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    • 21. 发明授权
    • Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers
    • 三维CMOS集成电路具有建立在不同晶体取向晶片上的器件层
    • US06821826B1
    • 2004-11-23
    • US10674644
    • 2003-09-30
    • Victor ChanKathryn W. GuariniMeikei Ieong
    • Victor ChanKathryn W. GuariniMeikei Ieong
    • H01L2904
    • H01L21/6835H01L25/0657H01L27/0688H01L27/1203H01L2221/68368H01L2924/0002H01L2924/00
    • Three-dimensional (3D) integration schemes of fabricating a 3D integrated circuit in which the pFETs are located on an optimal crystallographic surface for that device and the nFETs are located on a optimal crystallographic surface for that type of device are provided. In accordance with a first 3D integration scheme of the present invention, first semiconductor devices are pre-built on a semiconductor surface of a first silicon-on-insulator (SOI) substrate and second semiconductor devices are pre-built on a semiconductor surface of a second SOI substrate. After pre-building those two structures, the structure are bonded together and interconnect through wafer-via through vias. In a second 3D integration scheme, a blanket silicon-on-insulator (SOI) substrate having a first SOI layer of a first crystallographic orientation is bonded to a surface of a pre-fabricating wafer having second semiconductor devices on a second SOI layer that has a different crystallographic orientation than the first SOI layer; and forming first semiconductor device on the first SOI layer.
    • 提供制造3D集成电路的三维(3D)积分方案,其中pFET位于该器件的最佳晶体表面上,并且nFET位于用于该类型器件的最佳晶体表面上。 根据本发明的第一3D集成方案,第一半导体器件预先构建在第一绝缘体上硅(SOI)衬底的半导体表面上,并且第二半导体器件预先构建在第一绝缘体上硅绝缘体 第二SOI衬底。 在预先构建这两个结构之后,将结构粘合在一起并通过晶片通孔通孔进行互连。 在第二3D集成方案中,具有第一晶体取向的第一SOI层的绝缘硅绝缘体(SOI)衬底被结合到具有第二SOI层的具有第二半导体器件的预制晶片的表面上,所述第二SOI层具有 不同于第一SOI层的晶体取向; 以及在所述第一SOI层上形成第一半导体器件。
    • 22. 发明授权
    • Laser communication transceiver and system
    • 激光通信收发器和系统
    • US5710652A
    • 1998-01-20
    • US199115
    • 1994-02-22
    • Scott H. BloomEric KorevaarVictor ChanIrene ChenMichael D. RiversAmy Low
    • Scott H. BloomEric KorevaarVictor ChanIrene ChenMichael D. RiversAmy Low
    • H04B10/118H04B10/00
    • H04B10/118
    • A laser communication transceiver for transmitting information via laser beams to and from other similar laser communication transceivers. Each transceiver comprises a wavelength locked beacon laser providing a beacon beam. The transceivers determine the precise location of other transceivers by detecting these beacon beams with beacon receive units comprising atomic line filters matched to the beacon wavelength. Signals are transmitted by imposing an electronic signal on laser beams produced by one or more signal laser devices. These signals are directed with precision at other transceivers, and the signal beams are detected with very narrow field of view signal receive units. In a preferred embodiment, these transceivers are installed on 66 satellites in low earth orbit and on selected mountain tops on earth to provide a global communication system.
    • 一种激光通信收发器,用于经由激光束向其它类似的激光通信收发器发送信息。 每个收发器包括提供信标光束的波长锁定信标激光器。 收发器通过用包括与信标波长匹配的原子线滤波器的信标接收单元来检测这些信标波束来确定其他收发机的精确位置。 通过在由一个或多个信号激光装置产生的激光束上施加电子信号来传输信号。 这些信号在其他收发器处被精确地引导,并且以非常窄的视场信号接收单元检测信号光束。 在优选实施例中,这些收发器安装在低地球轨道上的66颗卫星和地球上选定的山顶上,以提供全球通信系统。
    • 23. 发明授权
    • Deploying multiple e-commerce systems in a single computing platform
    • 在单个计算平台中部署多个电子商务系统
    • US08612379B2
    • 2013-12-17
    • US10907161
    • 2005-03-23
    • Victor ChanMark William HubbardDarshanand KhusialLev Mirlas
    • Victor ChanMark William HubbardDarshanand KhusialLev Mirlas
    • G06F7/00
    • G06Q30/0601G06Q30/06
    • A method, system, architecture and apparatus for deploying multiple e-commerce systems in a single computing platform. In accordance with the present invention, an e-commerce systems architecture can include an instantiable owning business logic component derived from an abstract business definition and one or more instantiable business element components configured for aggregation under the control of a business facility instance. The business facility instance can include a coupling to an instance of the owning business logic component. Finally, the architecture can include an instantiable partner business component derived from the abstract business definition. In particular, the instantiable partner business component can include a configuration for limited access to selected ones of the instantiable business element components aggregated under the control of the business facility instance.
