专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US09443746B2 Floating mold tool for semicondcutor packaging 有权
标题翻译：用于半切割包装的浮动模具
公开(公告)号：US09443746B2
公开(公告)日：2016-09-13
申请号：US14562770
申请日：2014-12-07
申请人： Zhigang Bai , Xingshou Pang , Jinzhong Yao
发明人： Zhigang Bai , Xingshou Pang , Jinzhong Yao
IPC分类号： H01L23/495 , H01L21/67 , H01L21/56 , H01L21/48 , H01L23/31 , H01L23/00
CPC分类号： H01L21/67126 , H01L21/4842 , H01L21/565 , H01L23/3107 , H01L23/49551 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.
摘要翻译：用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。模具半部具有齿和相邻齿对之间的空间。所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

22. 发明申请

US20160049318A1 FLOATING MOLD TOOL FOR SEMICONDCUTOR PACKAGING 有权
标题翻译：用于半导体包装的浮动模具
公开(公告)号：US20160049318A1
公开(公告)日：2016-02-18
申请号：US14562770
申请日：2014-12-07
申请人： Zhigang Bai , Xingshou Pang , Jinzhong Yao
发明人： Zhigang Bai , Xingshou Pang , Jinzhong Yao
IPC分类号： H01L21/67 , H01L21/48 , H01L23/495 , H01L21/56 , H01L23/31
CPC分类号： H01L21/67126 , H01L21/4842 , H01L21/565 , H01L23/3107 , H01L23/49551 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.
摘要翻译：用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。模具半部具有齿和相邻齿对之间的空间。所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

23. 发明申请

US20150028468A1 NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME 有权
标题翻译：非引线型半导体封装及其组装方法
公开(公告)号：US20150028468A1
公开(公告)日：2015-01-29
申请号：US14277061
申请日：2014-05-14
申请人： Zhigang Bai , Zhijie Wang , Jinzhong Yao
发明人： Zhigang Bai , Zhijie Wang , Jinzhong Yao
IPC分类号： H01L23/08 , H01L23/00 , H01L21/56
CPC分类号： H01L24/85 , H01L21/4842 , H01L23/3107 , H01L23/49541 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2224/32245 , H01L2224/48245 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.
摘要翻译：无引线型半导体封装具有形成模体的模盖。模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。模具柱防止角垫脱落。

24. 发明申请

US20140361421A1 LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE 有权
标题翻译：基于框架的半导体封装
公开(公告)号：US20140361421A1
公开(公告)日：2014-12-11
申请号：US13972885
申请日：2013-08-21
申请人： Zhigang Bai , Jinzhong Yao , Yuan Zang
发明人： Zhigang Bai , Jinzhong Yao , Yuan Zang
IPC分类号： H01L23/495 , H01L23/00
CPC分类号： H01L23/49517 , H01L23/3107 , H01L23/49555 , H01L23/49575 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06135 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.
摘要翻译：基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。模具通过接合线电连接到引线指。管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。密封剂包括用于接收第二组的引导指的槽或槽。

25. 发明申请

US20130196473A1 MOLD CHASE 有权
标题翻译：模具刀
公开(公告)号：US20130196473A1
公开(公告)日：2013-08-01
申请号：US13794789
申请日：2013-03-12
申请人： Zhigang Bai , Jinzhong Yao
发明人： Zhigang Bai , Jinzhong Yao
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H03K19/018521 , H01L2924/00014
摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.
摘要翻译：用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

26. 发明授权

US09589928B2 Combined QFN and QFP semiconductor package 有权
标题翻译：组合QFN和QFP半导体封装
公开(公告)号：US09589928B2
公开(公告)日：2017-03-07
申请号：US14552497
申请日：2014-11-25
申请人： Zhigang Bai , Jinzhong Yao , Lan Chu Tan
发明人： Zhigang Bai , Jinzhong Yao , Lan Chu Tan
IPC分类号： H01L23/48 , H01L23/00 , H01L23/495 , H01L23/498 , H01L21/56 , H01L23/31
CPC分类号： H01L24/85 , H01L21/565 , H01L23/3121 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/2919 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/456 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.
摘要翻译：半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型。集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

