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    • 23. 发明授权
    • Method of characterizing flare
    • 表征火炬的方法
    • US07277165B2
    • 2007-10-02
    • US10860853
    • 2004-06-04
    • Bo WuAbdurrahman Sezginer
    • Bo WuAbdurrahman Sezginer
    • G01N21/00
    • G03F7/70941G03F1/44G03F7/70591
    • A method of measuring flare in an optical lithographic system utilizes an exposure mask with first and second discrete opaque features each having rotational symmetry of order greater than four and of different respective areas. The exposure mask is positioned in the lithographic system such that actinic radiation emitted by the lithographic system illuminates the sensitive surface of an exposure target through the exposure mask. The extent to which regions of the sensitive surface that are within the geometric image of a feature of the exposure mask are exposed to actinic radiation during due to flare is measured.
    • 一种在光学平版印刷系统中测量光斑的方法利用具有第一和第二离散不透明特征的曝光掩模,每个不透明特征具有大于四的旋转对称性以及不同的相应区域。 曝光掩模位于光刻系统中,使得由光刻系统发射的光化辐射通过曝光掩模照射曝光目标的敏感表面。 测量在曝光掩模的特征的几何图像内的敏感表面的区域在由于耀斑期间暴露于光化辐射的程度。
    • 25. 发明授权
    • Method for correcting position-dependent distortions in patterning of integrated circuits
    • 用于校正集成电路图案化中的位置相关失真的方法
    • US07246343B2
    • 2007-07-17
    • US10933192
    • 2004-09-01
    • Devendra JoshiAbdurrahman SezginerFranz X. Zach
    • Devendra JoshiAbdurrahman SezginerFranz X. Zach
    • G06F17/50
    • G03F1/36
    • A method and system for reducing the computation time required to apply position-dependent corrections to lithography, usually mask, data is disclosed. Optical proximity or process corrections are determined for a few instances of a repeating cluster or object, usually at widely separated locations and then interpolating the corrections to the other instances of the repeating cluster based on their positions in the exposure field. Or, optical proximity corrections can be applied to the repeating cluster of objects for different values of flare intensity, or another parameter of patterning imperfection, such as by calculating the value of the flare at the location of each instance of the repeating cluster, and interpolating the optical proximity corrections to those values of flare.
    • 公开了一种用于减少对光刻应用位置相关校正所需的计算时间的方法和系统,通常是屏蔽数据。 通常在广泛分离的位置处对重复的簇或对象的几个实例确定光学邻近度或过程校正,然后基于它们在曝光区域中的位置将校正内插到重复簇的其他实例。 或者,可以将光学邻近校正应用于不同的闪光强度值的对象的重复簇或者图案化缺陷的另一参数,例如通过计算重复簇的每个实例的位置处的闪光的值,以及内插 光学接近度校正到这些闪光值。
    • 30. 发明申请
    • Method for correcting position-dependent distortions in patterning of integrated circuits
    • 用于校正集成电路图案化中的位置相关失真的方法
    • US20060048091A1
    • 2006-03-02
    • US10933192
    • 2004-09-01
    • Devendra JoshiAbdurrahman SezginerFranz Zach
    • Devendra JoshiAbdurrahman SezginerFranz Zach
    • G06F17/50G03F1/00G21K5/00
    • G03F1/36
    • A method and system for reducing the computation time required to apply position-dependent corrections to lithography, usually mask, data is disclosed. Optical proximity or process corrections are determined for a few instances of a repeating cluster or object, usually at widely separated locations and then interpolating the corrections to the other instances of the repeating cluster based on their positions in the exposure field. Or, optical proximity corrections can be applied to the repeating cluster of objects for different values of flare intensity, or another parameter of patterning imperfection, such as by calculating the value of the flare at the location of each instance of the repeating cluster, and interpolating the optical proximity corrections to those values of flare.
    • 公开了一种用于减少对光刻应用位置相关校正所需的计算时间的方法和系统,通常是屏蔽数据。 通常在广泛分离的位置处对重复的簇或对象的几个实例确定光学邻近度或过程校正,然后基于它们在曝光区域中的位置将校正内插到重复簇的其他实例。 或者,可以将光学邻近校正应用于不同的闪光强度值的对象的重复簇或者图案化缺陷的另一参数,例如通过计算重复簇的每个实例的位置处的闪光的值,以及内插 光学接近度校正到这些闪光值。