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    • 22. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US08338226B2
    • 2012-12-25
    • US12748520
    • 2010-03-29
    • Yuji AsanoJunichi Koezuka
    • Yuji AsanoJunichi Koezuka
    • H01L21/20
    • H01L29/7869C04B35/58C04B2235/3284C04B2235/3286H01L27/1225H01L29/66969H01L29/78618
    • An object is to provide a thin film transistor including an oxide semiconductor layer, in which the contact resistance between the oxide semiconductor layer and source and drain electrode layers is reduced and whose electric characteristics are stabilized. Another object is to provide a method for manufacturing the thin film transistor. The thin film transistor including an oxide semiconductor layer is formed in such a manner that buffer layers whose conductivity is higher than that of the oxide semiconductor layer are formed and the oxide semiconductor layer and the source and drain electrode layers are electrically connected to each other through the buffer layers. In addition, the buffer layers whose conductivity is higher than that of the oxide semiconductor layer are subjected to reverse sputtering treatment and heat treatment in a nitrogen atmosphere.
    • 目的是提供一种薄膜晶体管,其包括氧化物半导体层,其中氧化物半导体层与源极和漏极电极层之间的接触电阻降低并且其电特性稳定。 另一个目的是提供制造薄膜晶体管的方法。 包括氧化物半导体层的薄膜晶体管形成为形成电导率高于氧化物半导体层的缓冲层的方式,并且氧化物半导体层和源极和漏极电极层通过 缓冲层。 此外,在氮气气氛中对导电率高于氧化物半导体层的缓冲层进行反溅射处理和热处理。
    • 23. 发明申请
    • Semiconductor device fabrication method and semiconductor device
    • 半导体器件制造方法和半导体器件
    • US20070048890A1
    • 2007-03-01
    • US11327483
    • 2006-01-09
    • Yuji AsanoMorio Kato
    • Yuji AsanoMorio Kato
    • H01L21/00
    • H01L31/0216
    • A semiconductor device fabrication method in which when a semiconductor device with a built-in light receiving element is fabricated, a section for dividing the light receiving element is protected from damage caused by, for example, etching. An antireflection coating is formed not only on a light receiving area in a divided photodiode area but on a division area including a junction area between a division section outside the light receiving area for dividing a photodiode and a cathode. A polycrystalline silicon film is formed so as to cover the antireflection coating. Accordingly, the antireflection coating on the junction area between the division section outside the light receiving area and the cathode is protected against, for example, etching by the polycrystalline silicon film. As a result, the appearance of a crystal defect, a change in impurity concentration, or the like is suppressed in this area. Therefore, a high-performance high-quality semiconductor device with a built-in photodiode can be fabricated.
    • 一种半导体器件制造方法,其中当制造具有内置光接收元件的半导体器件时,用于分割光接收元件的部分被保护免受例如蚀刻引起的损坏。 防反射涂层不仅形成在分光电二极管区域的光接收区域上,而且形成在包含用于分割光电二极管的光接收区域外的分割部分与阴极之间的接合区域的分割区域上。 形成多晶硅膜以覆盖抗反射涂层。 因此,防止在光接收区域外的分割部分与阴极之间的接合区域上的抗反射涂层被防止例如多晶硅膜的蚀刻。 结果,在该区域中抑制了晶体缺陷的出现,杂质浓度的变化等。 因此,可以制造具有内置光电二极管的高性能高品质半导体器件。
    • 24. 发明授权
    • Facsimile machine
    • 传真机
    • US5532840A
    • 1996-07-02
    • US171420
    • 1993-12-22
    • Yuji AsanoWataru Tomida
    • Yuji AsanoWataru Tomida
    • G11C29/00H04N1/32H04N1/327H04N1/21
    • G11C29/88H04N1/32363H04N1/32379H04N1/32704H04N1/32708H04N1/3271H04N1/32719H04N1/32723H04N1/32728H04N1/32732
    • In this facsimile machine, it is determined whether data to be stored in a RAM is image data, and, if the data is image data, a normal cluster for writing the image data into is ensured. If the data is not image data, a defective cluster is selected, and the data is written into the defective cluster. In this case, if no defective cluster is selected, a normal cluster is selected, and the data is written into the normal cluster. Upon termination of the data writing operation, the data is managed on a classification (kind) basis. Accordingly, a facsimile machine is provided that is low in price and can easily carry out individual management for preservation of data while maintaining preservation (storage) quality of data even when a semiconductor memory that is not guaranteed in quality is used as the storage medium for the data.
    • 在该传真机中,确定要存储在RAM中的数据是否是图像数据,并且如果数据是图像数据,则确保了用于写入图像数据的正常集群。 如果数据不是图像数据,则选择有缺陷的簇,并将数据写入缺陷簇。 在这种情况下,如果没有选择有缺陷的集群,则选择正常集群,并将数据写入正常集群。 在数据写入操作终止时,以分类(种类)为基础来管理数据。 因此,提供廉价的传真机,并且即使当质量不保证的半导体存储器被用作存储介质时,也可以容易地进行用于数据保存的个体管理,同时保持数据的保存(存储)质量 数据。
    • 29. 发明申请
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US20070254398A1
    • 2007-11-01
    • US11528536
    • 2006-09-28
    • Toshihiro WakabayashiTakao SetoyamaYuji AsanoAkio Igarashi
    • Toshihiro WakabayashiTakao SetoyamaYuji AsanoAkio Igarashi
    • H01L21/425
    • H01L21/8249H01L27/0635H01L27/1443H01L31/102H01L31/18
    • A method of manufacturing a high-speed operable and broadband operable semiconductor device where a light-receiving element section, a CMOS element and a bipolar transistor element having a double polysilicon structure are formed on one chip. By performing the same conductivity type ion implantation, the same conductivity type diffusion layers (examples thereof include N-type diffusion layers, an anode diffusion layer, P-type well diffusion layer and collector diffusion layer as P-type diffusion layers, a cathode diffusion layer and collector contact diffusion layer as N-type diffusion layers, a source/drain diffusion layer and base Poly-Si diffusion layer as N-type diffusion layers, and a source/drain diffusion layer and base Poly-Si diffusion layer as P-type diffusion layers) are simultaneously formed in two or more regions among a light-receiving element region, CMOS element region and bipolar transistor element region of a semiconductor substrate or of an epitaxial layer over the semiconductor substrate.
    • 一种制造高速可操作和宽带可操作的半导体器件的方法,其中在一个芯片上形成具有双重多晶硅结构的光接收元件部分,CMOS元件和双极晶体管元件。 通过进行相同的导电型离子注入,具有相同的导电型扩散层(其例子包括N型扩散层,阳极扩散层,P型阱扩散层和作为P型扩散层的集电极扩散层,阴极扩散 作为N型扩散层的层和集电极接触扩散层,作为N型扩散层的源极/漏极扩散层和基底多晶硅扩散层,以及作为P-型扩散层的源极/漏极扩散层和基极多晶硅扩散层, 类型扩散层)同时形成在半导体衬底的光接收元件区域,CMOS元件区域和双极晶体管元件区域或半导体衬底上的外延层的两个或更多个区域中。