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21. 发明授权

US07605682B2 Magnetic core type laminated inductor 有权
标题翻译：磁芯式层叠电感器
公开(公告)号：US07605682B2
公开(公告)日：2009-10-20
申请号：US11338482
申请日：2006-01-24
申请人： Fumiaki Nakao , Kazunari Suzuki , Mikio Kitaoka , Daisuke Matsubayashi , Shigenori Suzuki
发明人： Fumiaki Nakao , Kazunari Suzuki , Mikio Kitaoka , Daisuke Matsubayashi , Shigenori Suzuki
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F27/2804
摘要： In a magnetic core type laminated inductor, magnetic gap layers are interposed between layers of conductive patterns, and the magnetic gap layers are formed separately on multiple layers mutually distant from each other while sandwiching a magnetic body layer. Moreover, the multiple magnetic gap layers are vertically symmetrically disposed relative to a central portion of lamination in a magnetically equivalent fashion, and the respective magnetic gap layers interpose at least two layers of the conductive patterns therebetween.
摘要翻译：在磁芯式层叠电感器中，磁性层插入在导电图案层之间，并且磁隙层分别形成在彼此相互间隔的多个层上，同时夹着磁性体层。此外，多个磁隙层相对于层叠的中心部分以磁等效的方式垂直对称地设置，并且各个磁隙层在其间插入至少两层导电图案。

22. 发明授权

US07452787B2 Fabrication method of semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US07452787B2
公开(公告)日：2008-11-18
申请号：US11020049
申请日：2004-12-23
申请人： Chuichi Miyazaki , Yoshiyuki Abe , Toshihide Uematsu , Minoru Kimura , Kazunari Suzuki , Masao Odagiri , Hideyuki Suga , Manabu Takata
发明人： Chuichi Miyazaki , Yoshiyuki Abe , Toshihide Uematsu , Minoru Kimura , Kazunari Suzuki , Masao Odagiri , Hideyuki Suga , Manabu Takata
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/02238 , H01L21/02255 , H01L21/30625 , H01L21/314 , H01L21/31654 , H01L21/31675 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/6834
摘要： A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.
摘要翻译：一种能够从切割带稳定地释放芯片的技术包括：将压敏粘合带粘附到形成有集成电路的半导体晶片的电路形成表面上，研磨半导体晶片的背面，以实现预定厚度，强制氧化半导体晶片的背面。然后，剥离粘附到半导体晶片的电路形成表面的压敏粘合带，并将切割带粘附到半导体晶片的背面。此外，通过将半导体晶片切割成单独的芯片来分割半导体晶片，然后通过切割带对芯片的背面进行压制，从而从切割带释放芯片。

23. 发明授权

US07199469B2 Semiconductor device having stacked semiconductor chips sealed with a resin seal member 失效
标题翻译：具有用树脂密封构件密封的层叠半导体芯片的半导体装置
公开(公告)号：US07199469B2
公开(公告)日：2007-04-03
申请号：US09964484
申请日：2001-09-28
申请人： Toru Ishida , Tetsuharu Urawa , Fujio Ito , Tomoo Matsuzawa , Kazunari Suzuki , Akihiko Kameoka , Hiromichi Suzuki , Takuji Ide
发明人： Toru Ishida , Tetsuharu Urawa , Fujio Ito , Tomoo Matsuzawa , Kazunari Suzuki , Akihiko Kameoka , Hiromichi Suzuki , Takuji Ide
IPC分类号： H01L23/48 , H01L23/495 , H01L23/50 , H01L25/18 , H01L25/065
CPC分类号： H01L24/06 , H01L23/49575 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48599 , H01L2224/49113 , H01L2224/49171 , H01L2224/4945 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2225/06555 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2224/48227 , H01L2924/00012
摘要： The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.
摘要翻译：降低半导体器件的成本。通过布置在第一半导体芯片周围的引线的引线的内部引线部分和两个接合线来制造堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片之间的电连接。