    • 用于在单个计算平台中部署多个电子商务系统的方法,系统,架构和装置。 根据本发明,电子商务系统架构可以包括从抽象业务定义导出的可实例拥有的业务逻辑组件和被配置用于在业务设施实例的控制下聚合的一个或多个可实例化业务元素组件。 业务设施实例可以包括与所拥有的业务逻辑组件的实例的耦合。 最后,架构可以包含从抽象业务定义派生的可实例化的伙伴业务组件。 特别地,可实例性的合作伙伴业务组件可以包括用于对在业务设施实例的控制下聚合的可实例化业务元素组件中的所选择的那些的有限访问的配置。
    • 26. 发明授权
    • Method and apparatus for dispensing diagnostic test strips
    • 用于分配诊断测试条的方法和装置
    • US07887757B2
    • 2011-02-15
    • US11430178
    • 2006-05-09
    • Victor Chan
    • Victor Chan
    • B01L9/00
    • G01N33/48757B65D83/0829B65D83/087B65H3/24G01N33/4875
    • An apparatus for storing and dispensing a test strip includes a container configured to store a stack of test strips. The container maintains appropriate environmental conditions, such as humidity, for storing the test strips. An engaging member is disposed in the container and is adapted to contact one test strip of the stack of test strips. An actuator actuates the engaging member to dispense the one test strip from the container. Since one test strip is dispensed at a time, the remaining test strips are not handled by the user. Accordingly, the unused test strips remain free of contaminants such as naturally occurring oils on the user's hand.
    • 用于存储和分配测试条的设备包括被配置为存储测试条的堆叠的容器。 容器保持适当的环境条件,例如湿度,用于存放测试条。 接合构件设置在容器中并且适于接触测试条堆叠的一个测试条。 致动器致动接合构件以从容器分配一个测试条。 由于一次分配一个测试条,所以剩余的测试条不被用户处理。 因此,未使用的测试条保持没有污染物,例如用户手上的天然存在的油。
    • 28. 发明申请
    • MECHANICAL STRESS CHARACTERIZATION IN SEMICONDUCTOR DEVICE
    • 半导体器件中的机械应力特性
    • US20080284462A1
    • 2008-11-20
    • US12181566
    • 2008-07-29
    • Victor ChanKhee Yong Lim
    • Victor ChanKhee Yong Lim
    • G01R31/28
    • G01R31/2648
    • Methods of characterizing a mechanical stress level in a stressed layer of a transistor and a mechanical stress characterizing test structure are disclosed. In one embodiment, the test structure includes a first test transistor including a first stress level; and at least one second test transistor having a substantially different second stress level. A testing circuit can then be used to characterize the mechanical stress level by comparing performance of the first test transistor and the at least one second test transistor. The type of test structure depends on the integration scheme used. In one embodiment, at least one second test transistor is provided with a substantially neutral stress level and/or an opposite stress level from the first stress level. The substantially neutral stress level may be provided by either rotating the transistor, removing the stressed layer causing the stress level or de-stressing the stressed layer causing the stress layer.
    • 公开了在晶体管的应力层中表征机械应力水平的方法和机械应力表征测试结构。 在一个实施例中,测试结构包括包括第一应力水平的第一测试晶体管; 以及至少一个具有基本上不同的第二应力水平的第二测试晶体管。 然后可以通过比较第一测试晶体管和至少一个第二测试晶体管的性能来测试电路来表征机械应力水平。 测试结构的类型取决于所使用的集成方案。 在一个实施例中,至少一个第二测试晶体管具有与第一应力水平基本上中性的应力水平和/或相反的应力水平。 基本中性的应力水平可以通过旋转晶体管来提供,去除施加应力的应力层,或者使应力层的应力层解除应力层。
    • 29. 发明授权
    • Mechanical stress characterization in semiconductor device
    • 半导体器件中的机械应力表征
    • US07436169B2
    • 2008-10-14
    • US11162295
    • 2005-09-06
    • Victor ChanKhee Yong Lim
    • Victor ChanKhee Yong Lim
    • G01R31/28
    • G01R31/2648
    • Methods of characterizing a mechanical stress level in a stressed layer of a transistor and a mechanical stress characterizing test structure are disclosed. In one embodiment, the test structure includes a first test transistor including a first stress level; and at least one second test transistor having a substantially different second stress level. A testing circuit can then be used to characterize the mechanical stress level by comparing performance of the first test transistor and the at least one second test transistor. The type of test structure depends on the integration scheme used. In one embodiment, at least one second test transistor is provided with a substantially neutral stress level and/or an opposite stress level from the first stress level. The substantially neutral stress level may be provided by either rotating the transistor, removing the stressed layer causing the stress level or de-stressing the stressed layer causing the stress layer.
    • 公开了在晶体管的应力层中表征机械应力水平的方法和机械应力表征测试结构。 在一个实施例中,测试结构包括包括第一应力水平的第一测试晶体管; 以及至少一个具有基本上不同的第二应力水平的第二测试晶体管。 然后可以通过比较第一测试晶体管和至少一个第二测试晶体管的性能来测试电路来表征机械应力水平。 测试结构的类型取决于所使用的集成方案。 在一个实施例中,至少一个第二测试晶体管具有基本上中性的应力水平和/或与第一应力水平相反的应力水平。 可以通过旋转晶体管来提供基本中性的应力水平,去除引起应力水平的应力层或者使施加应力层的应力层去应力。