会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 26. 发明授权
    • Integrated MEMS packaging
    • 集成MEMS封装
    • US07217588B2
    • 2007-05-15
    • US11178148
    • 2005-07-08
    • John W. HartzellHarry Garth WaltonMichael James Brownlow
    • John W. HartzellHarry Garth WaltonMichael James Brownlow
    • H01L21/00
    • B81C1/0023H01L27/1214
    • An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.
    • 提供集成MEMS封装和相关封装方法。 该方法包括:形成电连接到第一基板的电路; 将MEMS器件集成在电连接到第一衬底的第一衬底区域上; 提供覆盖所述第一基板的第二基板; 以及沿所述第一区域边界在所述第一和第二基板之间形成壁。 在一个方面,使用薄膜工艺形成电路; 并且其中将MEMS器件集成在第一衬底区域上包括使用薄膜工艺形成MEMS,同时形成电子器件。 或者,MEMS器件以独立的工艺形成,附接到第一衬底,并且使用薄膜工艺将电互连形成到第一衬底。