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21. 发明授权

US06423141B1 Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US06423141B1
公开(公告)日：2002-07-23
申请号：US09358980
申请日：1999-07-22
申请人： Jeff Lin , John Trublowski , Vinh Van Ha
发明人： Jeff Lin , John Trublowski , Vinh Van Ha
IPC分类号： B05C302
CPC分类号： B41F15/42 , B41F15/40 , H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The compression head cap further includes a plurality of members which are selectively and movably disposed within the contained environment and which selectively remove an amount of the material from the environment, effective to prevent the material from being undesirably dispensed by the head cap.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新型装置具有压缩头帽，其提供容纳的环境以引导和帮助压力粘性材料流过模板中的开口。压缩头帽还包括多个构件，其被选择性地和可移动地设置在所容纳的环境中并且选择性地从环境中去除一定量的材料，有效地防止材料被头帽不期望地分配。

22. 发明授权

US06357414B1 Air manifold mounting for engine control circuitry 失效
标题翻译：用于发动机控制电路的空气歧管安装
公开(公告)号：US06357414B1
公开(公告)日：2002-03-19
申请号：US09553009
申请日：2000-04-20
申请人： Pawel Kalinowski , Bharat Z. Patel , Timothy J. Yerdon , John Trublowski , Prathap A. Reddy , Harvinder Singh
发明人： Pawel Kalinowski , Bharat Z. Patel , Timothy J. Yerdon , John Trublowski , Prathap A. Reddy , Harvinder Singh
IPC分类号： F01P106
CPC分类号： F02M35/10249 , F02D9/02 , F02D41/3005 , F02D2400/18 , F02D2400/21 , F02M35/10019 , F02M35/10222 , F05C2225/08 , G01F1/684 , H01R12/613 , H01R13/26 , H05K1/189
摘要： Central mounting of control electronics proximate to the engine is provided by attaching the electronics to an upper surface of the intake manifold to provide heat shielding and heat conduction for active components on the circuit card. The central location provides extremely short harnesses to important actuators located in cylinder heads of the engine thus reducing wiring clutter and cost.
摘要翻译：通过将电子装置附接到进气歧管的上表面来提供靠近发动机的控制电子装置的中央安装，以为电路卡上的有源部件提供热屏蔽和热传导。中心位置为位于发动机气缸盖的重要执行机构提供极短的线束，从而减少了布线杂乱和成本。

23. 发明授权

US06302306B1 Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US06302306B1
公开(公告)日：2001-10-16
申请号：US09358981
申请日：1999-07-22
申请人： Jeff Jin Her Lin , John Trublowski , Vinh Van Ha
发明人： Jeff Jin Her Lin , John Trublowski , Vinh Van Ha
IPC分类号： B67D542
CPC分类号： B41F15/42 , H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The apparatus further includes a selectively expandable diaphragm which selectively and expandably allows the viscous material to be dispensed into the compression head cap.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新型装置具有压缩头帽，其提供容纳的环境以引导和帮助压力粘性材料流过模板中的开口。该装置还包括选择性地可膨胀的膜片，其选择性地且可膨胀地允许将粘性材料分配到压缩头盖中。

24. 发明授权

US06286422B1 Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US06286422B1
公开(公告)日：2001-09-11
申请号：US09359617
申请日：1999-07-22
申请人： Jeff (Jin Her) Lin , John Trublowski , Vinh Van Ha
发明人： Jeff (Jin Her) Lin , John Trublowski , Vinh Van Ha
IPC分类号： B41F1544
CPC分类号： B41F15/42 , B41F15/44 , H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新型装置具有压缩头帽，其提供容纳的环境以引导和帮助压力粘性材料流过模板中的开口。