24. 发明授权

US07176060B2 Integrated circuit card and a method of manufacturing the same 失效
标题翻译：集成电路卡及其制造方法
公开(公告)号：US07176060B2
公开(公告)日：2007-02-13
申请号：US10902024
申请日：2004-07-30
申请人： Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
发明人： Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
IPC分类号： H01L21/00
CPC分类号： G06K19/07745 , G06K19/077 , G06K19/07718 , G06K19/07724 , G06K19/07733 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.
摘要翻译：推动插入式通用IC卡的多功能结构，降低制造成本。插件UICC的主体由模制树脂构成。胶带基板和安装在带基材一侧的芯片被密封在模塑树脂的内部。与带基片的芯片安装侧相对的一侧暴露于模制树脂的外部，构成插件UICC的表面部分。作为插件UICC的外部端子的接触图案形成在暴露于成型树脂的外部的带基材的表面上。在其主体由模制树脂构成的插件UICC中，即使在芯片尺寸较大的情况下也可以有效地防止芯片的开裂。

25. 发明申请

US20060212603A1 Apparatus and method for controlling storage device 失效
标题翻译：用于控制存储设备的装置和方法
公开(公告)号：US20060212603A1
公开(公告)日：2006-09-21
申请号：US11366933
申请日：2006-03-02
申请人： Masakazu Satoh , Kazunari Suzuki
发明人： Masakazu Satoh , Kazunari Suzuki
IPC分类号： G06F15/16
CPC分类号： H04L67/1097 , H04L67/2852 , H04L67/2861 , H04L67/2876
摘要： A method and apparatus for controlling a transmission of data from a first storage device to a second storage device. The first storage device includes a recording unit for recording the data, a buffer for temporarily storing the data read from the recording unit, and a transmission unit for transmitting the data read from the buffer. It is determined that sufficient buffer space in the buffer is not available for the transmission of the data in a predetermined time interval. It is ascertained whether a transmission error exists in a communication line connecting the first storage device to the second storage device. If the transmission error exits, then the transmission unit is controlled to not perform the transmission of the data from the first storage device; otherwise the transmission unit is not controlled to not perform the transmission of the data from the first storage device.
摘要翻译：一种用于控制数据从第一存储设备传输到第二存储设备的方法和设备。第一存储装置包括用于记录数据的记录单元，用于临时存储从记录单元读取的数据的缓冲器和用于发送从缓冲器读取的数据的发送单元。确定缓冲器中的足够的缓冲器空间不能用于在预定时间间隔内传输数据。确定在将第一存储设备连接到第二存储设备的通信线路中是否存在传输错误。如果发送错误退出，则控制发送单元不执行来自第一存储装置的数据的发送; 否则传输单元不被控制为不执行来自第一存储设备的数据的传输。

26. 发明申请

US20050167808A1 Semiconductor device, its fabrication method and electronic device 审中-公开
标题翻译：半导体器件，其制造方法和电子器件
公开(公告)号：US20050167808A1
公开(公告)日：2005-08-04
申请号：US11092685
申请日：2005-03-30
申请人： Masako Sasaki , Kazunari Suzuki , Seiichi Ichihara , Tomoaki Kudaishi , Hisao Nakamura , Kunihiko Nishi , Hideki Tanaka , Yutaka Nakajima
发明人： Masako Sasaki , Kazunari Suzuki , Seiichi Ichihara , Tomoaki Kudaishi , Hisao Nakamura , Kunihiko Nishi , Hideki Tanaka , Yutaka Nakajima
IPC分类号： H01L21/68 , H01L23/00 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L21/6836 , H01L23/3107 , H01L23/3114 , H01L23/3164 , H01L23/4951 , H01L23/49572 , H01L23/49833 , H01L23/4985 , H01L23/562 , H01L24/27 , H01L2221/68327 , H01L2224/05567 , H01L2224/05571 , H01L2224/05572 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16 , H01L2224/16245 , H01L2224/274 , H01L2924/00013 , H01L2924/01029 , H01L2924/01079 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： A semiconductor device comprising a semiconductor chip having an electrode on a circuit formation surface thereof, a flexible film having a lead attached thereto and electrically connected to said electrode of said semiconductor chip through a bump, a resin for covering said circuit formation surface of said semiconductor chip and a resin film for covering a back surface facing said circuit formation surface of said semiconductor chip.
摘要翻译：一种半导体器件，包括在其电路形成表面上具有电极的半导体芯片，具有附接到其上的引线并通过凸块与所述半导体芯片的所述电极电连接的柔性膜，用于覆盖所述半导体的所述电路形成表面的树脂芯片和用于覆盖面对所述半导体芯片的所述电路形成表面的背面的树脂膜。

