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    • 21. 发明授权
    • Method for arranging and rotating a semiconductor wafer within a photolithography tool prior to exposing the wafer
    • 在曝光晶片之前在光刻工具内布置和旋转半导体晶片的方法
    • US07352444B1
    • 2008-04-01
    • US11158513
    • 2005-06-22
    • Christopher A. SeamsYonghong YangClifford P. SandstromPrakash R. Krishanan
    • Christopher A. SeamsYonghong YangClifford P. SandstromPrakash R. Krishanan
    • G03B27/32
    • G03F9/7003G03F9/7011G03F9/708G03F9/7088
    • A method for arranging a semiconductor wafer within a photolithography tool and methods for processing a semiconductor wafer employing such an arrangement process are provided. The arrangement process includes positioning a semiconductor wafer on a stage in a pre-alignment unit of a photolithography tool such that a crystal orientation marker of the wafer is located at a first radial position. Thereafter, the wafer is moved to an exposure unit of the photolithography tool. During one or both of such steps, the semiconductor wafer is rotated such that the crystal orientation marker is relocated to a second, distinct radial position prior to arranging the wafer upon a stage of the exposure unit. In particular, the semiconductor wafer is rotated greater than approximately 10° and less than approximately 170° relative to the first radial position. The arrangement process is performed for lithography processes conducted during fabrication of a semiconductor device.
    • 提供了一种在光刻工具中布置半导体晶片的方法以及使用这种布置方法来处理半导体晶片的方法。 布置过程包括将半导体晶片定位在光刻工具的预对准单元中的台上,使得晶片的晶体取向标记位于第一径向位置。 此后,将晶片移动到光刻工具的曝光单元。 在一个或两个这样的步骤期间,半导体晶片被旋转,使得在将晶片布置在曝光单元的阶段之前,晶体取向标记被重新定位到第二,不同的径向位置。 特别地,半导体晶片相对于第一径向位置旋转大于约10°且小于约170°。 对在半导体器件的制造期间进行的光刻处理执行布置处理。
    • 22. 发明申请
    • Adaptive analysis methods
    • 自适应分析方法
    • US20070244676A1
    • 2007-10-18
    • US11713790
    • 2007-03-05
    • Li ShangYonghong YangRobert Dick
    • Li ShangYonghong YangRobert Dick
    • G06F17/10
    • G06F17/5018G06F2217/80
    • This invention relates to a comprehensive method of analyzing dynamic and steady-state properties of a system. Steady state (static), short time scale dynamic, and long time scale dynamic properties of the system are described by a plurality of elements. The method unifies spatial, temporal, and frequency-domain techniques to minimize analysis time while maintaining accuracy during both steady state, short time scale, and long time scale analysis. The method dynamically adapts spatial and temporal modeling granularity to achieve high efficiency while maintaining accuracy. The method is applicable to properties of a system that diffuse through space and/or time, such as temperature, concentration, density, etc., in fields such as biomedical modeling, molecular dynamics, meteorology, astrophysics, financial analysis, engineering, etc., and in particular, to thermal analysis of electronic devices such as integrated circuits.
    • 本发明涉及分析系统的动态和稳态属性的综合方法。 由多个元素描述系统的稳态(静态),短时刻度动态和长时间尺度动态属性。 该方法统一了空间,时域和频域技术,以最小化分析时间,同时保持稳态,短时间尺度和长时间尺度分析的准确性。 该方法动态地适应空间和时间建模粒度,以实现高效率,同时保持精度。 该方法适用于诸如生物医学建模,分子动力学,气象学,天体物理学,财务分析,工程等领域的通过空间和/或时间扩散的系统的性质,如温度,浓度,密度等。 特别涉及诸如集成电路的电子设备的热分析。