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    • 22. 发明授权
    • Unit cell of a non-volatile memory device, a non-volatile memory device and method thereof
    • 非易失性存储器件的单元,非易失性存储器件及其方法
    • US07551491B2
    • 2009-06-23
    • US11715404
    • 2007-03-08
    • Won-joo KimSuk-pil KimJae-woong HyunYoon-dong ParkJune-mo Koo
    • Won-joo KimSuk-pil KimJae-woong HyunYoon-dong ParkJune-mo Koo
    • G11C11/34
    • G11C16/0433G11C16/0491G11C16/10H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Unit cells of a non-volatile memory device and a method thereof are provided. In an example, the unit cell may include a first memory transistor and a second memory transistor connected to each other in series and further connected in common to a word line, the first and second memory transistors including first and second storage nodes, respectively, the first and second storage nodes configured to execute concurrent memory operations. In another example, the unit cell may include a semiconductor substrate in which first and second bit line regions are defined, first and second storage node layers respectively formed on the semiconductor substrate between the first and second bit line regions, a first pass gate electrode formed on the semiconductor substrate between the first bit line region and the first storage node layer, a second pass gate electrode formed on the semiconductor substrate between the second bit line region and the second storage node layer, a third pass gate electrode formed on the semiconductor substrate between the first and second storage node layers, a third bit line region formed in a portion of the semiconductor substrate under the third pass gate electrode and a control gate electrode extending across the first and second storage node layers. The example unit cells may be implemented within a non-volatile memory device (e.g., a flash memory device), such that the non-volatile memory device may include a plurality of example unit cells.
    • 提供非易失性存储器件的单元电池及其方法。 在一个示例中,单元可以包括串联连接并进一步连接到字线的第一存储晶体管和第二存储晶体管,第一和第二存储晶体管分别包括第一和第二存储节点, 配置为执行并发存储器操作的第一和第二存储节点。 在另一示例中,单元可以包括其中限定了第一和第二位线区域的半导体衬底,分别形成在第一和第二位线区域之间的半导体衬底上的第一和第二存储节点层,形成的第一遍栅极电极 在第一位线区域和第一存储节点层之间的半导体衬底上,形成在第二位线区域和第二存储节点层之间的半导体衬底上的第二遍栅极电极,形成在半导体衬底上的第三栅极电极 在所述第一和第二存储节点层之间形成第三位线区域,所述第三位线区域形成在所述第三栅极电极下方的所述半导体衬底的一部分中,以及跨越所述第一和第二存储节点层延伸的控制栅电极。 示例性单元单元可以在非易失性存储器件(例如,闪存器件)内实现,使得非易失性存储器件可以包括多个示例单位单元。
    • 24. 发明申请
    • Nonvolatile memory devices and methods of fabricating the same
    • 非易失性存储器件及其制造方法
    • US20080025096A1
    • 2008-01-31
    • US11704205
    • 2007-02-09
    • Won-joo KimSuk-Pil KimYoon-dong Park
    • Won-joo KimSuk-Pil KimYoon-dong Park
    • G11C11/34H01L21/336
    • H01L27/115H01L27/11521H01L27/11568H01L29/42332H01L29/42336H01L29/42352H01L29/66621H01L29/7881H01L29/792
    • A nonvolatile memory device includes a plurality of first control gate electrodes, second control gate electrodes, first storage node films, and second storage node films. The first control gate electrodes are recessed into a semiconductor substrate. Each second control gate electrode is disposed between two adjacent first control gate electrodes. The second control gate electrodes are disposed on the semiconductor substrate over the first control gate electrodes. The first storage node films are disposed between the semiconductor substrate and the first control gate electrodes. The second storage node films are disposed between the semiconductor substrate and the second control gate electrodes. A method of fabricating the nonvolatile memory device includes forming the first storage node films, forming the first control gate electrodes, forming the second storage node films, and forming the second control gate electrodes.
    • 非易失性存储器件包括多个第一控制栅电极,第二控制栅电极,第一存储节点膜和第二存储节点膜。 第一控制栅电极凹入半导体衬底。 每个第二控制栅电极设置在两个相邻的第一控制栅极之间。 第二控制栅电极设置在第一控制栅电极上的半导体衬底上。 第一存储节点膜设置在半导体衬底和第一控制栅电极之间。 第二存储节点膜设置在半导体衬底和第二控制栅电极之间。 一种制造非易失性存储器件的方法包括形成第一存储节点膜,形成第一控制栅电极,形成第二存储节点膜,以及形成第二控制栅电极。
    • 26. 发明授权
    • Non-volatile memory device and operation method of the same
    • 非易失性存储器件及其操作方法相同
    • US07894265B2
    • 2011-02-22
    • US12081679
    • 2008-04-18
    • Tae-hee LeeWon-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-eung Yoon
    • Tae-hee LeeWon-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-eung Yoon
    • G11C5/06G11C16/04G11C16/10G11C16/26
    • G11C16/0483H01L27/11521H01L27/11568
    • The non-volatile memory device may include one or more main strings each of which may include first and second substrings which may separately include a plurality of memory cell transistors; and a charge supply line which may be configured to provide charges to or block charges from the first and second substrings of each of the main strings, wherein each of the main strings may include a first ground selection transistor which may be connected to the first substring; a first substring selection transistor which may be connected to the first ground selection transistor; a second ground selection transistor which may be connected to the second substring; and a second substring selection transistor which may be connected to the second ground selection transistor. A method of programming a target cell of the memory device includes activating selection transistors connected to a main string and substring of the target cell.
