f) a silicone resin.
    • 可以容易地以单层或薄膜形式处理的导热固化产物可以容易地附着到发热组件或散热构件,并且显示适当的粘性和热量 提供薄膜形式的导电性及其制备方法。 导热性固化物通过将作为薄膜的导热性组合物涂布在经过处理而具有有机硅压敏性粘合剂剥离性表面的基材上并使该组合物固化来制备,所述组合物包含作为基本组分的(a) (b)导热填料,所述填料基于其总体积包含至少30体积%的铝粉,(c)有机氢聚硅氧烷,(d)铂族金属催化剂,(e)具有烯基的有机基聚硅氧烷, 反应调节剂,和(f)有机硅树脂。