27. 发明授权

US06853089B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06853089B2
公开(公告)日：2005-02-08
申请号：US10225163
申请日：2002-08-22
申请人： Mikako Ujiie , Michiaki Sugiyama , Kazunari Suzuki , Masachika Masuda , Tamaki Wada
发明人： Mikako Ujiie , Michiaki Sugiyama , Kazunari Suzuki , Masachika Masuda , Tamaki Wada
IPC分类号： H01L23/12 , H01L21/56 , H01L21/58 , H01L21/60 , H01L23/28 , H01L23/498 , H01L23/48 , H01L21/44
CPC分类号： H01L21/561 , H01L21/56 , H01L23/49838 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2221/68331 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/26175 , H01L2224/27013 , H01L2224/29011 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/83051 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/8385 , H01L2224/85399 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/10161 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused by flowing-out of the adhesive is to be prevented. The semiconductor device according to the present invention comprises a wiring substrate, the wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film, a semiconductor chip fixed through an adhesive onto the insulating film formed on the main surface of the wiring substrate, conductive wires for connecting the electrodes on the main surface of the wiring substrate and electrodes on the semiconductor chip with each other, and a seal member, i.e., a package, which covers the semiconductor chip, the main surface of the wiring substrate and the electrodes, wherein a groove is formed between the semiconductor chip and the electrodes and the seal member and the wiring substrate have side faces cut by dicing. A protruding portion of the adhesive (an insulating resin) stays within the groove without getting over the groove and does not reach the electrodes. The groove is formed by removing the insulating film partially in the full depth direction of the film so as to extend through the film.
摘要翻译：在半导体器件的制造中，通过采用通过粘合剂将半导体芯片固定在布线基板上的嵌段成型方法，可以防止由粘合剂流出而引起的缺陷的发生。根据本发明的半导体器件包括布线基板，具有主表面的布线基板，形成在主表面上的绝缘膜，以及形成在主表面上以从绝缘膜露出的电极，半导体芯片通过粘合剂固定在形成在布线基板的主表面上的绝缘膜上，用于将布线基板的主表面上的电极和半导体芯片上的电极彼此连接的导线，以及密封件封装，其覆盖半导体芯片，布线基板的主表面和电极，其中在半导体芯片和电极之间形成凹槽，并且密封构件和布线基板具有通过切割切割的侧面。粘合剂（绝缘树脂）的突出部分保持在槽内而不越过槽并且不会到达电极。通过在膜的整个深度方向上部分地去除绝缘膜以便延伸穿过膜而形成凹槽。