    • 非易失性存储器件可以包括一个或多个主串,每个主弦可以包括可以分别包括多个存储单元晶体管的第一和第二子串; 以及电荷供给线,其可以被配置为向每个主串的第一和第二子串提供电荷或阻止电荷,其中每个主串可以包括第一接地选择晶体管,其可以连接到第一子串 ; 可以连接到第一接地选择晶体管的第一子串选择晶体管; 可以连接到第二子串的第二接地选择晶体管; 以及可以连接到第二接地选择晶体管的第二子串选择晶体管。 编程存储器件的目标单元的方法包括激活连接到目标单元的主串和子串的选择晶体管。
    • 29. 发明申请
    • Non-volatile memory device and method of operating the same
    • 非易失性存储器件及其操作方法
    • US20090122613A1
    • 2009-05-14
    • US12149213
    • 2008-04-29
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-eung YoonTae-hee Lee
    • Won-joo KimYoon-dong ParkJune-mo KooSuk-pil KimTae-eung YoonTae-hee Lee
    • G11C16/06G11C11/34
    • G11C16/10G11C2213/71
    • A non-volatile memory device may include a plurality of stacked semiconductor layers, a plurality of NAND strings, a common bit line, a common source line, and/or a plurality of string selection lines. The plurality of NAND strings may be on the plurality of semiconductor layers. Each of the plurality of NAND strings may include a plurality of memory cells and/or at least one string selection transistor arranged in a NAND-cell array. The common bit line may be commonly connected to each of the NAND strings at a first end of the memory cells. The common source line may be commonly connected to each of the NAND strings at a second end of the memory cells. The plurality of string selection lines may be coupled to the at least one string selection transistor included in each of the NAND strings such that a signal applied to the common bit line is selectively applied to the NAND strings.
    • 非易失性存储器件可以包括多个堆叠半导体层,多个NAND串,公共位线,公共源极线和/或多个串选择线。 多个NAND串可以在多个半导体层上。 多个NAND串中的每一个可以包括布置在NAND单元阵列中的多个存储单元和/或至少一个串选择晶体管。 公共位线可以在存储器单元的第一端处共同连接到每个NAND串。 公共源极线可以在存储器单元的第二端处共同连接到每个NAND串。 多个串选择线可以耦合到包括在每个NAND串中的至少一个串选择晶体管,使得施加到公共位线的信号被选择性地施加到NAND串。
    • 30. 发明申请
    • Unit cell of a non-volatile memory device, a non-volatile memory device and method thereof
    • 非易失性存储器件的单元,非易失性存储器件及其方法
    • US20080025106A1
    • 2008-01-31
    • US11715404
    • 2007-03-08
    • Won-joo KimSuk-pil KimJae-woong HyunYoon-dong ParkJune-mo Koo
    • Won-joo KimSuk-pil KimJae-woong HyunYoon-dong ParkJune-mo Koo
    • G11C11/34
    • G11C16/0433G11C16/0491G11C16/10H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Unit cells of a non-volatile memory device and a method thereof are provided. In an example, the unit cell may include a first memory transistor and a second memory transistor connected to each other in series and further connected in common to a word line, the first and second memory transistors including first and second storage nodes, respectively, the first and second storage nodes configured to execute concurrent memory operations. In another example, the unit cell may include a semiconductor substrate in which first and second bit line regions are defined. first and second storage node layers respectively formed on the semiconductor substrate between the first and second bit line regions, a first pass gate electrode formed on the semiconductor substrate between the first bit line region and the first storage node layer, a second pass gate electrode formed on the semiconductor substrate between the second bit line region and the second storage node layer, a third pass gate electrode formed on the semiconductor substrate between the first and second storage node layers, a third bit line region formed in a portion of the semiconductor substrate under the third pass gate electrode and a control gate electrode extending across the first and second storage node layers. The example unit cells may be implemented within a non-volatile memory device (e.g., a flash memory device), such that the non-volatile memory device may include a plurality of example unit cells.
    • 提供非易失性存储器件的单元电池及其方法。 在一个示例中,单元可以包括串联连接并进一步连接到字线的第一存储晶体管和第二存储晶体管,第一和第二存储晶体管分别包括第一和第二存储节点, 配置为执行并发存储器操作的第一和第二存储节点。 在另一示例中,单元可以包括其中限定了第一和第二位线区域的半导体衬底。 分别形成在第一和第二位线区域之间的半导体衬底上的第一和第二存储节点层,形成在第一位线区域和第一存储节点层之间的半导体衬底上的第一遍栅极电极,形成的第二遍栅极电极 在第二位线区域和第二存储节点层之间的半导体衬底上,形成在第一和第二存储节点层之间的半导体衬底上的第三遍栅极电极,形成在半导体衬底的一部分中的第三位线区域 所述第三通道栅极电极和跨越所述第一和第二存储节点层延伸的控制栅极电极。 示例性单元单元可以在非易失性存储器件(例如,闪存器件)内实现,使得非易失性存储器件可以包括多个示例单位单元。