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21. 发明申请

US20100012360A1 CIRCUIT ELEMENT MOUNTING BOARD, AND CIRCUIT DEVICE AND AIR CONDITIONER USING THE SAME 有权
标题翻译：电路元件安装板，电路装置和空调器
公开(公告)号：US20100012360A1
公开(公告)日：2010-01-21
申请号：US12516769
申请日：2007-11-29
申请人： Kouji Takahashi , Yusuke Igarashi , Jun Sakano
发明人： Kouji Takahashi , Yusuke Igarashi , Jun Sakano
IPC分类号： H05K1/16 , H05K1/00 , H05K1/09
CPC分类号： H05K1/0206 , H01L23/142 , H01L23/49822 , H01L23/49838 , H01L23/5386 , H01L23/5389 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32057 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H05K1/0265 , H05K1/056 , H05K3/202 , H05K3/384 , H05K3/44 , H05K2201/0352 , H05K2201/09554 , H05K2203/0323 , H05K2203/0369 , H05K2203/1476 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A circuit device of the present invention includes a wiring board 45, and circuit elements such as semiconductor elements 32 mounted on the wiring board 45. The wiring board 45 includes: a conductive pattern 12, which is a metal core layer; a first insulating layer 14 and a second insulating layer 16 respectively covering an upper surface and a lower surface of the conductive pattern 12; and a first wiring layer 18 and a second wiring layer 20 formed respectively on an upper surface of the first insulating layer 14 and a lower surface of the second insulating layer 16. The conductive pattern 12 is made of rolled metal. With this configuration, the thermal resistance of the conductive pattern 12, which is the metal core, is reduced, and the thermal dissipation of the entire device can be improved.
摘要翻译：本发明的电路装置包括布线板45和安装在布线板45上的诸如半导体元件32的电路元件。布线板45包括：导电图案12，其是金属芯层; 分别覆盖导电图案12的上表面和下表面的第一绝缘层14和第二绝缘层16; 以及分别形成在第一绝缘层14的上表面和第二绝缘层16的下表面上的第一布线层18和第二布线层20.导电图案12由轧制金属制成。利用这种结构，作为金属芯的导电图案12的热阻减小，并且可以提高整个器件的散热。

22. 发明授权

US07476972B2 Circuit device, manufacturing method thereof, and sheet-like board member 失效
标题翻译：电路装置及其制造方法以及片状基板部件
公开(公告)号：US07476972B2
公开(公告)日：2009-01-13
申请号：US11131638
申请日：2005-05-17
申请人： Kouji Takahashi
发明人： Kouji Takahashi
IPC分类号： H01L29/40
CPC分类号： H01L23/3107 , H01L21/4832 , H01L21/561 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2221/68377 , H01L2224/05554 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Provided is a method of manufacturing a circuit device capable of forming a thick conductive pattern while reducing a degree of side etching. In the manufacturing method for a circuit device, a first isolation trench is provided on a surface of a conductive foil, and conductive patterns are formed in convex shaped. Moreover, second isolation trenches are provided on a rear surface of the conductive foil in regions corresponding to positions where the first isolation trenches are formed. Then, resin sealing is performed after completing fixation and electrical connection of a circuit element. Thereafter, the respective conductive patterns are isolated by etching the rear surface of the conductive foil.
摘要翻译：提供一种制造能够在减少侧面蚀刻的同时形成厚导电图案的电路器件的方法。在电路装置的制造方法中，在导电箔的表面上设置有第一隔离沟槽，并且导电图案形成为凸状。此外，在对应于形成第一隔离沟槽的位置的区域中，在导电箔的后表面上设置第二隔离沟槽。然后，在完成电路元件的固定和电连接之后执行树脂密封。此后，通过蚀刻导电箔的后表面来隔离各导电图案。

23. 发明授权

US07354663B2 Thermal barrier coating, manufacturing method thereof, turbine part and gas turbine 有权
标题翻译：热障涂层，其制造方法，涡轮机部件和燃气轮机
公开(公告)号：US07354663B2
公开(公告)日：2008-04-08
申请号：US10815734
申请日：2004-04-02
申请人： Taiji Torigoe , Kazutaka Mori , Sunao Aoki , Kouji Takahashi , Minoru Ohara
发明人： Taiji Torigoe , Kazutaka Mori , Sunao Aoki , Kouji Takahashi , Minoru Ohara
IPC分类号： B32B9/00
CPC分类号： C23C4/11 , B32B15/04 , C23C28/3215 , C23C28/3455 , F05B2230/90 , F05C2253/12 , Y02T50/67 , Y10T428/12618
摘要： A thermal barrier coating enabling to prevent peeling of layer in a high temperature use and still having a high thermal barrier effect, a turbine part coated by this thermal barrier coating and a gas turbine comprising this turbine part are provided. The thermal barrier coating comprises a base material 21 of high temperature heat resistant alloy and a ceramics layer 23 formed on the base material 21. The ceramics layer 23 comprises ZrO2 added with Yb2O3 as stabilizer and is laminated on the base material via a bond coat layer 22 laminated as a metallic bond layer. A plurality of cracks 23A are preferably introduced in the ceramics layer 23. The turbine part is constructed having its surface coated with the above thermal barrier coating.
摘要翻译：提供能够防止在高温使用中并且仍然具有高热障效应的层的剥离的热障涂层，由该热障涂层涂覆的涡轮部分和包括该涡轮部的燃气轮机。隔热涂层包括高温耐热合金的基材21和形成在基材21上的陶瓷层23。陶瓷层23由添加了Yb 2 O 3 O 3的稳定剂构成的ZrO 2 2层叠在基材上，层叠有粘接层22 作为金属结合层。在陶瓷层23中优选引入多个裂纹23A。涡轮机部件被构造成具有涂覆有上述热障涂层的表面。