25. 发明授权

US5917704A Laser-solderable electronic component 失效
标题翻译：激光可焊接电子部件
公开(公告)号：US5917704A
公开(公告)日：1999-06-29
申请号：US944700
申请日：1997-10-06
申请人： John Trublowski , Andrew Z. Glovatsky , Richard Keith McMillan, II , Bernard Allen Meyer
发明人： John Trublowski , Andrew Z. Glovatsky , Richard Keith McMillan, II , Bernard Allen Meyer
IPC分类号： H01L23/31 , H01L23/433 , H05K1/02 , H05K3/34 , H05K7/20
CPC分类号： H01L23/4334 , H01L23/3121 , H05K3/341 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K1/0206 , H05K2201/0112 , H05K2201/09909 , H05K2201/10166 , H05K2201/10969 , H05K2203/107 , H05K3/3452 , H05K3/3494 , Y02P70/613
摘要： There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.
摘要翻译：这里公开了一种具有整体散热器16的电子部件10，其特别设计用于辅助将散热器激光焊接到衬底20上的焊盘22上。部件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大体上垂直于顶表面和底表面之间。部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端接件14的一部分。散热器16限定电子部件10的至少一部分底表面32，并且至少电子部件10的至少一个周边外表面34的一部分。

26. 发明授权

US5705104A Method for embedding conductors in a structure 失效
标题翻译：将导体嵌入结构中的方法
公开(公告)号：US5705104A
公开(公告)日：1998-01-06
申请号：US644398
申请日：1996-05-10
申请人： John Trublowski , Michael George Todd , Robert Edward Belke, Jr.
发明人： John Trublowski , Michael George Todd , Robert Edward Belke, Jr.
IPC分类号： B60R16/02 , B29D11/00 , B32B27/04
CPC分类号： B60R16/0207
摘要： A method, and an article produced according to the method, for embedding conductors in a structure having a signal distribution function associated therewith such as a vehicle instrument panel. The method includes embedding a conductor in a film, and molding a material to the film such that the material and the film integrally form the structure. The method also includes attaching a connector to the integral structure so that the connector is provided in communication with the conductor.
摘要翻译：根据该方法制造的方法和制品，用于将导体嵌入具有与其相关联的信号分配功能的结构中，例如车辆仪表板。该方法包括将导体嵌入到膜中，并将材料模制成膜，使得材料和膜一体地形成结构。该方法还包括将连接器附接到整体结构，使得连接器设置成与导体连通。

27. 发明授权

US09126130B2 Fluid vessel with abrasion and corrosion resistant interior cladding 有权
标题翻译：具有磨损和耐腐蚀内部包层的流体容器
公开(公告)号：US09126130B2
公开(公告)日：2015-09-08
申请号：US13097720
申请日：2011-04-29
申请人： Michael Lee Killian , John Trublowski , Christopher S. Rau , Derek R. Thelen
发明人： Michael Lee Killian , John Trublowski , Christopher S. Rau , Derek R. Thelen
IPC分类号： B01D35/30 , B65D90/02 , B23K31/02 , B23K26/08 , B23K26/14 , B23K26/32 , B23K26/34 , B23K35/30 , B23K35/32 , B23K35/02 , B01D35/00 , B23K26/00
CPC分类号： B01D35/30 , B23K26/0823 , B23K26/144 , B23K26/32 , B23K26/342 , B23K31/02 , B23K35/0244 , B23K35/3033 , B23K35/3046 , B23K35/32 , B23K2101/06 , B23K2101/34 , B23K2101/35 , B23K2103/02 , B23K2103/04 , B23K2103/05 , B23K2103/06 , B23K2103/08 , B23K2103/18 , B23K2103/26 , B23K2103/50
摘要： A fluid vessel includes a body structure defining a cavity, an inlet structure defining a first channel, and an outlet structure defining a second channel. The body structure includes an overlay material surrounding the cavity, and includes a metal substrate surrounding the overlay material. The first channel and second channel are provided in fluid communication with the cavity. The inlet structure and outlet structure each include an overlay material surrounding the respective first channel and second channel, and include a metal substrate surrounding the respective overlay material. The overlay material of each of the body structure, the inlet structure, and the outlet structure is fused to the respective metal substrate of the body structure, the inlet structure, and the outlet structure through laser cladding.
摘要翻译：流体容器包括限定空腔的主体结构，限定第一通道的入口结构以及限定第二通道的出口结构。身体结构包括围绕空腔的覆盖材料，并且包括围绕覆盖材料的金属基底。第一通道和第二通道设置成与空腔流体连通。入口结构和出口结构各自包括围绕相应的第一通道和第二通道的覆盖材料，并且包括围绕各个覆盖材料的金属基底。主体结构，入口结构和出口结构中的每一个的覆盖材料通过激光包层熔合到主体结构的相应金属基底，入口结构和出口结构。