28. 发明授权

US06558980B2 Plastic molded type semiconductor device and fabrication process thereof 有权
公开(公告)号：US06558980B2
公开(公告)日：2003-05-06
申请号：US09832008
申请日：2001-04-11
申请人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Takafumi Nishita , Fujio Ito , Kunihiro Tsubosaki , Akihiko Kameoka , Kunihiko Nishi
发明人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Takafumi Nishita , Fujio Ito , Kunihiro Tsubosaki , Akihiko Kameoka , Kunihiko Nishi
IPC分类号： H01L2144
CPC分类号： H01L24/32 , H01L21/565 , H01L23/3107 , H01L23/49503 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/06179 , H01L2224/29007 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48799 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/85447 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/00012
摘要： A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pad are sealed with a plastic mold. The semiconductor chip and the die pad are disposed within a cavity of a mold so that the clearance from the reverse surface of the die pad to the inside wall surface of the cavity opposite to the reverse surface of the die pad becomes narrower, by a length corresponding to the thickness of the die pad, than the clearance from the principal surface of the semiconductor chip to the inside wall surface of the cavity opposite to the principal surface of the semiconductor chip; and a resin is poured from a center gate into said cavity to form a plastic mold, which makes it possible to prevent said semiconductor chip from being lifted upwardly by the resin flowing in a filling region on the reverse surface side of the semiconductor chip. As a result, inconvenient shifting of the semiconductor chip, bonding wires and the like in the plastic mold can be prevented, leading to an increase in the yield of the plastic molded type semiconductor device.

29. 发明授权

US06445076B1 Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same 失效
标题翻译：电子部件绝缘胶，引线框和使用其的半导体器件
公开(公告)号：US06445076B1
公开(公告)日：2002-09-03
申请号：US09700491
申请日：2000-11-16
申请人： Takehiro Shimizu , Takafumi Dohdoh , Kazumi Tameshige , Hidekazu Matsuura , Yoshihiro Nomura , Kunihiro Tsubosaki , Toshihiro Shiotsuki , Kazunari Suzuki , Tomoko Higashino
发明人： Takehiro Shimizu , Takafumi Dohdoh , Kazumi Tameshige , Hidekazu Matsuura , Yoshihiro Nomura , Kunihiro Tsubosaki , Toshihiro Shiotsuki , Kazunari Suzuki , Tomoko Higashino
IPC分类号： H01L2348
CPC分类号： C09J179/08 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/01012 , H01L2924/0102 , H01L2924/01077 , H01L2924/01079 , H01L2924/07802 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An insulating adhesive for electronic parts, which is to be used for bonding a semiconductor chip to a lead frame and comprises a resin and a solvent, the resin having (A) a weight average molecular weight (Mw) of 30,000 to 300,000 based on conversion into polystyrene and (B) a ratio of weight average molecular weight (Mw)/number average molecular weight (Mn) of 5 or less, and (C) the insulating adhesive for electronic parts having a viscosity of 5,000 to 100,000 mPa.s at a rotation number of 10 rpm and a viscosity ratio (&eegr;1 rpm/&eegr;10 rpm) of 1.0 to 6.0 as measured at 25° C. with an E-type viscometer.
摘要翻译：一种用于电子部件的绝缘粘合剂，其用于将半导体芯片接合到引线框架并且包括树脂和溶剂，所述树脂具有（A）基于转化率的30,000至300,000的重均分子量（Mw）（B）重均分子量（Mw）/数均分子量（Mn）的比值为5以下，（C）粘度为5000〜100,000mPa.s的电子部件用绝缘性粘接剂，旋转数为10rpm，粘度比（eta1rpm / eta10rpm）为1.0〜6.0，用E型粘度计测定。

30. 发明授权

US06396142B1 Semiconductor device 失效
公开(公告)号：US06396142B1
公开(公告)日：2002-05-28
申请号：US09369402
申请日：1999-08-06
申请人： Fujio Ito , Hiroaki Tanaka , Hiromichi Suzuki , Tokuji Toida , Takafumi Konno , Kunihiro Tsubosaki , Shigeki Tanaka , Kazunari Suzuki , Akihiko Kameoka
发明人： Fujio Ito , Hiroaki Tanaka , Hiromichi Suzuki , Tokuji Toida , Takafumi Konno , Kunihiro Tsubosaki , Shigeki Tanaka , Kazunari Suzuki , Akihiko Kameoka
IPC分类号： H01L2348
CPC分类号： H01L24/32 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/29007 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/85385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2924/3512 , H01L2224/85399 , H01L2224/05599
摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

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