24. 发明授权

US07220921B1 Sheet-like board member and method of manufacturing a semiconductor device 失效
标题翻译：板状板构件及半导体装置的制造方法
公开(公告)号：US07220921B1
公开(公告)日：2007-05-22
申请号：US09678142
申请日：2000-10-03
申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
发明人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/50 , H01L2221/68377 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： In the present invention there is formed a sheet-like board member 50 having conductive coating films, such as first pads 55 and die pads 59, formed thereon or a sheet-like board member 50 which has been half-etched by using conductive coating films such as first pads 55 and die pads 59. A hybrid IC can be manufactured by means of utilization of post-processing processes of a semiconductor manufacturer. Further, a hybrid IC can be manufactured without adoption of a support board, and hence there can be manufactured a hybrid IC which is of lower profile and has superior heat dissipation characteristics.
摘要翻译：在本发明中，形成有具有导电性涂膜的片状基板部件50，例如形成在其上的第一焊盘55和焊盘59，或者通过使用导电性涂膜半刻蚀的片状基板部件50 例如第一焊盘55和焊盘59。可以通过利用半导体制造商的后处理工艺来制造混合IC。此外，可以在不采用支撑板的情况下制造混合IC，因此可以制造具有较低轮廓并具有优异散热特性的混合IC。

25. 发明申请

US20060226029A1 Measuring apparatus for ulcerative colitis diagnosis/prognostic test and method of measuring 审中-公开
标题翻译：溃疡性结肠炎诊断/预后测定用测定装置及测定方法
公开(公告)号：US20060226029A1
公开(公告)日：2006-10-12
申请号：US10566155
申请日：2004-07-30
申请人： Takeshi Nishida , Hideaki Hashimoto , Fumiyo Kusu , Hideki Hakamata , Akira Kotani , Kouji Takahashi
发明人： Takeshi Nishida , Hideaki Hashimoto , Fumiyo Kusu , Hideki Hakamata , Akira Kotani , Kouji Takahashi
IPC分类号： G01N27/26
CPC分类号： G01N30/84 , G01N2030/645 , G01N2030/8429 , G01N2800/065
摘要： A measurement apparatus for ulcerative colitis diagnosis and prognostic test according to the present invention comprises a solution mixing unit (15) for mixing an eluent and a quinone solution, the eluent being supplied from a system including a tank (9) in which the eluent used for acid separation is stored, a pump (12) for sending the eluent, a sample injection unit (13) for injecting a sample into the eluent, and an acid separation column (14) for separating short-chain fatty acids included in the sample that is injected from the sample injection unit (13), and the quinone solution being supplied from a system including a tank (8) in which the quinone solution containing quinone and supporting electrolyte is stored, and a pump (11) for sending the quinone solution; and an acid degree measurement unit (16) for measuring the acid degrees of the short-chain fatty acids separated from the sample. In the measurement apparatus for ulcerative colitis diagnosis and prognostic test which is constructed as described above, it is possible to perform ulcerative colitis diagnosis speedily, easily, and accurately, without performing blood test.
摘要翻译：根据本发明的用于溃疡性结肠炎诊断和预后测试的测量装置包括用于混合洗脱液和醌溶液的溶液混合单元（15），洗脱液由包括其中使用洗脱液的罐（9）的系统供应，储存酸分离液，用于送出洗脱液的泵（12），用于将样品注入洗脱液的样品注入单元（13）和用于分离样品中所含的短链脂肪酸的酸分离塔（14）从所述样品注入单元（13）注入的醌溶液和从包含其中存储有醌和支持电解质的醌溶液的罐（8）的系统供给的醌溶液和用于发送醌的泵（11）解; 以及用于测量从样品分离出的短链脂肪酸的酸度的酸度测定单元（16）。在如上构造的溃疡性结肠炎诊断和预后测定用测定装置中，能够不进行血液试验而快速，容易，准确地进行溃疡性结肠炎诊断。

