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21. 发明授权

US07049680B2 Semiconductor integrated circuit device and process for manufacturing the same 有权
公开(公告)号：US07049680B2
公开(公告)日：2006-05-23
申请号：US10971073
申请日：2004-10-25
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： H01L29/00
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element.Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer.Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

22. 发明授权

US07023071B2 Semiconductor integrated circuit device and process for manufacturing the same 失效
公开(公告)号：US07023071B2
公开(公告)日：2006-04-04
申请号：US10866874
申请日：2004-06-15
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： H01L29/00 , H01L21/8234
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element.Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer.Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

23. 发明申请

US20050082622A1 Semiconductor integrated circuit device and process for manufacturing the same 有权
公开(公告)号：US20050082622A1
公开(公告)日：2005-04-21
申请号：US10971073
申请日：2004-10-25
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： G11C11/412 , H01L21/768 , H01L21/8244 , H01L27/11 , H01L21/84 , H01L29/94
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

24. 发明申请

US20110076820A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME 有权
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US20110076820A1
公开(公告)日：2011-03-31
申请号：US12895357
申请日：2010-09-30
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： H01L21/8234
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.
摘要翻译：一种完整的CMOS型SRAM，其存储单元由六个MISFET组成，其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成，该难熔金属硅化物层形成在构成个体的第一导电层上存储单元的驱动MISFET，转移MISFET和负载MISFET的栅极电极，其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。此外，通过在第一导电层上叠加局部布线，在局部布线和第一导电层之间形成电容元件。此外，通过使用诸如硅化的电阻降低装置来形成局部布线。此外，公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。

25. 发明授权

US07910427B1 Semiconductor integrated circuit device and process for manufacturing the same 有权
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US07910427B1
公开(公告)日：2011-03-22
申请号：US12895357
申请日：2010-09-30
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： H01L21/8234 , H01L29/00
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.
摘要翻译：一种完整的CMOS型SRAM，其存储单元由六个MISFET组成，其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成，该难熔金属硅化物层形成在构成个体的第一导电层上存储单元的驱动MISFET，转移MISFET和负载MISFET的栅极电极，其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。此外，通过在第一导电层上叠加局部布线，在局部布线和第一导电层之间形成电容元件。此外，通过使用诸如硅化的电阻降低装置形成局部布线。此外，公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。

26. 发明授权

US07456486B2 Semiconductor integrated circuit device and process for manufacturing the same 失效
公开(公告)号：US07456486B2
公开(公告)日：2008-11-25
申请号：US11826491
申请日：2007-07-16
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： H01L29/00 , H01L21/8234
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

27. 发明授权

US06809399B2 Semiconductor integrated circuit device and process for manufacturing the same 失效
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US06809399B2
公开(公告)日：2004-10-26
申请号：US10304045
申请日：2002-11-26
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： H01L218234
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.
摘要翻译：一种完整的CMOS型SRAM，其存储单元由六个MISFET组成，其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成，该难熔金属硅化物层形成在构成个体的第一导电层上存储器单元的驱动MISFET，传输MISFET和负载MISFET的栅电极，其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。此外，通过在第一导电层上叠置局部布线，在局部布线和第一导电层之间形成电容元件。此外，通过使用诸如硅化的电阻降低装置形成局部布线。此外，公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。

28. 发明授权

US06548885B2 Semiconductor integrated circuit device and process for manufacturing the same 有权
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US06548885B2
公开(公告)日：2003-04-15
申请号：US09755184
申请日：2001-01-08
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： H01L2900
CPC分类号： H01L27/11 , G11C11/412 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.
摘要翻译：一种完整的CMOS型SRAM，其存储单元由六个MISFET组成，其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成，该难熔金属硅化物层形成在构成个体的第一导电层上存储单元的驱动MISFET，转移MISFET和负载MISFET的栅极电极，其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。此外，通过在第一导电层上叠加局部布线，在局部布线和第一导电层之间形成电容元件。此外，通过使用诸如硅化的电阻降低装置来形成局部布线。此外，公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。

29. 发明授权

US5946565A Semiconductor integrated circuit device and process for manufacturing the same 失效
公开(公告)号：US5946565A
公开(公告)日：1999-08-31
申请号：US880736
申请日：1997-06-23
申请人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
发明人： Shuji Ikeda , Toshiaki Yamanaka , Kenichi Kikushima , Shinichiro Mitani , Kazushige Sato , Akira Fukami , Masaya Iida , Akihiro Shimizu
IPC分类号： G11C11/412 , H01L21/768 , H01L21/8244 , H01L27/11 , H01L21/8234
CPC分类号： H01L27/11 , G11C11/4125 , H01L21/76895 , H01L27/0203 , H01L27/0207 , H01L27/1104 , G11C11/412 , Y10S257/904
摘要： A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

30. 发明授权

US08774687B2 Belt driving apparatus and image forming apparatus 有权
标题翻译：皮带驱动装置和图像形成装置
公开(公告)号：US08774687B2
公开(公告)日：2014-07-08
申请号：US13599184
申请日：2012-08-30
申请人： Akihiro Shimizu , Keitaro Taoka
发明人： Akihiro Shimizu , Keitaro Taoka
IPC分类号： G03G15/01 , G03G15/00 , G03G15/16
CPC分类号： G03G15/1615 , G03G15/755 , G03G2215/00151 , G03G2215/0016
摘要： A belt driving apparatus includes: an endless belt having a stepped region at its edge; a driving member for driving the endless belt; a moving member for moving the endless belt in a widthwise direction; a mark provided at a part of the endless belt with respect to a circumferential direction and located at a position corresponding to the stepped region of the endless belt with respect to a rotational direction; a mark detecting member for detecting the mark during rotation of the endless belt; an edge position detecting member for detecting a widthwise position of at least one of edges of the endless belt during rotation; and a controller for controlling, after the mark detecting member detects the mark, the moving member on the basis of a detection result of the edge other than the stepped region of the endless belt.
摘要翻译：带驱动装置包括：环形带，其边缘具有台阶区域; 用于驱动环形带的驱动构件; 移动构件，用于沿宽度方向移动所述环形带; 相对于圆周方向设置在环形带的一部分处的标记，并且位于相对于环形带的相对于旋转方向的阶梯状区域的位置; 标记检测构件，用于在环形带旋转期间检测标记; 边缘位置检测构件，用于在旋转期间检测环形带的至少一个边缘的宽度方向位置; 以及控制器，用于根据环形带的阶梯区域以外的边缘的检测结果，在标记检测部件检测到标记之后，控制移动部件。

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