27. 发明申请

US20150097278A1 SURFACE MOUNT SEMICONDUCTOR DEVICE WITH ADDITIONAL BOTTOM FACE CONTACTS 审中-公开
标题翻译：表面安装半导体器件与附加底部表面接触
公开(公告)号：US20150097278A1
公开(公告)日：2015-04-09
申请号：US14459328
申请日：2014-08-14
申请人： Zhigang Bai , Yin Kheng Au , Lan Chu Tan , Jinzhong Yao
发明人： Zhigang Bai , Yin Kheng Au , Lan Chu Tan , Jinzhong Yao
IPC分类号： H01L23/495
CPC分类号： H01L21/4842 , H01L23/49541 , H01L23/49551 , H01L23/49558 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/06135 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： Assembling a surface mount semiconductor device includes providing a lead frame structure with peripheral leads and additional bottom face contacts integral with frame members. Outer portions of the bottom face contact members are interposed between inner portions of adjacent pairs of the peripheral leads. A package body is formed by encapsulating the lead frame structure in which the frame members are positioned outside a side edge surface. The peripheral leads and the bottom face contact members project between the side edge surface of the package body and the frame members. The frame members are cut and the peripheral leads and the bottom face contact members are separated and electrically isolated from each other.
摘要翻译：组装表面贴装半导体器件包括提供具有周边引线的引线框结构和与框架构件一体的附加底面接触。底面接触构件的外部部分位于相邻的外围引线对的内部之间。通过封装框架构件定位在侧边缘表面外侧的引线框架结构形成封装体。外围引线和底面接触构件在封装主体的侧边缘表面和框架构件之间突出。框架构件被切割，并且周边引线和底面接触构件彼此分离并电隔离。

28. 发明授权

US08643170B2 Method of assembling semiconductor device including insulating substrate and heat sink 有权
标题翻译：包括绝缘基板和散热片的半导体器件组装方法
公开(公告)号：US08643170B2
公开(公告)日：2014-02-04
申请号：US13442878
申请日：2012-04-10
申请人： Junhua Luo , Jinzhong Yao , Baoguan Yin
发明人： Junhua Luo , Jinzhong Yao , Baoguan Yin
IPC分类号： H01L23/34
CPC分类号： H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.
摘要翻译：半导体管芯安装在散热片阵列框架结构上。散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。半导体管芯与绝缘基板上的电触点电连接。半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

29. 发明授权

US08202222B2 Equal phase two-dimensional array probe 有权
标题翻译：等相二维阵列探头
公开(公告)号：US08202222B2
公开(公告)日：2012-06-19
申请号：US11975091
申请日：2007-10-16
申请人： Jinzhong Yao , Wenping Zhou , Zhiqiang Chen
发明人： Jinzhong Yao , Wenping Zhou , Zhiqiang Chen
IPC分类号： A61B8/00
CPC分类号： G01S7/5208 , A61B8/483 , G01S15/8925 , G10K11/345 , G10K11/346
摘要： An ultrasonic image scanning system for scanning an organic object includes a 2D array probe constructed with transducer elements in both azimuth and elevation dimension. There is a multiplexer disposed in one dimension to route the transducer elements to system front-end channels, while the other dimension can sum into the first dimension with various element number.
摘要翻译：用于扫描有机物体的超声波图像扫描系统包括由方位角和仰角尺寸的换能器元件构成的2D阵列探针。有一个多路复用器设置在一个维度上以将换能器元件路由到系统前端通道，而另一个尺寸可以与各种元件数量相加到第一维度中。

30. 发明申请

US20110193237A1 METHOD FOR MAKING SEMICONDUCTOR PACKAGE 有权
标题翻译：制造半导体封装的方法
公开(公告)号：US20110193237A1
公开(公告)日：2011-08-11
申请号：US13004029
申请日：2011-01-11
申请人： Bin Tian , Nan Xu , Jinzhong Yao
发明人： Bin Tian , Nan Xu , Jinzhong Yao
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/3107 , H01L21/56 , H01L21/6835 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2224/48247 , H01L2224/85001 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.
摘要翻译：一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。快速冷却步骤不需要同时对包装施加任何夹紧压力。快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式