26. 发明授权

US07053492B2 Circuit device and method of manufacturing the same 失效
标题翻译：电路装置及其制造方法
公开(公告)号：US07053492B2
公开(公告)日：2006-05-30
申请号：US10632623
申请日：2003-08-01
申请人： Kouji Takahashi , Kazuhisa Kusano , Noriaki Sakamoto
发明人： Kouji Takahashi , Kazuhisa Kusano , Noriaki Sakamoto
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L24/83 , C25D7/12 , H01L21/4832 , H01L23/3107 , H01L23/49582 , H01L23/498 , H01L23/49838 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05647 , H01L2224/26175 , H01L2224/291 , H01L2224/29101 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2224/83205 , H01L2924/00012
摘要： The overflow of a brazing material (19) from a die pad (11) is prevented by forming a second plating film (14B) on the surface of the die pad (11). The second plating film (14B) is provided around the surface of the die pad 11 so as to enclose an area where a semiconductor element (13) is mounted. In a step of mounting the semiconductor element (13) on the die pad (11) with the brazing material (19), the brazing material (19) overflows from the first plating film (14A) when the semiconductor element (13) is mounted on the upper part of the molten brazing material. However, the second plating film (14B) functions as a blocking area by which the overflow of the brazing material is prevented. Therefore, a short circuit can be prevented from arising between the die pad (11) and the bonding pad (12) because of the brazing material that has spread.
摘要翻译：通过在管芯焊盘（11）的表面上形成第二镀膜（14B）来防止钎焊材料（19）从管芯焊盘（11）溢出。第二电镀膜（14B）设置在芯片焊盘11的表面周围，以包围安装半导体元件（13）的区域。在利用钎料（19）将半导体元件（13）安装在芯片焊盘（11）上的步骤中，半导体元件（13）为半导体元件（13）时，钎焊材料（19）从第一镀膜（14A）溢出安装在熔融钎焊材料的上部。然而，第二电镀膜（14B）用作防止钎焊材料的溢出的阻挡区域。因此，由于已经扩展的钎焊材料，可以防止在芯片焊盘（11）和焊盘（12）之间产生短路。

29. 发明授权

US06933604B2 Semiconductor device, semiconductor module and hard disk 失效
标题翻译：半导体器件，半导体模块和硬盘
公开(公告)号：US06933604B2
公开(公告)日：2005-08-23
申请号：US09810117
申请日：2001-03-16
申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
发明人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Yukio Okada , Yusuke Igarashi , Eiju Maehara , Kouji Takahashi
IPC分类号： H01L23/28 , H01L21/48 , H01L23/12 , H01L23/29 , H01L23/36 , H01L23/42 , H01L23/433 , H01L25/04 , H01L25/18 , H05K1/02 , H05K1/18 , H01L23/34 , H01L23/995 , H01L921/4763
CPC分类号： H05K1/021 , G11B5/4853 , H01L21/4832 , H01L23/36 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/73257 , H01L2224/85001 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10161 , H01L2924/10162 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H05K1/0204 , H05K1/182 , H05K1/189 , H05K2201/10416 , H05K2201/10727 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate (23) and the second supporting member (24).
摘要翻译：半导体芯片（16）的背面从绝缘树脂（13）的背面露出，金属板（23）固定在该半导体芯片（16）上。该金属板（23）的后表面和第一支撑构件（11）的后表面基本上位于同一平面内，从而容易地固定在第二支撑构件（24）上。因此，可以通过金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。

30. 发明申请

US20050104198A1 Circuit device and manufacturing method thereof 失效
标题翻译：电路装置及其制造方法
公开(公告)号：US20050104198A1
公开(公告)日：2005-05-19
申请号：US10953299
申请日：2004-09-29
申请人： Kouji Takahashi
发明人： Kouji Takahashi
IPC分类号： H01L23/12 , H01L21/48 , H01L23/31 , H01L23/495 , H01L23/50 , H01L25/04 , H01L25/18 , H05K1/02 , H05K1/18 , H05K3/20 , H01L21/44 , H01L21/50 , H01L21/76 , H01L23/043
CPC分类号： H01L24/97 , H01L21/4832 , H01L23/3107 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/0603 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H05K1/187 , H05K3/202 , H05K2203/0353 , H05K2203/0369 , H05K2203/1476 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： Provided is a circuit device having conductive patterns which are equally spaced apart and a manufacturing method thereof. A method for manufacturing a circuit device of the present invention includes the steps of: preparing a conductive foil; forming conductive patterns, which are included in a unit having at least regions for mounting circuit elements, by forming isolation trenches having a uniform width in the conductive foil; electrically connecting the conductive patterns to the circuit elements; sealing with a sealing resin so as to cover the circuit elements and to be filled in the isolation trenches; and removing the conductive foil in its thickness portions where no isolation trenches are provided.
摘要翻译：提供了具有等距间隔的导电图案的电路装置及其制造方法。本发明的电路装置的制造方法包括以下步骤：制备导电箔; 形成导电图案，其通过形成在导电箔中具有均匀宽度的隔离沟槽而包括在至少具有用于安装电路元件的区域的单元中; 将导电图案电连接到电路元件; 用密封树脂密封以覆盖电路元件并填充在隔离沟槽中; 并且在其不设置隔离沟槽的厚度部分中去除导电箔。

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