28. 发明授权

US06992887B2 Liquid cooled semiconductor device 失效
标题翻译：液冷半导体器件
公开(公告)号：US06992887B2
公开(公告)日：2006-01-31
申请号：US10685979
申请日：2003-10-15
申请人： Vivek A. Jairazbhoy , Prathap A. Reddy , John Trublowski
发明人： Vivek A. Jairazbhoy , Prathap A. Reddy , John Trublowski
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. The wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material. The substrate is mounted to the base, whereby the second side of the spreader is exposed to allow fluid to flow across the second side, directed within a channel defined by the base, and transfer heat away from the spreader.
摘要翻译：提供液冷半导体器件。该装置包括半导体管芯，散热器，润湿材料，密封剂，基底和基底。扩展器安装到基板上，使得扩展器的第一侧暴露在基板的一侧上，并且扩展器的第二侧暴露在基板的相对侧上。连接到扩展器的第一侧是半导体管芯。润湿材料用于在模具和散热器之间提供热/电连接。在模具和散热器之间提供密封剂以包封和容纳润湿材料。衬底被安装到基座上，从而暴露扩散器的第二侧以允许流体流过第二侧，指向由基座限定的通道内，并将热量从扩展器传送出去。

29. 发明授权

US06977337B1 Electronic assembly packaging 失效
标题翻译：电子组装包装
公开(公告)号：US06977337B1
公开(公告)日：2005-12-20
申请号：US10869729
申请日：2004-06-16
申请人： Anthony Nicolo Satullo , Robert E. Belke , Hong Zhou , Diane M. Jett , Bertrand R. Mohr , John Trublowski , Michael S. Schulke , Adam W. Schubring
发明人： Anthony Nicolo Satullo , Robert E. Belke , Hong Zhou , Diane M. Jett , Bertrand R. Mohr , John Trublowski , Michael S. Schulke , Adam W. Schubring
IPC分类号： H01J5/00 , H01L23/28 , H05K5/04 , H05K7/20 , H05K9/00
CPC分类号： H05K7/20436 , H05K9/0015
摘要： The present invention provides an assembly for protecting automotive electronics. The assembly includes a circuit board, a cover, and a metal housing. The metal housing is disposed over and around the circuit board. The cover and metal housing are crimped together to create a seal that protects the circuit board inside the metal housing and attaches the cover to the metal housing.
摘要翻译：本发明提供一种用于保护汽车电子的组件。组件包括电路板，盖和金属外壳。金属外壳设置在电路板的上方和周围。盖和金属壳体被压接在一起以形成密封件，其保护金属壳体内部的电路板并将盖子附接到金属壳体。

30. 发明申请

US20050083652A1 Liquid cooled semiconductor device 失效
标题翻译：液冷半导体器件
公开(公告)号：US20050083652A1
公开(公告)日：2005-04-21
申请号：US10685979
申请日：2003-10-15
申请人： Vivek Jairazbhoy , Prathap Reddy , John Trublowski
发明人： Vivek Jairazbhoy , Prathap Reddy , John Trublowski
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. The wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material. The substrate is mounted to the base, whereby the second side of the spreader is exposed to allow fluid to flow across the second side, directed within a channel defined by the base, and transfer heat away from the spreader.
摘要翻译：提供液冷半导体器件。该装置包括半导体管芯，散热器，润湿材料，密封剂，基底和基底。扩展器安装到基板上，使得扩展器的第一侧暴露在基板的一侧上，并且扩展器的第二侧暴露在基板的相对侧上。连接到扩展器的第一侧是半导体管芯。润湿材料用于在模具和散热器之间提供热/电连接。在模具和散热器之间提供密封剂以包封和容纳润湿材料。衬底被安装到基座上，从而暴露扩散器的第二侧以允许流体流过第二侧，指向由基座限定的通道内，并将热量从扩展器传送出去。

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